×

Multi-chip light emitting diode modules

  • US 8,791,471 B2
  • Filed: 11/07/2008
  • Issued: 07/29/2014
  • Est. Priority Date: 11/07/2008
  • Status: Active Grant
First Claim
Patent Images

1. A multi-chip module device, comprising:

  • a substantially thermally dissipative substrate;

    a plurality of light emitting devices;

    an electrically conductive layer applied to a surface of said substrate, wherein said conductive layer comprises a plurality of chip carrier parts each having a surface for carrying at least one of said light emitting devices;

    a reflective coating at least partially between and at least partially surrounding two or more of said light emitting devices and at least partially covering said conductive layer; and

    an isolating layer disposed between said reflective coating and said conductive layer, said isolating layer at least partially surrounding two or more of said light emitting devices.

View all claims
  • 2 Assignments
Timeline View
Assignment View
    ×
    ×