Three dimensional memory structure

• US 8,796,862 B2
• Filed: 08/09/2013
• Issued: 08/05/2014
• Est. Priority Date: 04/04/1997
• Status: Expired due to Fees

• Current Assignee: Elm 3DS Innovations LLC
• Original Assignee: Elm 3DS Innovations LLC
• Inventors: Leedy, Glenn J
• Primary Examiner(s): Lam, David
• Application Number:
  US13/963,164
• Publication Number:
  US 20130320341A1
• Time in Patent Office: 361 Days
• Field of Search: 257777-778, 257685-686, 438/455, 438/977, 438107-108, 365/63, 365/51, 365/230.06
• US Class Current: 257/777
• CPC Class Codes: G11C 5/02 Disposition of storage elements, e.g. in the form of a matrix array
• CPC Class Codes: G11C 5/06 Arrangements for interconnecting storage elements electrically, e.g. by wiring
• CPC Class Codes: H01L 21/76898 formed through a semiconductor substrate
• CPC Class Codes: H01L 2224/8083 Solid-solid interdiffusion
• CPC Class Codes: H01L 2224/8384 Sintering
• CPC Class Codes: H01L 23/481 Internal lead connections, e.g. via connections, feedthrough structures
• CPC Class Codes: H01L 23/5226 Via connections in a multilevel interconnection structure
• CPC Class Codes: H01L 25/0657 Stacked arrangements of devices
• CPC Class Codes: H01L 27/0688 Integrated circuits having a three-dimensional layout
• CPC Class Codes: H01L 29/02 Semiconductor bodies ; Multistep manufacturing processes therefor
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H10B 12/50 Peripheral circuit region structures
• CPC Class Codes: Y10S 438/977 Thinning or removal of substrate

Abstract

A Three-Dimensional Structure (3DS) Memory allows for physical separation of the memory circuits and the control logic circuit onto different layers such that each layer may be separately optimized. One control logic circuit suffices for several memory circuits, reducing cost. Fabrication of 3DS memory involves thinning of the memory circuit to less than 50 microns in thickness and bonding the circuit to a circuit stack while still in wafer substrate form. Fine-grain high density inter-layer vertical bus connections are used. The 3DS memory manufacturing method enables several performance and physical size efficiencies, and is implemented with established semiconductor processing techniques.

Claims

1. A stacked circuit structure comprising:

a plurality of stacked, thin, substantially flexible circuit layers each comprising a top surface and a bottom surface and at least one of which comprises a thinned, substantially flexible monocrystalline semiconductor substrate of one piece; and

an interlayer region disposed between a pair of vertically adjacent circuit layers and extending from a top surface of one of the pair of vertically adjacent circuit layers to a bottom surface of another one of the pair of vertically adjacent circuit layers, the interlayer region comprising an interlayer for providing mechanical attachment and electrical interconnection between the pair of vertically adjacent circuit layers;

wherein within the interlayer region the stacked circuit structure consists essentially of metal or metal and silicon-based dielectric.

2. The stacked circuit structure of claim 1, wherein the interlayer comprises both signal-carrying metal contacts and non-signal-carrying metal bonding areas.

3. The stacked circuit structure of claim 1, wherein at least one of:

the thinned, substantially flexible monocrystalline semiconductor substrate comprises a plurality of etched through-holes each surrounding a vertical interconnect, each vertical interconnect comprising a conductor and an insulator surrounding the conductor and isolating the conductor from the thinned, substantially flexible monocrystalline semiconductor substrate; and

a backside of the thinned, substantially flexible monocrystalline semiconductor substrate is polished to reduce vulnerability to fracture as a result of flexing.

4. The stacked circuit structure of claim 3, wherein the insulator comprises low-stress silicon-based dielectric material having a stress of less than 5×

10⁸ dynes/cm² tensile.

5. The stacked circuit structure of claim 1, further comprising a low-stress silicon-based dielectric layer formed above the thinned, substantially flexible monocrystalline semiconductor substrate, wherein the low-stress silicon-based dielectric layer exhibits net tensile stress.

6. The stacked circuit structure of claim 5, wherein the low-stress silicon-based dielectric layer has a stress of less than 5×

10⁸ dynes/cm² tensile.

7. The stacked circuit structure of claim 1, wherein a backside of the thinned, substantially flexible monocrystalline semiconductor substrate is polished to reduce vulnerability to fracture as a result of flexing.

8. The stacked circuit structure of claim 1, wherein at least one of the plurality of stacked, thin, substantially flexible circuit layers comprises at least one memory array and another of the stacked, thin, substantially flexible circuit layers comprises a memory controller for controlling the at least one memory array.

9. The stacked circuit structure of claim 8, wherein the at least one memory array comprises a plurality of independently-operable memory arrays, the memory controller being enabled to control the plurality of independently-operable memory arrays independently and simultaneously;

further comprising a plurality of independently-operable vertical interconnect buses, wherein data exchanged between the memory controller and the plurality of independently-operable memory arrays is bussed independently and simultaneously over the plurality of independently-operable vertical interconnect buses.

10. The stacked circuit structure of claim 8, wherein at least one of:

the at least one memory array and memory controller together form a memory, the memory being reconfigurable by operation of the memory controller;

the memory controller or another of the stacked, thin, substantially flexible circuit layers comprises circuitry for performing functional testing of the at least one memory array.

40. The stacked circuit structure of claim 1, further comprising a low-stress silicon-based dielectric layer formed above the thinned, substantially flexible monocrystalline semiconductor substrate and having a stress of less than 5×

10⁸ dynes/cm² tensile, wherein at least one of;

the thinned, substantially flexible monocrystalline semiconductor substrate comprises a plurality of etched through-holes each surrounding a vertical interconnect, each vertical interconnect comprising a conductor and an insulator comprising low-stress silicon-based dielectric material having a stress of less than 5×

10⁸ dynes/cm² tensile surrounding the conductor and isolating the conductor from the thinned, substantially flexible monocrystalline semiconductor substrate; and

the backside of the thinned, substantially flexible monocrystalline semiconductor substrate is polished to reduce vulnerability to fracture as a result of flexing.

41. The stacked circuit structure of claim 8, further comprising a low-stress silicon-based dielectric layer formed above the thinned, substantially flexible monocrystalline semiconductor substrate and having a stress of less than 5×

10⁸ dynes/cm² tensile, wherein at least one of;

the thinned, substantially flexible monocrystalline semiconductor substrate comprises a plurality of etched through-holes each surrounding a vertical interconnect, each vertical interconnect comprising a conductor and an insulator comprising low-stress silicon-based dielectric material having a stress of less than 5×

10⁸ dynes/cm² tensile surrounding the conductor and isolating the conductor from the thinned, substantially flexible monocrystalline semiconductor substrate; and

a backside of the thinned, substantially flexible monocrystalline semiconductor substrate is polished to reduce vulnerability to fracture as a result of flexing.

48. The stacked circuit structure of claim 7, further comprising a low-stress silicon-based dielectric layer having a stress of less than 5×

10⁸ dynes/cm² tensile formed on the polished backside of the of the thinned, substantially flexible monocrystalline semiconductor substrate.

52. The stacked circuit structure of claim 40, further comprising a low-stress silicon-based dielectric layer having a stress of less than 5×

10⁸ dynes/cm² tensile formed on the polished backside of the of the thinned, substantially flexible monocrystalline semiconductor substrate.

53. The stacked circuit structure of claim 41, further comprising a low-stress silicon-based dielectric layer having a stress of less than 5×

10⁸ dynes/cm² tensile formed on the polished backside of the of the thinned, substantially flexible monocrystalline semiconductor substrate.

60. The stacked circuit structure of claim 9, further comprising a low-stress silicon-based dielectric layer formed above the thinned, substantially flexible monocrystalline semiconductor substrate and having a stress of less than 5×

10⁸ dynes/cm² tensile, wherein at least one of;

the thinned, substantially flexible monocrystalline semiconductor substrate comprises a plurality of etched through-holes each surrounding a vertical interconnect, each vertical interconnect comprising a conductor and an insulator comprising low-stress silicon-based dielectric material having a stress of less than 5×

10⁸ dynes/cm² tensile surrounding the conductor and isolating the conductor from the thinned, substantially flexible monocrystalline semiconductor substrate; and

the backside of the thinned, substantially flexible monocrystalline semiconductor substrate is polished to reduce vulnerability to fracture as a result of flexing.

