Die press process for manufacturing a Z-directed component for a printed circuit board
First Claim
1. A method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board, comprising:
- punching a plurality of segments out of at least one sheet of substrate material, the plurality of punched-out segments form a plurality of layers of the Z-directed component;
forming a channel through the substrate material, at least one of the formed layers including at least a portion of the channel;
applying a conductive material to at least one surface of at least one of the formed layers; and
combining a stack of the formed layers to form the Z-directed component.
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Accused Products
Abstract
A method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board according to one example embodiment includes punching a plurality of segments out of at least one sheet of substrate material to form a plurality of layers of the Z-directed component. A channel is formed through the substrate material either before or after the segments are punched. At least one of the formed layers includes at least a portion of the channel. A conductive material is applied to at least one surface of at least one of the formed layers. A stack of the formed layers is combined to form the Z-directed component.
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Citations
23 Claims
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1. A method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board, comprising:
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punching a plurality of segments out of at least one sheet of substrate material, the plurality of punched-out segments form a plurality of layers of the Z-directed component; forming a channel through the substrate material, at least one of the formed layers including at least a portion of the channel; applying a conductive material to at least one surface of at least one of the formed layers; and combining a stack of the formed layers to form the Z-directed component. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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20. A method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board, comprising:
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punching a segment out of a sheet of substrate material, the punched-out segment forms a layer of the Z-directed component; forming a channel through the substrate material, the formed layer including at least a portion of the channel; applying a conductive material to at least one surface of the formed layer; punching additional segments out of at least one of the same sheet and a different sheet of substrate material, the additional punched-out segments form additional layers of the Z-directed component; and stacking and combining the formed layers to form the Z-directed component. - View Dependent Claims (21, 22)
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23. A method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board, comprising:
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forming a channel through a first sheet of substrate material; applying a conductive material to a predetermined portion of the first sheet; stacking the first sheet with additional sheets of substrate material; punching segments out of the stacked sheets, the punched-out segments form a plurality of stacked layers of the Z-directed component, the punched-out segment from the first sheet including at least a portion of the channel and the conductive material on a surface thereof; and combining the stacked layers to form the Z-directed component.
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Specification