Light emitting diode package structure and manufacturing method thereof
First Claim
1. A manufacturing method of a light emitting diode (LED) package structure, the method comprising:
- providing a substrate having a first surface and a second surface opposite to the first surface, the substrate containing therein a electrically conductive component that connects the first surface and the second surface;
forming a first electrically conductive pattern on the first surface and a second electrically conductive pattern on the second surface such that the electrically conductive component electrically couples the first electrically conductive pattern and the second electrically conductive pattern; and
bonding a plurality of LED chips including first and second LED chips on the second surface of the substrate with a light extraction surface of each of the first and second LED chips coupled to the second electrically conductive pattern such that the first LED chip is aligned with the electrically conductive component and the second LED chip is not aligned with the electrically conductive component and that the first and second LED chips are electrically coupled to the first electrically conductive pattern via the second electrically conductive pattern and the electrically conductive component.
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Accused Products
Abstract
An LED package structure comprises a substrate, a first electrically conductive pattern, a second electrically conductive pattern, at least one electrically conductive element, and an LED chip. The substrate has a first surface and a second surface opposite to the first surface. The first electrically conductive pattern is disposed on the first surface. The second electrically conductive pattern is disposed on the second surface. The at least one electrically conductive element traverses the fluorescent substrate and connects the first and second electrically conductive patterns. The LED chip is disposed on the second surface and has a light extraction surface that connects the second electrically conductive pattern. The LED chip is electrically coupled to the first electrically conductive pattern via the at least one electrically conductive element.
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Citations
8 Claims
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1. A manufacturing method of a light emitting diode (LED) package structure, the method comprising:
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providing a substrate having a first surface and a second surface opposite to the first surface, the substrate containing therein a electrically conductive component that connects the first surface and the second surface; forming a first electrically conductive pattern on the first surface and a second electrically conductive pattern on the second surface such that the electrically conductive component electrically couples the first electrically conductive pattern and the second electrically conductive pattern; and bonding a plurality of LED chips including first and second LED chips on the second surface of the substrate with a light extraction surface of each of the first and second LED chips coupled to the second electrically conductive pattern such that the first LED chip is aligned with the electrically conductive component and the second LED chip is not aligned with the electrically conductive component and that the first and second LED chips are electrically coupled to the first electrically conductive pattern via the second electrically conductive pattern and the electrically conductive component. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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Specification