Multi-chip light emitting diode modules
First Claim
1. A multi-chip module device, comprising:
- a substantially thermally dissipative substrate;
a plurality of light emitting devices;
an electrically conductive layer applied to a surface of said substrate, wherein said conductive layer comprises a plurality of chip carrier parts each having a surface for carrying at least one of said light emitting devices;
a reflective coating at least partially between and at least partially surrounding two or more of said light emitting devices and at least partially covering said conductive layer; and
an isolating layer disposed between said reflective coating and said conductive layer, said isolating layer at least partially surrounding two or more of said light emitting devices.
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Accused Products
Abstract
A multi-chip lighting module is disclosed for maximizing luminous flux output and thermal management. In one embodiment, a multi-chip module device comprises a substantially thermally dissipative substrate with a dark insulating layer deposited on a surface of the substrate. A plurality of light emitting devices is also provided. An electrically conductive layer is applied to a surface of the substrate, with the conductive layer comprising a plurality of chip carrier parts each having a surface for carrying at least one of the light emitting devices. Each light emitting device has a first and a second electrical terminal. A reflective layer is also provided that at least partially covers the conductive layer.
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Citations
24 Claims
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1. A multi-chip module device, comprising:
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a substantially thermally dissipative substrate; a plurality of light emitting devices; an electrically conductive layer applied to a surface of said substrate, wherein said conductive layer comprises a plurality of chip carrier parts each having a surface for carrying at least one of said light emitting devices; a reflective coating at least partially between and at least partially surrounding two or more of said light emitting devices and at least partially covering said conductive layer; and an isolating layer disposed between said reflective coating and said conductive layer, said isolating layer at least partially surrounding two or more of said light emitting devices. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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19. A single lead frame structure for a multi-chip module, the lead frame comprising:
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a plurality of electrically conductive light emitting device chip carrier parts, with each of said carrier parts having a surface carrying at least one light emitting device, each light emitting device having a first electrical terminal and a second electrical terminal, the first terminal of each of said light emitting devices being electrically coupled to said chip carrying surface of said chip carrier part; a plurality of electrically conductive connection parts separate from said chip carrier parts, each of said connection parts having at least one connection pad; the second terminal of each of said light emitting devices being electrically coupled to at least one of said connection pads of a corresponding one of said chip carrier parts or one of said connection parts; a reflective coating at least partially between and at least partially surrounding two or more of said light emitting devices and at least partially covering said carrier parts; and an isolating layer disposed between said reflective layer and said carrier parts, said isolating layer at least partially between and at least partially surrounding two or more of said light emitting devices.
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20. A method for producing a multi-chip lighting module device, said method comprising:
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providing a thermally dissipative substrate; depositing an insulating layer on substantially all of the top surface of said substrate; applying an electrically conductive layer at least partially covering a surface of said insulating layer, said conductive layer carrying a plurality of light emitting devices; electrically coupling said light emitting devices with portions of said electrically conductive layer; depositing an isolating layer at least partially covering said conductive layer, said isolating layer at least partially surrounding two or more of said light emitting devices and depositing a reflective coating at least partially over said isolating layer, said reflective coating at least partially between and at least partially surrounding two or more of said light emitting devices and at least partially covering said conductive layer.
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21. A multi-chip module device, comprising:
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a substantially thermally dissipative substrate; a plurality of light emitting devices; an electrically conductive layer applied to a surface of said substrate, wherein said conductive layer comprises a plurality of chip carrier parts each having a surface for carrying at least one of said light emitting devices; a reflective coating at least partially between and at least partially surrounding two or more of said light emitting devices and at least partially covering said conductive layer; and a protective coating at least partially between and at least partially surrounding two or more of said light emitting devices and at least partially covering said conductive layer. - View Dependent Claims (22, 23, 24)
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Specification