61. The stacked circuit structure of claim 60, further comprising a low-stress silicon-based dielectric layer having a stress of less than 5×

10⁸ dynes/cm² tensile formed on the polished backside of the of the thinned, substantially flexible monocrystalline semiconductor substrate.

62. The stacked circuit structure of claim 10, further comprising a low-stress silicon-based dielectric layer formed above the thinned, substantially flexible monocrystalline semiconductor substrate and having a stress of less than 5×

10⁸ dynes/cm² tensile, wherein at least one of;

the thinned, substantially flexible monocrystalline semiconductor substrate comprises a plurality of etched through-holes each surrounding a vertical interconnect, each vertical interconnect comprising a conductor and an insulator comprising low-stress silicon-based dielectric material having a stress of less than 5×

10⁸ dynes/cm² tensile surrounding the conductor and isolating the conductor from the thinned, substantially flexible monocrystalline semiconductor substrate; and

the backside of the thinned, substantially flexible monocrystalline semiconductor substrate is polished to reduce vulnerability to fracture as a result of flexing.

63. The stacked circuit structure of claim 62, further comprising a low-stress silicon-based dielectric layer having a stress of less than 5×

10⁸ dynes/cm² tensile formed on the polished backside of the of the thinned, substantially flexible monocrystalline semiconductor substrate.

80. The stacked circuit structure of claim 8, further comprising a plurality of vertical interconnections passing through at least one of the plurality of stacked, thin, substantially flexible circuit layers and used by the memory controller for controlling the at least one memory array.

84. The stacked circuit structure of claim 1, further comprising a low-stress silicon-based dielectric layer formed above the thinned, substantially flexible monocrystalline semiconductor substrate and having a stress of less than 5×

10⁸ dynes/cm² tensile, wherein;

a backside of the thinned, substantially flexible monocrystalline semiconductor substrate is polished to reduce vulnerability to fracture as a result of flexing; and

at least one of the plurality of stacked, thin, substantially flexible circuit layers has edges that define its size in area; and

the thinned, substantially flexible monocrystalline semiconductor substrate extends in one piece across a substantial portion of the area between the edges.

88. The stacked circuit structure of claim 1, further comprising a low-stress silicon-based dielectric layer formed above the thinned, substantially flexible monocrystalline semiconductor substrate and having a stress of less than 5×

10⁸ dynes/cm² tensile, wherein;

a backside of the thinned, substantially flexible monocrystalline semiconductor substrate is polished to reduce vulnerability to fracture as a result of flexing; and

at least one of the plurality of stacked, thin, substantially flexible circuit layers comprises a singulated die having a die area defined by its perimeter; and

the thinned, substantially flexible monocrystalline semiconductor substrate extends in one piece across a substantial portion of the die area.

92. The stacked circuit structure of claim 1, further comprising a low-stress silicon-based dielectric layer formed above the thinned, substantially flexible monocrystalline semiconductor substrate and having a stress of less than 5×

10⁸ dynes/cm² tensile, wherein;

a backside of the thinned, substantially flexible monocrystalline semiconductor substrate is polished to reduce vulnerability to fracture as a result of flexing; and

at least one of the plurality of stacked, thin, substantially flexible circuit layers is substantially flexible based on the thinned, substantially flexible monocrystalline semiconductor substrate being substantially flexible and the stress of the low stress silicon-based dielectric layer being less than 5×

10⁸ dynes/cm² tensile.

96. The stacked circuit structure of claim 40, wherein:

the plurality of stacked, thin, substantially flexible circuit layers form a stacked integrated circuit memory structure;

a majority of the stacked integrated circuit memory structure is partitioned into a plurality of block stacks, a block stack comprising at least one memory array controller block, a plurality of memory array blocks and an array of vertical interconnects that vertically interconnect the at least one memory array controller block and the plurality of memory array blocks and pass through at least one of the at least one memory array controller block and the plurality of memory array blocks, wherein the at least one memory array controller block comprises circuitry for performing memory accesses with the plurality of memory array blocks;

wherein at least two of the plurality of block stacks can independently and simultaneously perform memory accesses within the stacked integrated circuit memory structure, wherein the array of vertical interconnects of the at least two of the plurality of block stacks can independently and simultaneously transfer data during said memory accesses.

97. The stacked circuit structure of claim 96, wherein at least one block stack of the plurality of the block stacks comprises at least one memory array controller block comprising circuitry that performs error correction on read data from at least one of the memory array blocks of said at least one block stack, wherein read data is transferred through one or more vertical interconnects of the array of vertical interconnects of the at least one block stack.

98. The stacked circuit structure of claim 97, wherein the read data includes ECC data used by the circuitry of the at least one memory array controller block to perform error correction on the read data.

99. The stacked circuit structure of claim 96, wherein at least one block stack of the plurality of the block stacks comprises at least one memory array controller block comprising reconfiguration circuitry that performs reconfiguration of the array of vertical interconnects to avoid using one or more defective memory portions of the plurality of memory array blocks.

100. The stacked circuit structure of claim 99, wherein the reconfiguration circuitry substitutes for the one or more defective memory portions of the plurality of memory array blocks one or more redundant memory portions from at least one of the plurality of memory array blocks.

101. The stacked circuit structure of claim 100, wherein the one or more defective memory portions comprise defective gate lines of the plurality of memory array blocks and the one or more redundant memory portions comprise redundant gate lines of the plurality of memory array blocks.

102. The stacked circuit structure of claim 96, wherein at least one block stack of the plurality of block stacks comprises at least one memory array controller block further comprising reconfiguration circuitry that performs reconfiguration of the array of vertical interconnects to avoid using one or more defective vertical interconnects of the at least one block stack.

103. The stacked circuit structure of claim 96, wherein at least one block stack of the plurality of block stacks comprises at least one memory array controller block further comprising refresh circuitry that performs refresh of one or more memory portions of the plurality of memory array blocks, wherein the refresh circuitry performs refresh of the one or more memory portions of the plurality of memory array blocks using one or more of the vertical interconnects of said at least one block stack.

104. The stacked circuit structure of claim 96, wherein at least one

block stack of the plurality of block stacks comprises at least one memory array block controller further comprising test circuitry that performs testing of one or more memory portions of the plurality of memory array blocks, wherein the test circuitry tests the one or more memory portions of the plurality of memory array blocks using one or more of the vertical interconnects of said at least one block stack.

157. The substantially flexible stacked integrated circuit structure of claim 1, wherein a process technology used to make the at least one of the plurality of thin substantially flexible circuit layers is different than a process technology used to make the at least one of the plurality of thin substantially flexible circuit layers comprising a thinned, substantially flexible monocrystalline semiconductor substrate.

11. A stacked circuit structure comprising:

a plurality of stacked, thin, substantially flexible circuit layers at least one of which comprises a thinned, substantially flexible monocrystalline semiconductor substrate of one piece;

wherein a pair of vertically adjacent circuit layers is joined together using metal-to-metal bonding as a mechanism of both attachment and electrical interconnection.

12. The stacked circuit structure of claim 11, further comprising an interlayer joining the pair of vertically adjacent circuit layers, the interlayer comprising both signal-carrying metal contacts and non-signal-carrying metal bonding areas.

13. The stacked circuit structure of claim 11, wherein at least one of:

the thinned, substantially flexible monocrystalline semiconductor substrate comprises a plurality of etched through-holes each surrounding a vertical interconnect, each vertical interconnect comprising a conductor and an insulator surrounding the conductor and isolating the conductor from the thinned, substantially flexible monocrystalline semiconductor substrate; and

a backside of the thinned, substantially flexible monocrystalline semiconductor substrate is polished to reduce vulnerability to fracture as a result of flexing.

