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Die press process for manufacturing a Z-directed component for a printed circuit board

  • US 8,790,520 B2
  • Filed: 08/31/2011
  • Issued: 07/29/2014
  • Est. Priority Date: 08/31/2011
  • Status: Active Grant
First Claim
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1. A method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board, comprising:

  • punching a plurality of segments out of at least one sheet of substrate material, the plurality of punched-out segments form a plurality of layers of the Z-directed component;

    forming a channel through the substrate material, at least one of the formed layers including at least a portion of the channel;

    applying a conductive material to at least one surface of at least one of the formed layers; and

    combining a stack of the formed layers to form the Z-directed component.

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