Monitoring and measurement of thin film layers

• US 8,796,048 B1
• Filed: 05/11/2012
• Issued: 08/05/2014
• Est. Priority Date: 05/11/2011
• Status: Expired due to Fees

• Current Assignee: Fujitsu Semiconductor Limited (Fujitsu Limited)
• Original Assignee: SuVolta, Inc.
• Inventors: Thompson, Scott E., Ranade, Pushkar, Scudder, Lance, Stager, Charles
• Primary Examiner(s): TAYLOR, EARL N
• Application Number:
  US13/469,598
• Time in Patent Office: 816 Days
• Field of Search: 438/14, 438/638
• US Class Current: 438/14
• CPC Class Codes: H01L 21/67253 Process monitoring, e.g. flow or thickness monitoring
• CPC Class Codes: H01L 21/76229 Concurrent filling of a plurality of trenches having a different trench shape or dimension, e.g. rectangular and V-shaped trenches, wide and narrow trenches, shallow and deep trenches
• CPC Class Codes: H01L 22/12 for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions electrical measurement of diffusions H01L22/14
• CPC Class Codes: H01L 22/30 Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements

Abstract

The present disclosure provides methods and structures for measurement, control, and monitoring the thickness of thin film layers formed as part of a semiconductor manufacturing process. The methods and structures presented provide the capability to measure and monitor the thickness of the thin film using trench line structures. In certain embodiments, the thin film thickness measurement system can be integrated with thin film growth and control software, providing automated process control (APC) or statistical process control (SPC) capability by measuring and monitoring the thin film thickness during manufacturing. Methods for measuring the thickness of thin films can be important to the fabrication of integrated circuits because the thickness and uniformity of the thin film can determine electrical characteristics of the transistors being fabricated.

Claims

1. A method for monitoring a process that concurrently forms at least one material on vertical and horizontal surfaces on the surface of a substrate, the method comprising:

providing a first substrate having a first surface, the first surface comprising a plurality of trenches of substantially a same depth and having substantially different widths;

applying the process to the first substrate using process parameters selected to provide a target thickness for the at least one material;

identifying a widest one of the plurality of trenches substantially filled with the at least one material to yield an identified trench; and

determining whether the process provided the target thickness based on the identified trench and pre-defined correlation data specifying a target trench corresponding to the target thickness.

2. The method of claim 1, further comprising:

estimating a thickness of the at least one material based on the identified trench and on pre-defined correlation data, the pre-defined correlation data specifying a correlation between a substantial filing of the plurality of trenches and thicknesses for the at least one material for the process.

3. The method of claim 1, wherein the providing comprises forming the plurality of trenches on the first surface, the forming comprising selecting the plurality of widths to be between about 1×

and 2.5×

of the target thickness.

4. The method of claim 3, the forming further comprising selecting the depth to be between about 2×

and 5×

of the target thickness.

5. The method of claim 1, wherein the first substrate comprises a plurality of scribe regions, and wherein the providing comprises forming the plurality of trenches on the first surface in the plurality of scribe regions.

6. The method of claim 1, wherein the first surface comprises a semiconductor surface.

7. The method of claim 1, wherein the providing comprises forming the plurality of trenches on the first surface during an alignment mask process.

8. The method of claim 1, wherein the providing comprises selecting dimensions for the plurality of trenches, the selecting comprising:

providing at least one precursor substrate, the at least one precursor substrate comprising one or more sets of trenches, each of the sets of trenches comprising a series of trenches having substantially different widths, and each of the set of trenches associated with a substantially different depth;

applying the process to the at least precursor substrate using process parameters selected to provide a target thickness for the at least one material;

identifying one set from the sets of trenches comprising a first trench that is substantially filled with the at least one material, at least one second trench that is completely filled with the at least one material, and at least one third trench still defining a trench; and

selecting the one set to define the plurality of trenches for the first substrate, wherein the first trench is the target trench.

9. The method of claim 8, further comprising generating the pre-defined correlation data, the generating comprising:

providing a plurality of test substrates each comprising the plurality of trenches;

applying the process to the plurality of test substrates using process parameters selected to provide different thicknesses for the at least one material on different ones of the plurality of test substrates;

obtaining a measure of the thicknesses of the at least one material for each of the plurality of test substrates; and

identifying a widest one of the plurality of trenches substantially filled with the at least one material on each of the plurality of substrates to yield identified trenches and correlating to the measured thicknesses and the identified trenches to generate the pre-defined correlation data.