14. The stacked circuit structure of claim 13, wherein the insulator comprises low-stress silicon-based dielectric material having a stress of less than 5×

10⁸ dynes/cm² tensile.

15. The stacked circuit structure of claim 11, further comprising a low-stress silicon-based dielectric layer formed above the thinned, substantially flexible monocrystalline semiconductor substrate, wherein the low-stress silicon-based dielectric layer exhibits net tensile stress.

16. The stacked circuit structure of claim 15, wherein the low-stress silicon-based dielectric layer has a stress of less than 5×

10⁸ dynes/cm² tensile.

17. The stacked circuit structure of claim 11, wherein a backside of the thinned, substantially flexible moncrystalline semiconductor substrate is polished to reduce vulnerability to fracture as a result of flexing.

18. The stacked circuit structure of claim 11, wherein at least one of the plurality of stacked, thin, substantially flexible circuit layers comprises at least one memory array and another of the stacked, thin, substantially flexible circuit layers comprises a memory controller for controlling the at least one memory array.

19. The stacked circuit structure of claim 18, wherein the at least one memory array comprises a plurality of independently-operable memory arrays, the memory controller being enabled to control the plurality of independently-operable memory arrays independently and simultaneously;

further comprising a plurality of independently-operable vertical interconnect buses, wherein data exchanged between the memory controller and the plurality of independently-operable memory arrays is bussed independently and simultaneously over the plurality of independently-operable vertical interconnect buses.

20. The stacked circuit structure of claim 18, wherein at least one of:

the at least one memory array and memory controller together form a memory, the memory being reconfigurable by operation of the memory controller;

the memory controller or another of the stacked, thin, substantially flexible circuit layers comprises circuitry for performing functional testing of the at least one memory array.

42. The stacked circuit structure of claim 11, further comprising a low-stress silicon-based dielectric layer formed above the thinned, substantially flexible monocrystalline semiconductor substrate and having a stress of less than 5×

10⁸ dynes/cm² tensile, wherein at least one of;

the thinned, substantially flexible monocrystalline semiconductor substrate comprises a plurality of etched through-holes each surrounding a vertical interconnect, each vertical interconnect comprising a conductor and an insulator comprising low-stress silicon-based dielectric material having a stress of less than 5×

10⁸ dynes/cm² tensile surrounding the conductor and isolating the conductor from the thinned, substantially flexible monocrystalline semiconductor substrate; and

a backside of the thinned, substantially flexible monocrystalline semiconductor substrate is polished to reduce vulnerability to fracture as a result of flexing.

43. The stacked circuit structure of claim 18, further comprising a low-stress silicon-based dielectric layer formed above the thinned, substantially flexible monocrystalline semiconductor substrate and having a stress of less than 5×

10⁸ dynes/cm² tensile, wherein at least one of;

the thinned, substantially flexible monocrystalline semiconductor substrate comprises a plurality of etched through-holes each surrounding a vertical interconnect, each vertical interconnect comprising a conductor and an insulator comprising low-stress silicon-based dielectric material having a stress of less than 5×

10⁸ dynes/cm² tensile surrounding the conductor and isolating the conductor from the thinned, substantially flexible monocrystalline semiconductor substrate; and

a backside of the thinned, substantially flexible monocrystalline semiconductor substrate is polished to reduce vulnerability to fracture as a result of flexing.

49. The stacked circuit structure of claim 17, further comprising a low-stress silicon-based dielectric layer having a stress of less than 5×

10⁸ dynes/cm² tensile formed on the polished backside of the of the thinned, substantially flexible monocrystalline semiconductor substrate.

54. The stacked circuit structure of claim 42, further comprising a low-stress silicon-based dielectric layer having a stress of less than 5×

10⁸ dynes/cm² tensile formed on the polished backside of the of the thinned, substantially flexible monocrystalline semiconductor substrate.

55. The stacked circuit structure of claim 43, further comprising a low-stress silicon-based dielectric layer having a stress of less than 5×

10⁸ dynes/cm² tensile formed on the polished backside of the of the thinned, substantially flexible monocrystalline semiconductor substrate.

64. The stacked circuit structure of claim 19, further comprising a low-stress silicon-based dielectric layer formed above the thinned, substantially flexible monocrystalline semiconductor substrate and having a stress of less than 5×

10⁸ dynes/cm² tensile, wherein at least one of;

the thinned, substantially flexible monocrystalline semiconductor substrate comprises a plurality of etched through-holes each surrounding a vertical interconnect, each vertical interconnect comprising a conductor and an insulator comprising low-stress silicon-based dielectric material having a stress of less than 5×

10⁸ dynes/cm² tensile surrounding the conductor and isolating the conductor from the thinned, substantially flexible monocrystalline semiconductor substrate; and

a backside of the thinned, substantially flexible monocrystalline semiconductor substrate is polished to reduce vulnerability to fracture as a result of flexing.

65. The stacked circuit structure of claim 64, further comprising a low-stress silicon-based dielectric layer having a stress of less than 5×

10⁸ dynes/cm² tensile formed on the polished backside of the of the thinned, substantially flexible monocrystalline semiconductor substrate.

66. The stacked circuit structure of claim 20, further comprising a low-stress silicon-based dielectric layer formed above the thinned, substantially flexible monocrystalline semiconductor substrate and having a stress of less than 5×

10⁸ dynes/cm² tensile, wherein at least one of;

the thinned, substantially flexible monocrystalline semiconductor substrate comprises a plurality of etched through-holes each surrounding a vertical interconnect, each vertical interconnect comprising a conductor and an insulator comprising low-stress silicon-based dielectric material having a stress of less than 5×

10⁸ dynes/cm² tensile surrounding the conductor and isolating the conductor from the thinned, substantially flexible monocrystalline semiconductor substrate; and

a backside of the thinned, substantially flexible monocrystalline semiconductor substrate is polished to reduce vulnerability to fracture as a result of flexing.

67. The stacked circuit structure of claim 66, further comprising a low-stress silicon-based dielectric layer having a stress of less than 5×

10⁸ dynes/cm² tensile formed on the polished backside of the of the thinned, substantially flexible monocrystalline semiconductor substrate.

77. The stacked circuit structure of claim 18, wherein at least one of:

the at least one memory array and memory controller together form a memory, the memory being reconfigurable by operation of the memory controller;

the memory controller or another of the stacked, thin, substantially flexible circuit layers comprises circuitry for performing functional testing of the at least one memory array.

81. The stacked circuit structure of claim 18, further comprising a plurality of vertical interconnections passing through at least one of the plurality of stacked, thin, substantially flexible circuit layers and used by the memory controller for controlling the at least one memory array.

85. The stacked circuit structure of claim 11, further comprising a low-stress silicon-based dielectric layer formed above the thinned, substantially flexible monocrystalline semiconductor substrate and having a stress of less than 5×

10⁸ dynes/cm² tensile, wherein;

a backside of the thinned, substantially flexible monocrystalline semiconductor substrate is polished to reduce vulnerability to fracture as a result of flexing; and

at least one of the plurality of stacked, thin, substantially flexible circuit layers has edges that define its size in area; and

the thinned, substantially flexible monocrystalline semiconductor substrate extends in one piece across a substantial portion of the area between the edges.

89. The stacked circuit structure of claim 11, further comprising a low-stress silicon-based dielectric layer formed above the thinned, substantially flexible monocrystalline semiconductor substrate and having a stress of less than 5×

10⁸ dynes/cm² tensile, wherein;

a backside of the thinned, substantially flexible monocrystalline semiconductor substrate is polished to reduce vulnerability to fracture as a result of flexing; and

at least one of the plurality of stacked, thin, substantially flexible circuit layers comprises a singulated die having a die area defined by its perimeter; and

the thinned, substantially flexible monocrystalline semiconductor substrate extends in one piece across a substantial portion of the die area.

