Method of making a compliant printed circuit peripheral lead semiconductor test socket

• US 8,789,272 B2
• Filed: 05/27/2010
• Issued: 07/29/2014
• Est. Priority Date: 06/02/2009
• Status: Active Grant

• Current Assignee: LCP Medical Technologies Incorporated
• Original Assignee: HSIO Technologies LLC
• Inventors: Rathburn, James
• Primary Examiner(s): Nguyen, Donghai D
• Application Number:
  US13/318,171
• Publication Number:
  US 20120049877A1
• Time in Patent Office: 1,524 Days
• Field of Search: 29830-832, 298/34, 298/46, 298/52, 174/255, 174/262, 438/15, 439/66
• US Class Current: 29/846
• CPC Class Codes: G01R 1/0466 concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
• CPC Class Codes: G01R 1/0483 Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips for IC's with connecting points around the edges only G01R1/0433
• CPC Class Codes: H05K 7/1061 co-operating by abutting
• CPC Class Codes: Y10T 29/49126 Assembling bases
• CPC Class Codes: Y10T 29/49128 Assembling formed circuit to base
• CPC Class Codes: Y10T 29/49147 Assembling terminal to base
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base

Abstract

A test socket that provides a temporary interconnect between terminals on an integrated circuit (IC) device and contact pads on a test printed circuit board (PCB). The test socket includes a compliant printed circuit and a socket housing. The compliant printed circuit includes at least one compliant layer, a plurality of first contact members located along a first major surface, a plurality of second contact members located along a second major surface, and a plurality of conductive traces electrically coupling the first and second contact members. The compliant layer is positioned to bias the first contact members against the terminals on the IC device and the second contact members against contact pads on the test PCB. The socket housing is coupled to the compliant printed circuit so the first contact members are positioned in a recess of the socket housing sized to receive the IC device.

Claims

1. A method of making a test socket comprising the steps of:

forming a compliant printed circuit comprising the steps of;

printing a first base layer of a dielectric material onto a surface of a fixture;

plating a conductive material into a plurality of cavities in the fixture;

processing the conductive material to form a plurality of first contact members positioned along a first major surface of the compliant printed circuit;

printing a compliant layer on the first base layer;

forming a plurality of conductive traces on an exposed surface of the compliant layer and electrically coupling the plurality of the conductive traces with a one or more of the plurality of first contact members;

printing a plurality of second contact members positioned along a second major surface of the compliant printed circuit and electrically coupling one or more of the second contact members to the conduct traces;

removing the compliant printed circuit from the fixture; and

positioning the compliant printed circuit in a socket housing so the first contact members are located in a recess of the socket housing, so that the compliant layer biases the first contact members into the recess.

2. The method of claim 1, wherein forming the conductive traces comprises depositing a plating onto an exposed surface.

3. The method of claim 1, wherein the conductive traces comprise substantially rectangular cross-sectional shapes.

4. The method of claim 1, further comprising plating a conductive material, printing a non-conductive material, and plating a semi-conductive material on a single layer of the compliant printed circuit.

5. The method of claim 1, wherein forming the plurality of conductive traces comprises:

positioning pre-formed conductive trace materials in recesses of in the compliant layer; and

plating the recesses of the base layer to form conductive traces with substantially rectangular cross-sectional shapes.

6. The method of claim 1, wherein forming the plurality of conductive traces comprises:

pressing a conductive foil into at least a portion of recesses in the compliant layer;

shearing the conductive foil along edges of the recesses;

removing excess conductive foil not located in the recesses; and

plating the recesses to form conductive traces with substantially rectangular cross-sectional shapes.

7. The method of claim 1, further comprising the steps of:

plating a conductive material into a plurality of the cavities in the compliant layer; and

processing the conductive material to form the plurality of second contact members positioned along the second major surface of the compliant printed circuit.

8. The method of claim 1, wherein the step of forming a plurality of second contact members comprises the steps of:

printing a second base layer of a dielectric material onto a surface of a fixture;

plating a conductive material into a plurality of the cavities in the fixture;

processing the conductive material to form a plurality of second contact members; and

coupling the second contact members with the conductive traces on the compliant printed circuit so the second contact members extend along the second major surface of the compliant printed circuit.

9. The method of claim 1, further comprising the step of forming at least one additional circuitry plane in the compliant printed circuit.

10. The method of claim 1, further comprising electrically coupling a flexible circuit member to the compliant printed circuit and extending the flexible circuit member beyond a perimeter edge of the socket housing.

11. The method of claim 1, further comprising the steps of:

printing at least one electrical device on the compliant printed circuit; and

electrically coupling the printed electrical device to at least one contact member.

12. A method of claim 1 comprising the steps of:

positioning an integrated circuit (IC) device in the recess of the socket housing such that terminals on the IC device electrically couple with the plurality of first contact members, the compliant layer biasing the first contact members against the terminals on the IC device; and

electrically coupling the plurality of second contact members with pads on a test printed circuit board (PCB), the compliant layer biasing the plurality of second contact members against the contact pads.

13. The method of claim 12, further comprising at least one electrical device printed on the compliant printed circuit monitoring performance of the IC device during a testing protocol.

14. The method of claim 12, further comprising modifying the IC device in response to results from the testing protocol.

15. The method of claim 12, further comprising monitoring performance of the IC device during a testing protocol.

16. The method of claim 15, wherein the test PCB comprises a plurality of testing protocols, the method comprising applying a second test protocol in response to performance of the IC device during a first test protocol.

17. The method of claim 15, further comprising applying a second test protocol in response to a signal from the electrical device printed on the compliant printed circuit.