Method of transferring a light emitting diode
First Claim
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1. A method of transferring a micro LED to a receiving substrate comprising:
- positioning a transfer head over a carrier substrate having an array of micro LED structures disposed thereon, each micro LED structure comprising;
a micro p-n diode; and
a metallization layer, wherein the metallization layer is between the micro p-n diode and a bonding layer on the carrier substrate;
heating the bonding layer for at least one of the micro LED structures above a liquidus temperature of the bonding layer to liquefy the bonding layer;
picking up the micro p-n diode and the metallization layer for the at least one of the micro LED structures with the transfer head while the bonding layer is liquefied; and
placing the micro p-n diode and the metallization layer for the at least one of the micro LED structures on the receiving substrate.
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Abstract
A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a metallization layer, with the metallization layer between the micro p-n diode and a bonding layer. A conformal dielectric barrier layer may span sidewalls of the micro p-n diode. The micro LED structure and micro LED array may be picked up and transferred to a receiving substrate.
394 Citations
18 Claims
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1. A method of transferring a micro LED to a receiving substrate comprising:
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positioning a transfer head over a carrier substrate having an array of micro LED structures disposed thereon, each micro LED structure comprising; a micro p-n diode; and a metallization layer, wherein the metallization layer is between the micro p-n diode and a bonding layer on the carrier substrate; heating the bonding layer for at least one of the micro LED structures above a liquidus temperature of the bonding layer to liquefy the bonding layer; picking up the micro p-n diode and the metallization layer for the at least one of the micro LED structures with the transfer head while the bonding layer is liquefied; and placing the micro p-n diode and the metallization layer for the at least one of the micro LED structures on the receiving substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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Specification