Optoelectronic apparatuses with post-molded reflector cups and methods for manufacturing the same

• US 8,796,052 B2
• Filed: 04/30/2012
• Issued: 08/05/2014
• Est. Priority Date: 02/24/2012
• Status: Active Grant

• Current Assignee: Intersil Americas LLC (Renesas Electronics Corporation)
• Original Assignee: Intersil Americas LLC (Renesas Electronics Corporation)
• Inventors: Ankireddi, Seshasayee S., Wiese, Lynn K.
• Primary Examiner(s): CHAUDHARI, CHANDRA P
• Application Number:
  US13/460,594
• Publication Number:
  US 20130221380A1
• Time in Patent Office: 827 Days
• Field of Search: 438/25
• US Class Current: 438/28
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/12044 OLED
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/60 Reflective elements

Abstract

A method for manufacturing a plurality of optoelectronic apparatuses include attaching bottom surfaces of a plurality of packaged optoelectronic semiconductor devices (POSDs) to a carrier substrate (e.g., a tape) so that there is a space between each POSD and its one or more neighboring POSD(s). A light reflective molding compound is molded around a portion each of the POSDs attached to the carrier substrate so that a reflector cup is formed from the light reflective molding compound for each of the POSDs. The light reflective molding compound can also attach the POSDs to one another. Alternatively, an opaque molding compound can be molded around each POSD/reflector cup to attach the POSDs/reflector cups to one another and form a light barrier between each POSD and its neighboring POSD(s). The carrier substrate is thereafter removed so that electrical contacts on the bottom surfaces of the POSDs are exposed.

Claims

1. A method for manufacturing a plurality of optoelectronic apparatuses that each include one or more packaged optoelectronic semiconductor devices (POSDs),

wherein each POSD includes one or more optoelectronic elements encapsulated by a light transmissive molding compound, and

wherein each POSD includes a bottom surface including electrical contacts,

the method comprising:

(a) attaching the bottom surfaces of a plurality of POSDs to a carrier substrate so that there is a space between each POSD and its one or more neighboring POSD(s);

(b) molding a light reflective molding compound around a portion each of the POSDs attached to the carrier substrate so that a reflector cup is formed from the light reflective molding compound for each of the POSDs; and

(c) removing the carrier substrate so that the electrical contacts on the bottom surfaces of the POSDs are exposed.

2. The method of claim 1, wherein step (b) includes molding the light reflective molding compound around a portion of each of the POSDs attached to the carrier substrate so that

a peripheral surface of each of the POSDs is surrounded by the light reflective molding compound which forms the reflector cups for the POSDs,

the space between each of the POSDs and its one or more neighboring POSD(s) is filled with the light reflective molding compound, and

the plurality of POSDs are attached to one another by the reflective molding compound.

3. The method of claim 2, further comprising, after step (b), and either before or after step (c):

cutting through the light reflective molding compound to separate each of the POSDs from the other POSDs, so that each of a plurality of resulting optoelectronic apparatuses includes one of the POSDs and one of the reflector cups formed from the light reflective molding compound.

4. The method of claim 2, further comprising, after step (b), and either before or after step (c):

cutting through the light reflective molding compound to separate subsets of the POSDs from the other subsets of the POSDs, so that each of a plurality of resulting optoelectronic apparatuses includes one subset of the POSDs;

wherein each subset of the POSDs comprises at least two POSDs; and

wherein associated with each of the POSDs within each subset of the POSDs is a corresponding one of the reflector cups formed from the light reflective molding compound.

5. The method of claim 1, further comprising after step (b) and before step (c):

molding an opaque molding compound around a portion of each of the molded reflector cups so that an optical barrier is formed from the opaque molding compound between each of the POSDs and its one or more neighboring POSDs.

6. The method of claim 5, further comprising, after the molding the light reflective molding compound, after the molding the opaque molding compound, and either before or after step (c):

cutting through the opaque molding compound to separate one of the POSDs from other ones of the POSDs, so that a plurality of resulting optoelectronic apparatuses each includes

one of the POSDs,

one of the reflector cups formed from the light reflective molding compound, and

an optical barrier formed from the opaque molding compound and surrounding a peripheral portion of the one of the reflector cups.

7. The method of claim 5, further comprising, after the molding the light reflective molding compound, and after the molding the opaque molding compound, and either before or after step (c):

cutting through the opaque molding compound to separate subsets of the POSDs from the other subsets of the POSDs, so that each of a plurality of resulting optoelectronic apparatuses includes one subset of the POSDs;

wherein each subset of the POSDs comprises at least two POSDs; and

wherein associated with each of the POSDs within each subset of the POSDs is a corresponding one of the reflector cups formed from the light reflective molding compound; and

wherein a light barrier formed from the opaque molding compound separates neighboring POSDs within each subset of the POSDs.

8. The method of claim 1, wherein:

the carrier substrate comprises tape having an adhesive surface;

step (a) comprises attaching the bottom surfaces of the plurality of POSDs to the adhesive surface of the tape so that there is the space between each POSD and its one or more neighboring POSD(s); and

step (c) comprises removing the tape so that the electrical contacts on the bottom surfaces of the POSDs are exposed.

9. The method of claim 1, wherein each of the POSDs comprises a packaged light source semiconductor device (PLSSD) that includes one or more light emitting elements.

10. The method of claim 1, wherein at least one of the POSDs comprises a packaged light detector semiconductor device (PLDSD) that include one or more light detecting elements.

11. A method for manufacturing an optoelectronic apparatus that includes

one or more packaged optoelectronic semiconductor devices (POSDs),

wherein each POSD includes one or more optoelectronic elements encapsulated by a light transmissive molding compound, and

wherein each POSD includes a bottom surface including electrical contacts,

the method comprising:

(a) attaching the bottom surfaces of the one or more POSDs to a carrier substrate;

(b) molding a light reflective molding compound around a portion each of the one or more POSDs attached to the carrier substrate so that a reflector cup is formed from the light reflective molding compound for each of the one or more POSDs; and

(c) removing the carrier substrate so that the electrical contacts on the bottom surfaces of the one or more POSDs are exposed.

12. The method of claim 11, wherein:

the carrier substrate comprises tape having an adhesive surface;

step (a) comprises attaching the bottom surfaces of the one or more POSDs to the adhesive surface of the tape; and

step (c) comprises removing the tape so that the electrical contacts on the bottom surfaces of the one or more POSDs are exposed.

13. The method of claim 11, further comprising after step (b) and before step (c):

molding an opaque molding compound around a portion of each molded reflector cup.

14. The method of claim 11, wherein each of the one or more POSDs comprises a packaged light source semiconductor device (PLSSD) that includes one or more light emitting elements.