Temporal thermal imaging method for detecting subsurface objects and voids

• US 8,787,619 B2
• Filed: 07/16/2013
• Issued: 07/22/2014
• Est. Priority Date: 02/09/2010
• Status: Active Grant

• Current Assignee: Nancy Kerr Del Grande
• Original Assignee: Nancy Kerr Del Grande
• Inventors: Del Grande, Nancy Kerr
• Primary Examiner(s): Cunningham, Gregory F
• Application Number:
  US13/943,154
• Publication Number:
  US 20130322693A1
• Time in Patent Office: 371 Days
• Field of Search: 250/253, 250/338.1, 250/339.04, 250/339.06, 250/339.1, 250/339.14, 250/341.1, 250/341.6, 250/341.8, 250/342, 356/369, 374/137, 382/100, 382/103, 382/109, 382/312
• US Class Current: 382/103
• CPC Class Codes: G01K 11/00 Measuring temperature based upon physical or chemical changes not covered by groups G01K3/00, G01K5/00, G01K7/00 or G01K9/00
• CPC Class Codes: G06V 20/13 Satellite images

Abstract

A temporal thermal survey method to locate at a given area whether or not there is a subsurface object or void site. The method uses thermal inertia change detection. It locates temporal heat flows from naturally heated subsurface objects or faulty structures such as corrosion damage. The added value over earlier methods is the use of empirical methods to specify the optimum times for locating subsurface objects or voids amidst clutter and undisturbed host materials. Thermal inertia, or thermal effusivity, is the bulk material resistance to temperature change. Surface temperature highs and lows are shifted in time at the subsurface object or void site relative to the undisturbed host material sites. The Dual-band Infra-Red Effusivity Computed Tomography (DIRECT) method verifies the optimum two times to detect thermal inertia outliers at the subsurface object or void border with undisturbed host materials.

Claims

1. A temporal thermal method for detecting thermal inertia differences comprising:

using an empirical method to determine a first imaging time and a second imaging time;

creating a first temperature map from data obtained by imaging at least one IR wavelength band at the first imaging time at a first location and a second location;

creating a second temperature map from data obtained by imaging at least one IR wavelength band at the second imaging time at the first location and the second location; and

using a computer to determine the existence of a thermal inertia difference between the first location and the second location using the first and second temperature maps, wherein the first imaging time occurs before the first location reaches its daily low thermal response or annual low thermal response, and wherein the second imaging time occurs before the first location reaches its daily high thermal response or annual high thermal response;

wherein the temperature difference between the first location and the second location is greater than a surface emissivity noise of the first and second locations, whereby the first imaging time and the second imaging time occur when the thermal response between the first and second locations is sufficient to detect an artifact at one of the locations.

2. The method of claim 1, wherein the at least one IR wavelength band comprises an IR band having a wavelength of from 3-5 microns and an IR band having a wavelength of from 8-12 microns.

3. The method of claim 1, wherein the first location comprises a host site.

4. The method of claim 3, wherein the second location comprises an artifact site.

5. The method of claim 1, wherein the thermal response is greater than 0.5°

C.

6. The method of claim 4, wherein the empirical method includes maintaining a data base of temporal thermal responses for a surrogate host site and a surrogate artifact site for different weather conditions.

7. The method of claim 6, wherein the temporal thermal responses identify the first and second imaging times for different weather conditions.

8. The method of claim 7, wherein the second imaging time corresponds to when the host site thermal response is below its daily high or annual high temperature.

9. The method of claim 8, wherein the first imaging time corresponds to when the host site thermal response is above its daily low or annual low temperature.

10. The method of claim 1, wherein the second location comprises a host material disturbed site including an artifact and the first location comprises a host material undisturbed site, wherein the host material disturbed site has less or greater thermal inertia than the thermal inertia of the host undisturbed material site.