10. A method for monitoring a process for forming that concurrently forms a semiconductor film on vertical and horizontal surfaces on the surface of a substrate comprising the semiconductor material, the method comprising:

forming a trench line structure on the surface of the substrate, the trench line structure comprising a plurality of trenches of substantially a same depth and having substantially different widths;

applying the process to the substrate using process parameters selected to provide a target thickness for the semiconductor material;

identifying a widest trench in the trench line structure substantially filled with the at least one material to yield an identified trench; and

determining whether the process provided the target thickness based on the identified trench and pre-defined correlation data specifying a target trench corresponding to the target thickness.

11. The method of claim 10, further comprising:

estimating a thickness of the semiconductor material based on the identified trench and on pre-defined correlation data, the pre-defined correlation data specifying a correlation between a substantial filing of the plurality of trenches and thicknesses for the semiconductor material for the process.

12. The method of claim 10, wherein the semiconductor material comprises silicon.

13. The method of claim 10, wherein the providing comprises forming the plurality of trenches on the surface of the substrate during an alignment mask process.

14. The method of claim 10, wherein the providing comprises selecting dimensions for the plurality of trenches, the selecting comprising:

providing at least one precursor substrate having a surface comprising the semiconductor material, the at least one precursor substrate comprising one or more sets of trenches, each of the sets of trenches comprising a series of trenches having substantially different widths, and each of the set of trenches associated with a substantially different depth;

applying the process to the at least precursor substrate using process parameters selected to provide a target thickness for the semiconductor material;

identifying one set from the sets of trenches comprising a first trench that is substantially filled with the semiconductor material, at least one second trench that is completely filled with the semiconductor material, and at least one third trench still defining a trench; and

selecting the one set to define the plurality of trenches for the first substrate, wherein the first trench is the target trench.

15. The method of claim 14, further comprising generating the pre-defined correlation data, the generating comprising:

providing a plurality of test substrates each comprising the plurality of trenches formed on a surface of the test substrate comprising the semiconductor material;

applying the process to the plurality of test substrates using process parameters selected to provide different thicknesses for the semiconductor material on different ones of the plurality of test substrates;

obtaining a measure of the thicknesses of the semiconductor material for each of the plurality of test substrates; and

identifying a widest one of the plurality of trenches substantially filled with the semiconductor material on each of the plurality of substrates to yield identified trenches and correlating to the measured thicknesses and the identified trenches to generate the pre-defined correlation data.

16. A method for monitoring a process for forming that concurrently forms at least one material on vertical and horizontal surfaces on the surface of a substrate, the method comprising:

providing a first substrate having a first surface, the first surface comprising a plurality of trenches of substantially a same depth and having substantially different widths;

applying the process to the first substrate using process parameters selected to provide a target thickness for the at least one material;

identifying a narrowest one of the plurality of trenches that is incompletely filled yield an identified trench; and

determining whether the process provided the target thickness based on the identified trench and pre-defined correlation data specifying a target trench corresponding to the target thickness.

17. The method of claim 16, further comprising:

estimating a thickness of the at least one material based on the identified trench and on pre-defined correlation data, the pre-defined correlation data specifying a correlation between ones of the plurality of trenches defining trenches incompletely filled after the process and thicknesses for the at least one material for the process.

18. The method of claim 16, wherein the providing comprises selecting dimensions for the plurality of trenches, the selecting comprising:

providing at least one precursor substrate, the at least one precursor substrate comprising one or more sets of trenches, each of the sets of trenches comprising a series of trenches having substantially different widths, and each of the set of trenches associated with a substantially different depth;

applying the process to the at least precursor substrate using process parameters selected to provide a target thickness for the at least one material;

identifying one set from the sets of trenches comprising a plurality of first trenches filled with the at least one material and a plurality of second trenches defining trenches that are incompletely filled; and

selecting the one set to define the plurality of trenches for the first substrate, wherein a narrowest one of the second trenches is the target trench.

19. The method of claim 18, further comprising generating the pre-defined correlation data, the generating comprising:

providing a plurality of test substrates each comprising the plurality of trenches;

applying the process to the plurality of test substrates using process parameters selected to provide different thicknesses for the at least one material on different ones of the plurality of test substrates;

obtaining a measure of the thicknesses of the at least one material for each of the plurality of test substrates; and

identifying a narrowest one of the plurality of trenches still defining an incompletely filled trench on each of the plurality of substrates to yield identified trenches and correlating to the measured thicknesses and the identified trenches to generate the pre-defined correlation data.