93. The stacked circuit structure of claim 11, further comprising a low-stress silicon-based dielectric layer formed above the thinned, substantially flexible monocrystalline semiconductor substrate and having a stress of less than 5×

10⁸ dynes/cm² tensile, wherein;

a backside of the thinned, substantially flexible monocrystalline semiconductor substrate is polished to reduce vulnerability to fracture as a result of flexing; and

at least one of the plurality of stacked, thin, substantially flexible circuit layers is substantially flexible based on the thinned, substantially flexible monocrystalline semiconductor substrate being substantially flexible and the stress of the low stress silicon-based dielectric layer being less than 5×

10⁸ dynes/cm² tensile.

105. The stacked circuit structure of claim 42, wherein:

the plurality of stacked, thin, substantially flexible circuit layers form a stacked integrated circuit memory structure;

a majority of the stacked integrated circuit memory structure is partitioned into a plurality of block stacks, a block stack comprising at least one memory array controller block, a plurality of memory array blocks and an array of vertical interconnects that vertically interconnect the at least one memory array controller block and the plurality of memory array blocks and pass through at least one of the at least one memory array controller block and the plurality of memory array blocks, wherein the at least one memory array controller block comprises circuitry that performs memory accesses with the plurality of memory array blocks;

at least two of the plurality of block stacks can independently and simultaneously perform memory accesses within the stacked integrated circuit memory structure, wherein the array of vertical interconnects of the at least two of the plurality of block stacks can independently and simultaneously transfer data during said memory accesses.

106. The stacked circuit structure of claim 105, wherein at least one block stack of the plurality of the block stacks comprises at least one memory array controller block that performs error correction on read data from at least one of the memory array blocks of said at least one block stack, wherein the read data is transferred through one or more of the array of vertical interconnects of said at least one block stack.

107. The stacked circuit structure of claim 106, wherein the read data includes ECC data used by the circuitry of the at least one memory array controller block to perform error correction on the read data.

108. The stacked circuit structure of claim 105, wherein at least one block stack of the plurality of the block stacks comprises at least one memory array controller block comprising reconfiguration circuitry that performs reconfiguration of the array of vertical interconnects to avoid using one or more defective memory portions of the plurality of memory array blocks.

109. The stacked circuit structure of claim 108, wherein the reconfiguration circuitry substitutes for the one or more defective memory portions of the plurality of memory array blocks one or more redundant memory portions from at least one of the plurality of memory array blocks.

110. The stacked circuit structure of claim 109, wherein the one or more defective memory portions comprise defective gate lines of the plurality of memory array blocks and the one or more redundant memory portions comprise redundant gate lines of the plurality of memory array blocks.

112. The stacked circuit structure of claim 105, wherein at least one

block stack of the plurality of block stacks comprises at least one memory array controller block further comprising refresh circuitry that performs refresh of one or more memory portions of the plurality of memory array blocks, wherein the refresh circuitry performs refresh of the one or more memory portions of the plurality of memory array blocks using one or more of the vertical interconnects of said at least one block stack.

113. The stacked circuit structure of claim 105, wherein at least one

block stack of the plurality of block stacks comprises at least one memory array block controller further comprising test circuitry that performs testing of one or more memory portions of the plurality of memory array blocks, wherein the test circuitry tests the one or more memory portions of the plurality of memory array blocks using one or more of the vertical interconnects of said at least one block stack.

132. The stacked circuit structure of claim 18, wherein at least one of:

the at least one memory array and memory controller together form a memory, the memory being reconfigurable by operation of the memory controller;

the memory controller or one of the plurality of the stacked, thin, substantially flexible circuit layers comprises circuitry for performing functional testing of the memory array.

158. The substantially flexible stacked integrated circuit structure of claim 11, wherein a process technology used to make the at least one of the plurality of thin substantially flexible circuit layers is different than a process technology used to make the at least one of the plurality of thin substantially flexible circuit layers comprising a thinned, substantially flexible monocrystalline semiconductor substrate.

161. The stacked circuit structure of claim 77, further comprising a low-stress silicon-based dielectric layer formed above the thinned, substantially flexible monocrystalline semiconductor substrate and having a stress of less than 5×

10⁸ dynes/cm² tensile, wherein at least one of;

the thinned, substantially flexible monocrystalline semiconductor substrate comprises a plurality of etched through-holes each surrounding a vertical interconnect, each vertical interconnect comprising a conductor and an insulator comprising low-stress silicon-based dielectric material having a stress of less than 5×

10⁸ dynes/cm² tensile surrounding the conductor and isolating the conductor from the thinned, substantially flexible monocrystalline semiconductor substrate; and

a backside of the thinned, substantially flexible monocrystalline semiconductor substrate is polished to reduce vulnerability to fracture as a result of flexing.

162. The stacked circuit structure of claim 161, further comprising a low-stress silicon-based dielectric layer having a stress of less than 5×

10⁸ dynes/cm² tensile formed on the polished backside of the of the thinned, substantially flexible monocrystalline semiconductor substrate.

21. A stacked circuit structure comprising:

a plurality of stacked, thin, substantially flexible circuit layers at least one of which comprises a thinned, substantially flexible monocrystalline semiconductor substrate of one piece;

wherein a pair of adjacent stacked, thin, substantially flexible circuit layers is bonded together at least with metal, or at least with silicon-based dielectric and metal.

22. The stacked circuit structure of claim 21, further comprising an interlayer joining the pair of adjacent stacked, thin, substantially flexible circuit layers, the interlayer comprising signal-carrying metal contacts and non-signal-carrying metal bonding areas.

23. The stacked circuit structure of claim 21, wherein at least one of:

the thinned, substantially flexible monocrystalline semiconductor substrate comprises a plurality of etched through-holes each surrounding a vertical interconnect, each vertical interconnect comprising a conductor and an insulator surrounding the conductor and isolating the conductor from the thinned, substantially flexible monocrystalline semiconductor substrate; and

a backside of the thinned, substantially flexible monocrystalline semiconductor substrate is polished to reduce vulnerability to fracture as a result of flexing.

24. The stacked circuit structure of claim 23, wherein the insulator comprises low-stress silicon-based dielectric material having a stress of less than 5×

10⁸ dynes/cm² tensile.

25. The stacked circuit structure of claim 21, further comprising a low-stress silicon-based dielectric layer formed above the thinned, substantially flexible monocrystalline semiconductor substrate, wherein the low-stress silicon-based dielectric layer exhibits net tensile stress.

26. The stacked circuit structure of claim 25, wherein the low-stress silicon-based dielectric layer has a stress of less than 5×

10⁸ dynes/cm² tensile.

27. The stacked circuit structure of claim 21, wherein a backside of the thinned, substantially flexible monocrystalline semiconductor substrate is polished to reduce vulnerability to fracture as a result of flexing.

28. The stacked circuit structure of claim 21, wherein at least one of the plurality of stacked, thin, substantially flexible circuit layers comprises at least one memory array and another of the stacked, thin, substantially flexible circuit layers comprises a memory controller for controlling the at least one memory array.

29. The stacked circuit structure of claim 28, wherein the at least one memory array comprises a plurality of independently-operable memory arrays, the memory controller being enabled to control the plurality of independently-operable memory arrays independently and simultaneously;

further comprising a plurality of independently-operable vertical interconnect buses, wherein data exchanged between the memory controller and the plurality of independently-operable memory arrays is bussed independently and simultaneously over the plurality of independently-operable vertical interconnect buses.

44. The stacked circuit structure of claim 21, further comprising a low-stress silicon-based dielectric layer formed above the thinned, substantially flexible monocrystalline semiconductor substrate and having a stress of less than 5×

10⁸ dynes/cm² tensile, wherein at least one of;

the thinned, substantially flexible monocrystalline semiconductor substrate comprises a plurality of etched through-holes each surrounding a vertical interconnect, each vertical interconnect comprising a conductor and an insulator comprising low-stress silicon-based dielectric material having a stress of less than 5×

10⁸ dynes/cm² tensile surrounding the conductor and isolating the conductor from the thinned, substantially flexible monocrystalline semiconductor substrate; and

a backside of the thinned, substantially flexible monocrystalline semiconductor substrate is polished to reduce vulnerability to fracture as a result of flexing.

