Light emitting diode package structure and manufacturing method thereof

• US 8,796,713 B2
• Filed: 06/29/2011
• Issued: 08/05/2014
• Est. Priority Date: 09/30/2010
• Status: Active Grant

• Current Assignee: Everlight Electronics Company Limited
• Original Assignee: Everlight Electronics Company Limited
• Inventors: Lin, Hsien Chia
• Primary Examiner(s): Smoot, Stephen W
• Assistant Examiner(s): Chin, Edward
• Application Number:
  US13/172,175
• Publication Number:
  US 20120080703A1
• Time in Patent Office: 1,133 Days
• Field of Search: 257/98, 257/99, 257/100, 257/E33.056, 257/21.499, 257/E33.001, 257/678, 438/27, 438/29
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2933/0066 relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/504 Elements with two or more wavelength conversion materials
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

An LED package structure comprises a substrate, a first electrically conductive pattern, a second electrically conductive pattern, at least one electrically conductive element, and an LED chip. The substrate has a first surface and a second surface opposite to the first surface. The first electrically conductive pattern is disposed on the first surface. The second electrically conductive pattern is disposed on the second surface. The at least one electrically conductive element traverses the fluorescent substrate and connects the first and second electrically conductive patterns. The LED chip is disposed on the second surface and has a light extraction surface that connects the second electrically conductive pattern. The LED chip is electrically coupled to the first electrically conductive pattern via the at least one electrically conductive element.

Claims

1. A manufacturing method of a light emitting diode (LED) package structure, the method comprising:

providing a substrate having a first surface and a second surface opposite to the first surface, the substrate containing therein a electrically conductive component that connects the first surface and the second surface;

forming a first electrically conductive pattern on the first surface and a second electrically conductive pattern on the second surface such that the electrically conductive component electrically couples the first electrically conductive pattern and the second electrically conductive pattern; and

bonding a plurality of LED chips including first and second LED chips on the second surface of the substrate with a light extraction surface of each of the first and second LED chips coupled to the second electrically conductive pattern such that the first LED chip is aligned with the electrically conductive component and the second LED chip is not aligned with the electrically conductive component and that the first and second LED chips are electrically coupled to the first electrically conductive pattern via the second electrically conductive pattern and the electrically conductive component.

2. The method of claim 1, wherein providing the substrate comprises providing a fluorescent substrate that comprises a mixture of at least one fluorescent material and a transparent material.

3. The method of claim 2, wherein the at least one fluorescent material comprises a yellow phosphor, phosphors of at least two different wavelengths, or at least two of yellow phosphor, red phosphor, and green phosphor.

4. The method of claim 2, further comprising:

providing at least one electrically conductive bump in a recess of a supporting substrate;

filling the recess of the supporting substrate with the at least one fluorescent material and the transparent material, the at least one fluorescent material and the glass material covering the at least one electrically conductive bump;

heating the at least one electrically conductive bump, the at least one fluorescent material, and the transparent material together to form the fluorescent substrate with the at least one electrically conductive bumps embedded therein; and

polishing the fluorescent substrate and the at least one electrically conductive bump to form the at least one electrically conductive component that is flush with the first surface of the fluorescent substrate.

5. The method of claim 1, wherein the polishing comprises cutting the substrate with a cutting device to reduce a thickness of the substrate and to expose the at least one electrically conductive component.

6. The method of claim 1, further comprising:

forming at least one conductive line on the second surface after forming the second electrically conductive pattern, the at least one conductive line connecting the second electrically conductive pattern.

7. The method of claim 1, further comprising:

forming an underfill between the light extraction surface of each of the plurality of LED chips and the second surface of the substrate after bonding the plurality of LED chips on the second surface of the substrate, the underfill covering at least partially the light extraction surface of each of the plurality of LED chips.

8. The method of claim 7, wherein the underfill covers at least partially a side surface of each of the plurality of LED chips.