Leads with high surface resistance

• US 8,788,058 B2
• Filed: 09/16/2013
• Issued: 07/22/2014
• Est. Priority Date: 12/06/2007
• Status: Expired due to Fees

• Current Assignee: Cardiac Pacemakers Incorporated (Boston Scientific Corporation)
• Original Assignee: Cardiac Pacemakers Incorporated (Boston Scientific Corporation)
• Inventors: Li, Yingbo, Ameri, Masoud
• Primary Examiner(s): Layno, Carl H
• Assistant Examiner(s): Morales, Jon Eric C
• Application Number:
  US14/027,678
• Publication Number:
  US 20140018896A1
• Time in Patent Office: 309 Days
• Field of Search: 607/2, 607/63, 607115-116
• US Class Current: 607/63
• CPC Class Codes: A61N 1/05 for implantation or insertion into the body, e.g. heart electrode A61N1/06 takes precedence
• CPC Class Codes: A61N 1/056 Transvascular endocardial electrode systems
• CPC Class Codes: A61N 1/086 Magnetic resonance imaging [MRI] compatible leads
• CPC Class Codes: A61N 1/3718 Monitoring of or protection against external electromagnetic fields or currents

Abstract

Implantable medical leads having resistance characteristics adapted to dissipate radio frequency (RF) electromagnetic energy during medical procedures such as magnetic resonance imaging (MRI) are disclosed. An illustrative medical device includes a lead having an inner electrical conductor operatively coupled to an electrode and a pulse generator, and one or more outer resistive shields that radially surround the inner conductor and dissipate RF energy into the surrounding body tissue along the length of the lead.

Claims

1. An implantable medical lead for use in a magnetic resonance imaging (MRI) environment, the lead comprising:

a lead having a proximal portion, a distal portion having an electrode, and a conductor wire;

the conductor wire having a center portion and an outer portion, the conductor wire having a resistivity that increases across a width of the conductor wire such that the resistivity of the conductor wire is greater at the outer portion than at the center portion; and

wherein the increasing resistivity across the width of the conductor wire is configured to dissipate RF electromagnetic energy received along the lead and inhibit alternating current from being transmitted to the electrode.

2. The lead of claim 1, wherein the resistivity increases at a plurality of finite locations across the width of the conductor wire.

3. The lead of claim 1, wherein the conductor wire comprises a plurality of conductive layers.

4. The lead of claim 3, wherein the conductive layers successively increase in resistivity across the width of the conductor wire.

5. The lead of claim 3, wherein the plurality of conductive layers comprises a first outer conductor layer with a first resistivity, a second outer conductor layer with a second resistivity greater than the first resistivity, and a third outer conductor layer with third resistivity greater than the first and second resistivities.

6. The lead of claim 1, wherein the outer portion comprises a plurality of outer resistive shields that successively increase in resistivity.

7. The lead of claim 1, wherein the conductor wire is the only conductor wire that extends along the length of the lead.

8. The lead of claim 1, wherein the conductor wire continuously increases in resistivity from the center portion to the outer portion of the conductor wire.

9. The lead of claim 1, wherein an outer surface of the conductor wire defines an outer surface of the lead.

10. The lead of claim 1, wherein the resistivity increases gradually across the width of the conductor wire.

11. An implantable medical lead for use in a magnetic resonance imaging (MRI) environment, the lead comprising:

a lead having a proximal portion, a distal portion having an electrode, and a conductor wire that extends from the proximal portion to the distal portion and electrically connects with the electrode;

the conductor wire having a center portion and an outer portion, the conductor wire having a resistivity that changes across a width of the conductor wire such that the resistivity of the conductor wire is different between the outer portion and the center portion; and

wherein the changing resistivity across the width of the conductor wire is configured to dissipate RF electromagnetic energy received along the lead and inhibit alternating current from being transmitted to the electrode.

12. The lead of claim 11, wherein the conductor wire comprises a plurality of conductive layers.

13. The lead of claim 12, wherein the conductive layers successively change in resistivity across the width of the conductor wire.

14. The lead of claim 12, wherein the plurality of conductive layers comprises a first outer conductor layer with a first resistivity, a second outer conductor layer with a second resistivity different than the first resistivity, and a third outer conductor layer with third resistivity different than the first and second resistivities.

15. The lead of claim 11, wherein the outer portion comprises a plurality of outer resistive shields that successively change in resistivity.

16. The lead of claim 11, wherein the conductor wire is the only conductor wire that extends along the length of the lead.

17. The lead of claim 11, wherein the conductor wire continuously changes in resistivity from the center portion to the outer portion of the conductor wire.

18. The lead of claim 11, wherein an outer surface of the conductor wire defines an outer surface of the lead.

19. The lead of claim 11, wherein the resistivity changes gradually across the width of the conductor wire.

20. The lead of claim 11, wherein the resistivity changes at a plurality of finite locations across the width of the conductor wire.