45. The stacked circuit structure of claim 28, further comprising a low-stress silicon-based dielectric layer formed above the thinned, substantially flexible monocrystalline semiconductor substrate and having a stress of less than 5×

10⁸ dynes/cm² tensile, wherein at least one of;

the thinned, substantially flexible monocrystalline semiconductor substrate comprises a plurality of etched through-holes each surrounding a vertical interconnect, each vertical interconnect comprising a conductor and an insulator comprising low-stress silicon-based dielectric material having a stress of less than 5×

10⁸ dynes/cm² tensile surrounding the conductor and isolating the conductor from the thinned, substantially flexible monocrystalline semiconductor substrate; and

a backside of the thinned, substantially flexible monocrystalline semiconductor substrate is polished to reduce vulnerability to fracture as a result of flexing.

50. The stacked circuit structure of claim 27, further comprising a low-stress silicon-based dielectric layer having a stress of less than 5×

10⁸ dynes/cm² tensile formed on the polished backside of the of the thinned, substantially flexible monocrystalline semiconductor substrate.

56. The stacked circuit structure of claim 44, further comprising a low-stress silicon-based dielectric layer having a stress of less than 5×

10⁸ dynes/cm² tensile formed on the polished backside of the of the thinned, substantially flexible monocrystalline semiconductor substrate.

57. The stacked circuit structure of claim 44, further comprising a low-stress silicon-based dielectric layer having a stress of less than 5×

10⁸ dynes/cm² tensile formed on the polished backside of the of the thinned, substantially flexible monocrystalline semiconductor substrate.

68. The stacked circuit structure of claim 29, further comprising a low-stress silicon-based dielectric layer formed above the thinned, substantially flexible monocrystalline semiconductor substrate and having a stress of less than 5×

10⁸ dynes/cm² tensile, wherein at least one of;

the thinned, substantially flexible monocrystalline semiconductor substrate comprises a plurality of etched through-holes each surrounding a vertical interconnect, each vertical interconnect comprising a conductor and an insulator comprising low-stress silicon-based dielectric material having a stress of less than 5×

10⁸ dynes/cm² tensile surrounding the conductor and isolating the conductor from the thinned, substantially flexible monocrystalline semiconductor substrate; and

a backside of the thinned, substantially flexible monocrystalline semiconductor substrate is polished to reduce vulnerability to fracture as a result of flexing.

69. The stacked circuit structure of claim 68, further comprising a low-stress silicon-based dielectric layer having a stress of less than 5×

10⁸ dynes/cm² tensile formed on the polished backside of the of the thinned, substantially flexible monocrystalline semiconductor substrate.

79. The stacked circuit structure of claim 28, wherein at least one of:

the at least one memory array and memory controller together form a memory, the memory being reconfigurable by operation of the memory controller;

the memory controller or one of the plurality of the stacked, thin, substantially flexible circuit layers comprises circuitry for performing functional testing of the at least one memory array.

82. The stacked circuit structure of claim 28, further comprising a plurality of vertical interconnections passing through at least one of the plurality of stacked, thin, substantially flexible circuit layers and used by the memory controller for controlling the at least one memory array.

86. The stacked circuit structure of claim 21, further comprising a low-stress silicon-based dielectric layer formed above the thinned, substantially flexible monocrystalline semiconductor substrate and having a stress of less than 5×

10⁸ dynes/cm² tensile, wherein;

a backside of the thinned, substantially flexible monocrystalline semiconductor substrate is polished to reduce vulnerability to fracture as a result of flexing; and

at least one of the plurality of stacked, thin, substantially flexible circuit layers has edges that define its size in area; and

the thinned, substantially flexible monocrystalline semiconductor substrate extends in one piece across a substantial portion of the area between the edges.

90. The stacked circuit structure of claim 21, further comprising a low-stress silicon-based dielectric layer formed above the thinned, substantially flexible monocrystalline semiconductor substrate and having a stress of less than 5×

10⁸ dynes/cm² tensile, wherein;

a backside of the thinned, substantially flexible monocrystalline semiconductor substrate is polished to reduce vulnerability to fracture as a result of flexing; and

at least one of the plurality of stacked, thin, substantially flexible circuit layers comprises a singulated die having a die area defined by its perimeter; and

the thinned, substantially flexible monocrystalline semiconductor substrate extends in one piece across a substantial portion of the die area.

94. The stacked circuit structure of claim 21, further comprising a low-stress silicon-based dielectric layer formed above the thinned, substantially flexible monocrystalline semiconductor substrate and having a stress of less than 5×

10⁸ dynes/cm² tensile, wherein;

a backside of the thinned, substantially flexible monocrystalline semiconductor substrate is polished to reduce vulnerability to fracture as a result of flexing; and

at least one of the plurality of stacked, thin, substantially flexible circuit layers is substantially flexible based on the thinned, substantially flexible monocrystalline semiconductor substrate being substantially flexible and the stress of the low stress silicon-based dielectric layer being less than 5×

10⁸ dynes/cm² tensile.

114. The stacked circuit structure of claim 44, wherein:

the plurality of stacked, thin, substantially flexible circuit layers form a stacked integrated circuit memory structure;

a majority of the stacked integrated circuit memory structure is partitioned into a plurality of block stacks, a block stack comprising at least one memory array controller block, a plurality of memory array blocks and an array of vertical interconnects that vertically interconnect the at least one memory array controller block and the plurality of memory array blocks and pass through at least one of the at least one memory array controller block and the plurality of memory array blocks, wherein the at least one memory array controller block comprises circuitry that performs memory accesses with the plurality of memory array blocks;

at least two of the plurality of block stacks can independently and simultaneously perform memory accesses within the stacked integrated circuit memory structure, wherein the array of vertical interconnects of the at least two of the plurality of block stacks can independently and simultaneously transfer data during said memory accesses.

115. The stacked circuit structure of claim 114, wherein at least one block stack of the plurality of the block stacks comprises at least one memory array controller block comprising circuitry that performs error correction on read data from at least one of the memory array blocks of said at least one block stack, wherein the read data is transferred through one or more of the array of vertical interconnects of said at least one block stack.

116. The stacked circuit structure of claim 115, wherein the read data includes ECC data used by the circuitry of the at least one memory array controller block to perform error correction on the read data.

117. The stacked circuit structure of claim 114, wherein at least one block stack of the plurality of the block stacks comprises at least one memory array controller block comprising reconfiguration circuitry that performs reconfiguration of the array of vertical interconnects to avoid using one or more defective memory portions of the plurality of memory array blocks.

118. The stacked circuit structure of claim 117, wherein the reconfiguration circuitry substitutes for the one or more defective memory portions of the plurality of memory array blocks one or more redundant memory portions from at least one of the plurality of memory array blocks.

119. The stacked circuit structure of claim 118, wherein the one or more defective memory portions comprise defective gate lines of the plurality of memory array blocks and the one or more redundant memory portions comprise redundant gate lines of the plurality of memory array blocks.

120. The stacked circuit structure of claim 114, wherein at least one block stack of the plurality of block stacks comprises at least one memory array controller block further comprising reconfiguration circuitry that performs reconfiguration of the array of vertical interconnects to avoid using one or more defective vertical interconnects of the said at least one block stack.

121. The stacked circuit structure of claim 114, wherein at least one

block stack of the plurality of block stacks comprises at least one memory array controller block further comprising refresh circuitry that performs refresh of one or more memory portions of the plurality of memory array blocks, wherein the refresh circuitry performs refresh the one or more memory portions of the plurality of memory array blocks using one or more of the vertical interconnects of said at least one block stack.

122. The stacked circuit structure of claim 114, wherein at least one

block stack of the plurality of block stacks comprises at least one memory array block controller further comprising test circuitry that performs tests testing of one or more memory portions of the plurality of memory array blocks, wherein the test circuitry tests the one or more memory portions of the plurality of memory array blocks using one or more of the vertical interconnects of said at least one block stack.

133. The stacked circuit structure of claim 28, wherein at least one of:

the at least one memory array and memory controller together form a memory, the memory being reconfigurable by operation of the memory controller;

the memory controller or one of the plurality of the stacked, thin, substantially flexible circuit layers comprises circuitry for performing functional testing of the at least one memory array.

