Sub-10 NM line features via rapid graphoepitaxial self-assembly of amphiphilic monolayers

• US 8,801,894 B2
• Filed: 03/12/2010
• Issued: 08/12/2014
• Est. Priority Date: 03/22/2007
• Status: Active Grant

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Millward, Dan B.
• Primary Examiner(s): CHEN, KEATH T
• Application Number:
  US12/723,176
• Publication Number:
  US 20100163180A1
• Time in Patent Office: 1,614 Days
• Field of Search: 156/345.3, 428/98, 428/116, 428/119, 977/700
• US Class Current: 156/345.3
• CPC Class Codes: B05D 3/007 After-treatment
• CPC Class Codes: B81C 1/00031 Regular or irregular arrays of nanoscale structures, e.g. etch mask layer photomechanical, e.g. photolithographic, production of textured or patterned surfaces G03F7/00; lithographic processes for making patterned surfaces using printing and stamping G03F7/0002
• CPC Class Codes: B81C 2201/0149 Forming nanoscale microstructures using auto-arranging or self-assembling material
• CPC Class Codes: B81C 2201/0198 for making a masking layer
• CPC Class Codes: B82Y 30/00 Nanotechnology for materials or surface science, e.g. nanocomposites
• CPC Class Codes: H01L 21/02002 Preparing wafers
• CPC Class Codes: H01L 21/3086 characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
• CPC Class Codes: H01L 21/31144 using masks
• CPC Class Codes: Y10T 428/24 Structurally defined web or sheet [e.g., overall dimension, etc.]
• CPC Class Codes: Y10T 428/24149 Honeycomb-like
• CPC Class Codes: Y10T 428/24174 including sheet or component perpendicular to plane of web or sheet
• CPC Class Codes: Y10T 428/24521 with component conforming to contour of nonplanar surface
• CPC Class Codes: Y10T 428/2457 Parallel ribs and/or grooves
• CPC Class Codes: Y10T 428/24612 Composite web or sheet
• CPC Class Codes: Y10T 428/24802 Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]

Abstract

Methods for fabricating sub-lithographic, nanoscale microchannels utilizing an aqueous emulsion of an amphiphilic agent and a water-soluble, hydrogel-forming polymer, and films and devices formed from these methods are provided.

Claims

1. A template for etching a substrate, comprising:

a cross-linked hydrogel within a trench in a material on the substrate, the cross-linked hydrogel formed from a water-soluble polymer and spaced from sidewalls of the trench by an elongate gap exposing the substrate at a floor of the trench.

2. The template of claim 1, wherein the elongate gap is up to about 10 nm wide.

3. The template of claim 1, wherein the elongate gap is about 3-10 nm wide.

4. The template of claim 1, wherein the cross-linked hydrogel is spaced from ends of the trench by another gap exposing the substrate at the floor of the trench.

5. The template of claim 1, wherein the floor of the trench comprises a hydrophilic material.

6. The template of claim 5, wherein the hydrophilic material comprises an oxide material.

7. The template of claim 1, wherein ends of the trench comprise a hydrophilic material.

8. The template of claim 1, wherein the sidewalls of the trench comprise a hydrophobic material.

9. The template of claim 8, wherein the hydrophobic material is selected from the group consisting of silicon and amorphous carbon.

10. The template of claim 8, wherein the hydrophobic material comprises transparent carbon.

11. The template of claim 1, wherein ends of the trench comprise a hydrophobic material.

12. The template of claim 11, wherein the hydrophobic material comprises hydrogen-terminated silicon.

13. The template of claim 1, wherein the floor of the trench comprises a hydrophilic polymer.

14. The template of claim 1, wherein the substrate comprises an oxide.

15. The template of claim 1, wherein the material comprises silicon or amorphous carbon.

16. The template of claim 1, wherein the water-soluble polymer is selected from the group consisting of poly(ethylene oxide), poly(ethylene glycol), poly(vinyl alcohol), and poly(saccharide).

17. The template of claim 1, wherein the cross-linked hydrogel comprises a hardening agent.

18. A template for etching a substrate, comprising:

a cross-linked hydrogel situated within a trench in a material on the substrate, the cross-linked hydrogel formed from a water-soluble polymer, the trench having hydrophobic sidewalls and a hydrophilic floor, the cross-linked hydrogel spaced from the hydrophobic sidewalls of the trench by an elongate gap exposing the substrate at the hydrophilic floor of the trench.

19. The template of claim 18, wherein ends of the trench comprise a hydrophilic surface.

20. The template of claim 18, wherein ends of the trench comprise a hydrophobic surface, the cross-linked hydrogel spaced from the ends of the trench by another gap exposing the substrate at the hydrophilic floor of the trench.

21. A template for etching an oxide substrate, comprising:

a cross-linked hydrogel within a trench in a silicon material on the oxide substrate, the cross-linked hydrogel formed from a water-soluble polymer, the trench having hydrophobic sidewalls and a hydrophilic floor, the cross-linked hydrogel spaced from the hydrophobic sidewalls of the trench by an elongate gap exposing the oxide substrate at the hydrophilic floor of the trench.

22. A template for etching a substrate, comprising:

a cross-linked hydrogel within a trench in a material on the substrate, the cross-linked hydrogel derived from a water-soluble polymer, the cross-linked hydrogel and sidewalls of the trench defining therebetween a pair of linear channels adjacent the sidewalls and extending a length of the trench, the substrate at a floor of the trench exposed in the pair of linear channels, each of the linear channels of the pair of linear channels being up to about 10 nm wide.

23. A template for etching a substrate, comprising:

a first trench in a material overlying a substrate; and

a plurality of polymer lines, the polymer lines separated from one another by openings distributed across a width of the first trench and extending a length of the first trench, the openings exposing second trenches in the substrate.

24. A template for etching a substrate, comprising:

an inorganic material within a trench in another material on a substrate, the inorganic material spaced from at least one sidewall of the trench by an elongate gap having a width up to about 10 nm, the elongate gap exposing the substrate at a floor of the trench.

25. The template of claim 24, wherein the inorganic material is a dielectric material.

26. The template of claim 25, wherein the inorganic material is selected from the group consisting of silicon oxide, aluminum oxide, tantalum oxide, silicon carbide, hafnium oxide, hafnium aluminum oxide, silicon carbon nitride, silicon nitride, yttrium oxide, and tantalum pentoxide.