Sensor substrate systems and methods
First Claim
Patent Images
1. A sensing apparatus comprising:
- a planar substrate having a first side and a second side that is opposite and parallel to said first side, wherein the substrate defines therethrough a via, said via being a pathway that extends from said first side to said second side of the substrate;
a sensing element disposed on said first side, wherein the sensing element is configured to sense an analyte; and
electronics disposed on said second side, wherein the electronics include an illumination device for illuminating the analyte,wherein the via is hermetically sealed from the first side of the substrate to the second side of the substrate, wherein the via is at least partially filled with an optically transmissive material, and wherein the via is at least partially filled with an additional material, said additional material comprising an electrically conductive material other than air.
1 Assignment
0 Petitions
Accused Products
Abstract
A sensing apparatus may include a substrate having a first side for a sensing element and a second side for electronics, the substrate may have a at least one via from the first side of the substrate to the second side of the substrate, the at least one via may be hermetically sealed with an optically transmissive material.
-
Citations
27 Claims
-
1. A sensing apparatus comprising:
-
a planar substrate having a first side and a second side that is opposite and parallel to said first side, wherein the substrate defines therethrough a via, said via being a pathway that extends from said first side to said second side of the substrate; a sensing element disposed on said first side, wherein the sensing element is configured to sense an analyte; and electronics disposed on said second side, wherein the electronics include an illumination device for illuminating the analyte, wherein the via is hermetically sealed from the first side of the substrate to the second side of the substrate, wherein the via is at least partially filled with an optically transmissive material, and wherein the via is at least partially filled with an additional material, said additional material comprising an electrically conductive material other than air. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 24, 25, 26, 27)
-
-
17. A method of manufacturing a sensing apparatus, the method comprising:
-
providing a planar substrate having a first side and a second side that is opposite and parallel to said first side; forming at least one via through the substrate, wherein said at least one via is a pathway that extends from the first side of the substrate to the second side of the substrate; filling the at least one via at least partially with an optically transmissive material and at least partially with an additional material, said additional material comprising an electrically conductive material other than air, such that the at least one via is hermetically sealed from the first side of the substrate to the second side of the substrate; arranging on said first side of the substrate a sensing element configured to sense an analyte; and arranging electronics on said second side of the substrate, said electronics including an illumination device. - View Dependent Claims (18, 19, 20, 21, 22, 23)
-
Specification