159. The substantially flexible stacked integrated circuit structure of claim 21, wherein a process technology used to make the at least one of the plurality of thin substantially flexible circuit layers is different than a process technology used to make the at least one of the plurality of thin substantially flexible circuit layers comprising a thinned, substantially flexible monocrystalline semiconductor substrate.

30. A stacked circuit structure comprising:

a plurality of stacked, thin, substantially flexible circuit layers at least one of which comprises a thinned, substantially flexible monocrystalline semiconductor substrate of one piece;

wherein at least one of the substantially flexible circuit layers comprises at least one memory array comprising memory cells and a low stress silicon-based dielectric material; and

at least one vertical interconnection that passes through at least one of the plurality of stacked, thin, substantially flexible circuit layers.

31. The stacked circuit structure of claim 30, comprising an interlayer joining a pair of vertically adjacent circuit layers, the interlayer comprising both signal-carrying metal contacts and non-signal-carrying metal bonding areas.

32. The stacked circuit structure of claim 30, wherein at least one of:

the thinned, substantially flexible monocrystalline semiconductor substrate comprises a plurality of etched through-holes each surrounding a vertical interconnect, each vertical interconnect comprising a conductor and an insulator surrounding the conductor and isolating the conductor from the thinned, substantially flexible monocrystalline semiconductor substrate; and

a backside of the thinned, substantially flexible monocrystalline semiconductor substrate is polished to reduce vulnerability to fracture as a result of flexing.

33. The stacked circuit structure of claim 32, wherein the insulator comprises low-stress silicon-based dielectric material having a stress of less than 5×

10⁸ dynes/cm² tensile.

34. The stacked circuit structure of claim 30, wherein the low-stress silicon-based dielectric material comprises a low-stress silicon-based dielectric layer formed above the thinned, substantially flexible monocrystalline semiconductor substrate, wherein the low-stress silicon-based dielectric layer exhibits net tensile stress.

35. The stacked circuit structure of claim 34, wherein the low-stress silicon-based dielectric layer has a stress of less than 5×

10⁸ dynes/cm² tensile.

36. The stacked circuit structure of claim 30, wherein a backside of the thinned, substantially flexible monocrystalline semiconductor substrate is polished to reduce vulnerability to fracture as a result of flexing.

37. The stacked circuit structure of claim 30, wherein another of the stacked, thin, substantially flexible circuit layers comprises a memory controller for controlling the at least one memory array.

38. The stacked circuit structure of claim 37, wherein the at least one memory array comprises a plurality of independently-operable memory arrays, the memory controller being enabled to control the plurality of independently-operable memory arrays independently and simultaneously;

further comprising a plurality of independently-operable vertical interconnect buses, wherein data exchanged between the memory controller and the plurality of independently-operable memory arrays is bussed independently and simultaneously over the plurality of independently-operable vertical interconnect buses.

39. The stacked circuit structure of claim 37, wherein at least one of:

the at least one memory array and memory controller together form a memory, the memory being reconfigurable by operation of the memory controller;

the memory controller or another of the stacked, thinned, substantially flexible circuit layers comprises circuitry for performing functional testing of the at least one memory array.

46. The stacked circuit structure of claim 30, wherein:

the low-stress silicon-based dielectric material of the at least one substantially flexible circuit layers comprises a low-stress silicon-based dielectric layer formed above the thinned, substantially flexible monocrystalline semiconductor substrate and having a stress of less than 5×

10⁸ dynes/cm² tensile;

wherein at least one of;

the thinned, substantially flexible monocrystalline semiconductor substrate comprises a plurality of etched through-holes each surrounding a vertical interconnect, each vertical interconnect comprising a conductor and an insulator comprising low-stress silicon-based dielectric material having a stress of less than 5×

10⁸ dynes/cm² tensile surrounding the conductor and isolating the conductor from the thinned, substantially flexible monocrystalline semiconductor substrate; and

a backside of the thinned, substantially flexible monocrystalline semiconductor substrate is polished to reduce vulnerability to fracture as a result of flexing.

47. The stacked circuit structure of claim 37, wherein:

the low-stress silicon-based dielectric material of the at least one of the substantially flexible circuit layers comprises a low-stress silicon-based dielectric layer formed above the thinned, substantially flexible monocrystalline semiconductor substrate and having a stress of less than 5×

10⁸ dynes/cm² tensile;

wherein at least one of;

the thinned, substantially flexible monocrystalline semiconductor substrate comprises a plurality of etched through-holes each surrounding a vertical interconnect, each vertical interconnect comprising a conductor and an insulator comprising low-stress silicon-based dielectric material having a stress of less than 5×

10⁸ dynes/cm² tensile surrounding the conductor and isolating the conductor from the thinned, substantially flexible monocrystalline semiconductor substrate; and

a backside of the thinned, substantially flexible monocrystalline semiconductor substrate is polished to reduce vulnerability to fracture as a result of flexing.

51. The stacked circuit structure of claim 37, further comprising a low-stress silicon-based dielectric layer having a stress of less than 5×

10⁸ dynes/cm² tensile formed on the polished backside of the of the thinned, substantially flexible monocrystalline semiconductor substrate.

58. The stacked circuit structure of claim 46, further comprising a low-stress silicon-based dielectric layer having a stress of less than 5×

10⁸ dynes/cm² tensile formed on the polished backside of the of the thinned, substantially flexible monocrystalline semiconductor substrate.

59. The stacked circuit structure of claim 47, further comprising a low-stress silicon-based dielectric layer having a stress of less than 5×

10⁸ dynes/cm² tensile formed on the polished backside of the of the thinned, substantially flexible monocrystalline semiconductor substrate.

70. The stacked circuit structure of claim 38, wherein:

the low-stress silicon-based dielectric material of the at least one of the substantially flexible circuit layers comprises a low-stress silicon-based dielectric layer formed above the thinned, substantially flexible monocrystalline semiconductor substrate and having a stress of less than 5×

10⁸ dynes/cm² tensile;

wherein at least one of;

the thinned, substantially flexible monocrystalline semiconductor substrate comprises a plurality of etched through-holes each surrounding a vertical interconnect, each vertical interconnect comprising a conductor and an insulator comprising low-stress silicon-based dielectric material having a stress of less than 5×

10⁸ dynes/cm² tensile surrounding the conductor and isolating the conductor from the thinned, substantially flexible monocrystalline semiconductor substrate; and

a backside of the thinned, substantially flexible monocrystalline semiconductor substrate is polished to reduce vulnerability to fracture as a result of flexing.

71. The stacked circuit structure of claim 70, further comprising a low-stress silicon-based dielectric layer having a stress of less than 5×

10⁸ dynes/cm² tensile formed on the polished backside of the of the thinned, substantially flexible monocrystalline semiconductor substrate.

72. The stacked circuit structure of claim 39, wherein:

the low-stress silicon-based dielectric material of the at least one of the substantially flexible circuit layers comprises a low-stress silicon-based dielectric layer formed above the thinned, substantially flexible monocrystalline semiconductor substrate and having a stress of less than 5×

10⁸ dynes/cm² tensile;

wherein at least one of;

the thinned, substantially flexible monocrystalline semiconductor substrate comprises a plurality of etched through-holes each surrounding a vertical interconnect, each vertical interconnect comprising a conductor and an insulator comprising low-stress silicon-based dielectric material having a stress of less than 5×

10⁸ dynes/cm² tensile surrounding the conductor and isolating the conductor from the thinned, substantially flexible monocrystalline semiconductor substrate; and

a backside of the thinned, substantially flexible monocrystalline semiconductor substrate is polished to reduce vulnerability to fracture as a result of flexing.

73. The stacked circuit structure of claim 72, further comprising a low-stress silicon-based dielectric layer having a stress of less than 5×

10⁸ dynes/cm² tensile formed on the polished backside of the of the thinned, substantially flexible monocrystalline semiconductor substrate.

74. The stacked circuit structure of claim 30, wherein the at least one vertical interconnection vertically interconnects each of a plurality of the memory cells.

75. The stacked circuit structure of claim 35, wherein the at least one vertical interconnection vertically interconnects each of a plurality of the memory cells.