11. The method of claim 10, wherein the artifact comprises a subsurface located object or a surface located object.

12. A temporal thermal method for detecting an artifact comprising:

creating a first temperature map from data obtained by imaging at least one IR wavelength band at a first imaging time at a first location and a second location, the first location comprising a host site and the second location comprising an artifact site, wherein the first imaging time is based upon the temporal thermal response of one of a surrogate host site or a surrogate artifact site;

creating a second temperature map from data obtained by imaging at least one IR wavelength band at a second imaging time at the first location and the second location, wherein the second imaging time is based upon the temporal thermal response of one of the surrogate host site or the surrogate artifact site; and

using a computer to determine the existence of an artifact using the first and second temperature maps,

wherein the first imaging time occurs before the host site reaches its first daily low thermal response or annual low thermal response, and wherein the second imaging time occurs before the host site reaches its first daily high thermal response or annual high thermal response;

wherein the temperature difference between the first location and the second location is greater than a surface emissivity noise of the first and second locations, whereby the first imaging time and the second imaging time occur when the thermal response between the first and second location is sufficient to detect an artifact.

13. The method of claim 12, wherein the at least one IR wavelength band comprises an IR band having a wavelength of from 3-5 microns and an IR band having a wavelength of from 8-12 microns.

14. The method of claim 12, wherein the thermal response is greater than 0.5°

C.

15. The method of claim 12, further including maintaining a data base of temporal thermal responses for a surrogate host site and a surrogate artifact site for different weather conditions.

16. The method of claim 15, wherein the temporal thermal responses identify the first and second imaging times for different weather conditions.

17. A temporal thermal method for detecting an artifact from thermal inertia differences between a host site and an artifact site, the method comprising:

establishing a data base of temporal thermal responses for a surrogate host site and a surrogate artifact site under different weather conditions;

creating a first temperature map from data obtained by imaging at least one IR wavelength band at a first imaging time at a host site and at an artifact site, the first imaging time corresponding to when the surrogate host site thermal response occurs before its daily low or annual low temperature obtained from the data base;

creating a second temperature map from data obtained by imaging at least one IR wavelength band at a second imaging time at the host site and at the artifact site, the second imaging time corresponding to when the surrogate host site thermal response occurs before its daily high or annual high temperature;

using a computer to determine thermal response differences between the host site and artifact site using the first and second temperature maps to detect an artifact at the artifact site;

wherein the temperature difference between the host site and the artifact site is greater than a surface emissivity noise of the host site and the artifact site, whereby the first imaging time and the second imaging time occur when the thermal response between the host site and the artifact site is sufficient to detect an artifact at one of the locations.

18. The method of claim 17, wherein the thermal response difference is greater than 0.5°

C.

19. The method of claim 17, wherein the artifact comprises a subsurface object or void.

20. The method of claim 17, wherein the artifact comprises a structural flaw.

21. The method of claim 17, wherein the at least one IR wavelength band comprises an IR band having a wavelength of from 3-5 microns and an IR band having a wavelength of from 8-12 microns.

22. A temporal thermal method for detecting an artifact from thermal inertia differences between a host site and an artifact site, the method comprising:

storing temporal thermal responses in a data base for a host site and an artifact site;

obtaining data from imaging at least one IR wavelength band at the host site and artifact site corresponding to when the host site thermal response occurs before its daily low or annual low temperature obtained from the data base;

obtaining data from imaging at least one IR wavelength band at the host site and artifact site corresponding to when the host site thermal response occurs before its daily high or annual high temperature obtained from the data base; and

using a computer to determine thermal response differences between the host site and artifact site using the obtained data to detect an artifact at the artifact site;

wherein the temperature difference between the host site and the artifact site is greater than a surface emissivity noise of the host site and the artifact site, whereby the first imaging time and the second imaging time occur when the thermal response between the host site and the artifact site is sufficient to detect an artifact at one of the locations.

23. The method of claim 22, wherein the artifact comprises a structural flaw, a subsurface object or void.

24. The method of claim 23, wherein the at least one IR wavelength band comprises an IR band having a wavelength of from 3-5 microns and an IR band having a wavelength of from 8-12 microns.

25. The method of claim 22, wherein the data base includes temporal thermal responses for the host site and the artifact site for different weather conditions.

26. The method of claim 22, wherein the thermal response difference is greater than 0.5°

C.