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Vertical integrated circuit switches, design structure and methods of fabricating same

  • US 8,791,778 B2
  • Filed: 09/16/2013
  • Issued: 07/29/2014
  • Est. Priority Date: 04/20/2009
  • Status: Active Grant
First Claim
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1. A MEMS switch, comprising:

  • at least two vertically extending metal wires formed in a wafer; and

    a void formed in the wafer which accommodates at least one of the at least two vertically extending metal wires,wherein the at least one of the at least two vertically extending metal wires is moveable within the void upon an application of a voltage, andthe at least two vertically extending metal wires are four wires and the at least one wire is two inner wires which are moveable within the void upon an application of the voltage.

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