76. The stacked circuit structure of claim 37, wherein the at least one vertical interconnection vertically interconnects each of a plurality of the memory cells.

78. The stacked circuit structure of claim 30, comprising an interlayer joining a pair of vertically adjacent stacked, thin, substantially flexible circuit layers, the interlayer comprising both signal-carrying metal contacts and non-signal-carrying metal bonding areas.

83. The stacked circuit structure of claim 37, further comprising a plurality of vertical interconnections passing through at least one of the plurality of stacked, thin, substantially flexible circuit layers and used by the memory controller for controlling the at least one memory array.

87. The stacked circuit structure of claim 30, wherein:

the low-stress silicon-based dielectric material of the at least one of the substantially flexible circuit layers comprises a low-stress silicon-based dielectric layer formed above the thinned, substantially flexible monocrystalline semiconductor substrate and having a stress of less than 5×

10⁸ dynes/cm² tensile; and

at least one of the plurality of stacked, thin, substantially flexible circuit layers has edges that define its size in area; and

the thinned, substantially flexible monocrystalline semiconductor substrate extends in one piece across a substantial portion of the area between the edges.the thinned, substantially flexible monocrystalline semiconductor substrate extends in one piece across a substantial portion of the area between the edges; and

wherein at least one of;

the thinned, substantially flexible monocrystalline semiconductor substrate comprises a plurality of etched through-holes each surrounding a vertical interconnect, each vertical interconnect comprising a conductor and an insulator surrounding the conductor and isolating the conductor from the thinned, substantially flexible monocrystalline semiconductor substrate, the insulator comprising low-stress silicon-based dielectric material having a stress of less than 5×

10⁸ dynes/cm² tensile; and

a backside of the thinned, substantially flexible monocrystalline semiconductor substrate is polished to reduce vulnerability to fracture as a result of flexing.

91. The stacked circuit structure of claim 30, wherein:

the low-stress silicon-based dielectric material of the at least one of the substantially flexible circuit layers comprises a low-stress silicon-based dielectric layer formed above the thinned, substantially flexible monocrystalline semiconductor substrate and having a stress of less than 5×

10⁸ dynes/cm² tensile; and

at least one of the plurality of stacked, thin, substantially flexible circuit layers comprises a singulated die having a die area defined by its perimeter; and

the thinned, substantially flexible monocrystalline semiconductor substrate extends in one piece across a substantial portion of the die area; and

wherein at least one of;

the thinned, substantially flexible monocrystalline semiconductor substrate comprises a plurality of etched through-holes each surrounding a vertical interconnect, each vertical interconnect comprising a conductor and an insulator surrounding the conductor and isolating the conductor from the thinned, substantially flexible monocrystalline semiconductor substrate, the insulator comprising low-stress silicon-based dielectric material having a stress of less than 5×

10⁸ dynes/cm² tensile; and

a backside of the thinned, substantially flexible monocrystalline semiconductor substrate is polished to reduce vulnerability to fracture as a result of flexing.

95. The stacked circuit structure of claim 30, wherein:

the low-stress silicon-based dielectric material of the at least one of the substantially flexible circuit layers comprises a low-stress silicon-based dielectric layer formed above the thinned, substantially flexible monocrystalline semiconductor substrate and having a stress of less than 5×

10⁸ dynes/cm² tensile; and

at least one of the plurality of stacked, thin, substantially flexible circuit layers is substantially flexible based on the thinned, substantially flexible monocrystalline semiconductor substrate being substantially flexible and the stress of the low stress silicon-based dielectric layer being less than 5×

10⁸ dynes/cm² tensile;

wherein at least one of;

the thinned, substantially flexible monocrystalline semiconductor substrate comprises a plurality of etched through-holes each surrounding a vertical interconnect, each vertical interconnect comprising a conductor and an insulator surrounding the conductor and isolating the conductor from the thinned, substantially flexible monocrystalline semiconductor substrate, the insulator comprising low-stress silicon-based dielectric material having a stress of less than 5×

10⁸ dynes/cm² tensile;

a backside of the thinned, substantially flexible monocrystalline semiconductor substrate is polished to reduce vulnerability to fracture as a result of flexing.

123. The stacked circuit structure of claim 46, wherein:

the plurality of stacked, thin, substantially flexible circuit layers form a stacked integrated circuit memory structure;

a majority of the stacked integrated circuit memory structure is partitioned into a plurality of block stacks, a block stack comprising at least one memory array controller block, a plurality of memory array blocks and an array of vertical interconnects that vertically interconnect the at least one memory array controller block and the plurality of memory array blocks and pass through at least one of the at least one memory array controller block and the plurality of memory array blocks;

the plurality of memory array blocks comprises at least one memory array comprising memory cells;

the at least one memory array controller block comprises circuitry for performing memory accesses with the plurality of memory array blocks;

at least two of the plurality of block stacks can independently and simultaneously perform memory accesses within the stacked integrated circuit memory structure, wherein the array of vertical interconnects of the at least two of the plurality of block stacks can independently and simultaneously transfer data during said memory accesses.

124. The stacked circuit structure of claim 123, wherein at least one block stack of the plurality of the block stacks comprises at least one memory array controller block comprising circuitry that performs error correction on read data from at least one of the memory array blocks of said at least one block stack, wherein the read data is transferred through one or more of the array of vertical interconnects of said at least one block stack.

125. The stacked circuit structure of claim 124, wherein the read data includes ECC data used by the circuitry of the at least one memory array controller block to perform error correction on the read data.

126. The stacked circuit structure of claim 123, wherein at least one block stack of the plurality of the block stacks comprises at least one memory array controller block comprising reconfiguration circuitry that performs reconfiguration of the array of vertical interconnects to avoid using one or more defective memory portions of the plurality of memory array blocks.

127. The stacked circuit structure of claim 126, wherein the reconfiguration circuitry substitutes for the one or more defective memory portions of the plurality of memory array blocks one or more redundant memory portions from at least one of the plurality of memory array blocks.

128. The stacked circuit structure of claim 127, wherein the one or more defective memory portions comprise defective gate lines of the plurality of memory array blocks and the one or more redundant memory portions comprise redundant gate lines of the plurality of memory array blocks.

129. The stacked circuit structure of claim 123, wherein at least one block stack of the plurality of block stacks comprises at least one memory array controller block further comprising reconfiguration circuitry that performs reconfiguration of the array of vertical interconnects to avoid using one or more defective vertical interconnects of the said at least one block stack.

130. The stacked circuit structure of claim 123, wherein at least one

block stack of the plurality of block stacks comprises at least one memory array controller block further comprising refresh circuitry that performs refresh of one or more memory portions of the plurality of memory array blocks, wherein the refresh circuitry performs refresh of the one or more memory portions of the plurality of memory array blocks using one or more of the vertical interconnects of said at least one block stack.

131. The stacked circuit structure of claim 123, wherein at least one

block stack of the plurality of block stacks comprises at least one memory array block controller further comprising test circuitry that performs testing of one or more memory portions of the plurality of memory array blocks, wherein the test circuitry tests the one or more memory portions of the plurality of memory array blocks using one or more of the vertical interconnects of said at least one block stack.

134. The stacked circuit structure of claim 38, wherein at least one of:

the at least one memory array and memory controller together form a memory, the memory being reconfigurable by operation of the memory controller;

the memory controller or one of the plurality of the stacked, thin, substantially flexible circuit layers comprises circuitry for performing functional testing of the memory array.

160. The substantially flexible stacked integrated circuit structure of claim 30, wherein a process technology used to make the at least one of the plurality of thin substantially flexible circuit layers is different than a process technology used to make the at least one of the plurality of thin substantially flexible circuit layers comprising a thinned, substantially flexible monocrystalline semiconductor substrate.

111. The stacked circuit structure of 105, wherein at least one block stack of the plurality of block stacks comprises at least one memory array controller block further comprising reconfiguration circuitry that performs reconfiguration of the array of vertical interconnects to avoid using one or more defective vertical interconnects of the at least one block stack.

