Package with a CMOS die positioned underneath a MEMS die

• US 8,791,531 B2
• Filed: 10/21/2011
• Issued: 07/29/2014
• Est. Priority Date: 12/28/2010
• Status: Active Grant

• Current Assignee: Knowles Electronics Llc (Knowles Corporation)
• Original Assignee: Knowles Electronics Llc (Knowles Corporation)
• Inventors: Loeppert, Peter V., Minervini, Anthony, Niew, Jeffrey, Grunert, Lawrence, Giesecke, David
• Primary Examiner(s): GEBREMARIAM, SAMUEL A
• Application Number:
  US13/278,351
• Publication Number:
  US 20120161259A1
• Time in Patent Office: 1,012 Days
• Field of Search: 257/414, 257/415, 257/416, 257/417
• US Class Current: 257/415
• CPC Class Codes: H01L 2224/05553 being rectangular
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48195 the item being a discrete passive component
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48265 the item being a discrete passive component
• CPC Class Codes: H01L 2224/48471 the other connecting portion not on the bonding area being a ball bond, i.e. wedge-to-ball, reverse stitch
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 25/165 Containers
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/1461 MEMS
• CPC Class Codes: H01L 2924/15151 the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
• CPC Class Codes: H01L 2924/16151 Cap comprising an aperture, e.g. for pressure control, encapsulation
• CPC Class Codes: H01L 2924/16251 Connecting to an item not being a semiconductor or solid-state body, e.g. cap-to-substrate
• CPC Class Codes: H01L 2924/19107 off-chip wires
• CPC Class Codes: H01L 2924/207 Diameter ranges
• CPC Class Codes: H04R 19/005 using semiconductor materials
• CPC Class Codes: H04R 19/04 : Microphones H04R19/01 takes precedence
• CPC Class Codes: H04R 2499/11 : Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's
• CPC Class Codes: H04R 31/00 : Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor manufacture of microstructural arrangements of deformable or non-deformable structures in general B81C1/00182

Abstract

A package is provided. The package has a substrate and a cover. A MEMS die is provided having a diaphragm. A CMOS die is provided wherein at least a portion of the CMOS die is positioned between the diaphragm and the substrate.

Claims

1. A package comprising:

a substrate;

a cover;

a MEMS die, the MEMS die having a top surface and a bottom surface, the bottom surface being in direct physical contact with the substrate;

a CMOS die located underneath the MEMS die, the CMOS die having a volume;

an acoustic port in the package, wherein the package has a back volume located between the MEMS die and the substrate and wherein an entirety of the CMOS die directly communicates with and is disposed within the back volume, wherein the back volume does not directly communicate with the acoustic port;

wherein an effective back volume exists which is equal to the back volume minus the volume of the CMOS die.

2. The package of claim 1 wherein the acoustic port is in the cover.

3. The package of claim 1 wherein the acoustic port is in the substrate.

4. A package comprising:

a substrate;

a cover;

a MEMS die, the MEMS die having a top surface and a bottom surface, the bottom surface being in direct physical contact with the substrate;

a CMOS die located underneath the MEMS die and being in direct physical contact with the substrate, the CMOS die having a volume;

an acoustic port disposed through the substrate and underneath the MEMS die;

wherein the package has a front volume located between the MEMS die and the substrate and wherein an entirety of the CMOS die directly communicates with and is disposed within the front volume, and wherein the front volume communicates directly with the acoustic port;

wherein an effective front volume exists which is equal to the front volume minus the volume of the CMOS die.

5. A package comprising:

a substrate;

a cover;

a MEMS die having sidewalls and a diaphragm connected to the sidewalls, the MEMS die having a top surface and a bottom surface, the bottom surface being in direct physical contact with the substrate, the top surface including the diaphragm;

a back volume that is formed between the sidewalls;

a front volume that is formed outside the sidewalls;

a CMOS die positioned on the substrate, underneath the MEMS die and surrounded by the sidewalls of the MEMS die and wherein an entirety of the CMOS die directly communicates with and is disposed within the back volume.

6. The package of claim 5 further comprising:

an acoustic port within the cover.

7. The package of claim 5 further comprising:

an acoustic port within the substrate.

8. A package comprising:

a substrate;

a cover;

a MEMS die having sidewalls and a diaphragm connected to the sidewalls, the MEMS die having a top surface and a bottom surface, the bottom surface being in direct physical contact with the substrate;

a back volume that is formed between the sidewalls;

a front volume that is formed outside the sidewalls and separate from the back volume, and the front volume communicating with a port;

a CMOS die positioned on the substrate, partially underneath the MEMS die within the back volume and through a channel in a sidewall of the MEMS die.

9. The package of claim 8 wherein the channel is acoustically sealed to effectively separate the back volume and the front volume.

10. The package of claim 8 further comprising:

an acoustic port within the substrate.

11. The package of claim 8 further comprising:

an acoustic port within the cover.

12. A package comprising:

a substrate;

a cover;

a MEMS die having a diaphragm, the MEMS die having a top surface and a bottom surface, the bottom surface being in direct physical contact with the substrate;

a CMOS die wherein the CMOS die is positioned between the diaphragm and the substrate and wherein an entirety of the CMOS die directly communicates with and is disposed within the back volume.

13. The package of claim 12 wherein the CMOS die is contained within sidewalls of the MEMS die.

14. The package of claim 12 further comprising:

an acoustic port within the substrate.

15. The package of claim 12 further comprising:

an acoustic port within the cover.

16. A package comprising:

a substrate;

a cover;

a MEMS die, the MEMS die having a top surface and a bottom surface, the MEMS die located on the substrate;

a CMOS die located underneath the MEMS die on the substrate, the CMOS die having a volume, wherein the bottom surface of the MEMS die is not in contact with the CMOS die;

an acoustic port in the package, wherein the package has a back volume located between the MEMS die and the substrate and wherein an entirety of the CMOS die directly communicates with and is disposed within the back volume, and wherein the back volume is not in direct communication with the acoustic port;

wherein an effective back volume exists which is equal to the back volume minus the volume of the CMOS die.