135. A stacked integrated circuit structure comprising:

at least one thin, substantially flexible integrated circuit layer comprising at least a thinned, substantially flexible monocrystalline semiconductor substrate of one piece having a backside;

at least one low-stress silicon-based dielectric layer formed above the thinned, substantially flexible monocrystalline semiconductor substrate, wherein the low-stress silicon-based dielectric layer has a stress of less than 5×

10⁸ dynes/cm² tensile; and

a plurality of memory circuit layers each memory circuit layer comprising at least one silicon-based low stress dielectric layer and at least one conductive layer, wherein the at least one low-stress silicon-based dielectric layer has a stress of less than 5×

10⁸ dynes/cm² tensile.

136. The stacked integrated circuit structure of claim 135,

wherein the backside of the thinned, substantially flexible moncrystalline semiconductor substrate is polished or smooth to form a polished or smoothed backside, wherein the polished or smoothed backside enables the thinned, substantially flexible monocrystalline semiconductor substrate to be substantially flexible, and the polished or smoothed backside reduces the vulnerability of the thinned, substantially flexible monocrystalline semiconductor substrate to fracture as a result of flexing.

137. The stacked integrated circuit structure of claim 136, wherein the stacked integrated circuit structure is flexible through a combination of the thinned, substantially flexible monocrystalline semiconductor substrate having a polished or smoothed backside, low stress of the at least one low stress silicon-based dielectric layer, and low stress stress of the at least one silicon-based low stress dielectric layer of the plurality of memory circuit layers.

138. The stacked integrated circuit structure of claim 136, further comprising a plurality of interconnect conductors extending vertically through at least one of the plurality of memory circuit layers;

and, low stress dielectric insulators insulating the interconnect conductors from the at least one conductive layer, wherein the low-stress dielectric insulators comprise silicon-based dielectric with a stress of less than 5×

10⁸ dynes/cm² tensile.

139. The stacked integrated circuit structure of claim 138, wherein the plurality of interconnect conductors comprise polysilicon.

140. The stacked integrated circuit structure of claim 136, wherein at least one of:

the plurality of memory circuit layers and at least one integrated circuit layer together form a memory, the memory being reconfigurable by operation of the at least one integrated circuit layer;

the at least one integrated circuit layer further comprises circuitry for performing functional testing of at least one of the plurality of memory circuit layers;

a process technology used to make the at least one integrated circuit layer is different from a process technology used to make the plurality of memory circuit layers.

141. The stacked integrated circuit structure of claim 138, wherein at least one of:

the plurality of memory circuit layers and at least one integrated circuit layer together form a memory, the memory being reconfigurable by operation of the memory controller circuit layer;

the at least one integrated circuit layer further comprising circuitry for performing functional testing of one or more memory portions of the plurality of memory circuit layers, wherein the test circuitry performs tests of the one or more memory portions of the plurality of memory circuit layers using one or more of the interconnect conductors;

a process technology used to make the at least one integrated circuit layer is different from a process technology used to make the plurality of memory circuit layers.

142. The stacked integrated circuit structure of claim 141, wherein the stacked integrated circuit structure is flexible through a combination of the thinned, substantially flexible monocrystalline semiconductor substrate having a polished or smoothed backside, low stress of the at least one low stress silicon-based dielectric layer, and low stress of the at least one silicon-based low stress dielectric layer of the plurality of memory circuit layers.

143. The stacked integrated circuit structure of claim 136, further comprising a low-sress silicon-based dielectric layer having a stress of less than 5×

10⁸ dynes/cm² tensile formed on the polished or smoothed backside of the of the thinned, substantially flexible monocrystalline semiconductor substrate.

144. The stacked integrated circuit structure of claim 138, further comprising a low-sress silicon-based dielectric layer having a stress of less than 5×

10⁸ dynes/cm² tensile formed on the polished or smoothed backside of the of the thinned, substantially flexible monocrystalline semiconductor substrate.

145. The stacked integrated circuit structure of claim 140, further comprising a low-sress silicon-based dielectric layer having a stress of less than 5×

10⁸ dynes/cm² tensile formed on the polished or smoothed backside of the of the thinned, substantially flexible monocrystalline semiconductor substrate.

146. The stacked integrated circuit structure of claim 142, further comprising a low-sress silicon-based dielectric layer having a stress of less than 5×

10⁸ dynes/cm² tensile formed on the polished or smoothed backside of the of the thinned, substantially flexible monocrystalline semiconductor substrate.

147. A substantially flexible stacked integrated circuit structure comprising:

at least one thin, substantially flexible integrated circuit layer comprising a thinned, substantially flexible monocrystalline semiconductor substrate of one piece having a backside, wherein the backside of the thinned, substantially flexible monocrystalline semiconductor substrate is polished or smoothed, wherein the polished or smoothed backside enables the thinned, monocrystalline semiconductor substrate to be substantially flexible, and the polished or smoothed backside reduces the vulnerability of the thinned, substantially flexible monocrystalline semiconductor substrate to fracture as a result of flexing;

at least one low-stress silicon-based dielectric layer formed above the thinned, substantially flexible monocrystalline semiconductor substrate, wherein the at least one low-stress silicon-based dielectric layer has a stress of less than 5×

10⁸ dynes/cm² tensile; and

a plurality of memory circuit layers, wherein each memory circuit layer comprises at least one silicon-based low stress dielectric layer and at least one conductive layer, wherein the at least one low-stress silicon-based dielectric layer has a stress of less than 5×

10⁸ dynes/cm² tensile;

wherein the substantially flexible stacked integrated circuit structure is substantially flexible through combination of the thinned, substantially flexible monocrystalline semiconductor substrate having a polished or smoothed backside, low stress of the at least one low stress silicon-based dielectric layer, and low stress of the at least one silicon-based low stress dielectric layer of the plurality of memory circuit layers.

148. The substantially flexible stacked integrated circuit structure of claim 147, further comprising a plurality of interconnect conductors extending vertically through at least one of the plurality of memory circuit layers;

and, low stress dielectric insulators insulating the interconnect conductors, wherein the low-stress dielectric insulators are silicon-based dielectric with a stress of less than 5×

10⁸ dynes/cm² tensile.

149. The stacked integrated circuit structure of claim 148, wherein the plurality of interconnect conductors comprise polysilicon.

150. The substantially flexible stacked integrated circuit structure of claim 148, wherein at least one of:

the plurality of memory circuit layers and at least one integrated circuit layer together form a memory, the memory being reconfigurable by operation of the memory controller circuit layer;

the at least one integrated circuit layer further comprises circuitry for performing functional testing of one or more memory portions of the plurality of memory circuit layers, wherein the test circuitry performs tests of the one or more memory portions of the plurality of memory circuit layers using one or more of the interconnect conductors.

151. The substantially flexible stacked integrated circuit structure of claim 147, further comprising a low-stress silicon-based dielectric layer having a stress of less than 5×

10⁸ dynes/cm² tensile formed on the polished or smoothed backside of the of the thinned, substantially flexible monocrystalline semiconductor substrate.

152. The substantially flexible stacked integrated circuit structure of claim 148, further comprising a low-stress silicon-based dielectric layer having a stress of less than 5×

10⁸ dynes/cm² tensile formed on the polished or smoothed backside of the of the thinned, substantially flexible monocrystalline semiconductor substrate.

153. The substantially flexible stacked integrated circuit structure of claim 150, further comprising a low-stress silicon-based dielectric layer having a stress of less than 5×

10⁸ dynes/cm² tensile formed on the polished or smoothed backside of the of the thinned, substantially flexible monocrystalline semiconductor substrate.

154. The substantially flexible stacked integrated circuit structure of claim 147, wherein a process technology used to make the at least one integrated circuit layer is different from a process technology used to make the plurality of memory circuit layers.

155. The substantially flexible stacked integrated circuit structure of claim 148, wherein a process technology used to make the at least one integrated circuit layer is different from a process technology used to make the plurality of memory circuit layers.

156. The substantially flexible stacked integrated circuit structure of claim 150, wherein a process technology used to make the at least one integrated circuit layer is different from a process technology used to make the plurality of memory circuit layers.