Vertical light emitting devices with nickel silicide bonding and methods of manufacturing
First Claim
1. A method for manufacturing a lighting emitting device, comprising:
- forming a light emitting structure;
depositing a barrier material, a mirror material, and a bonding material on the light emitting structure, the bonding material containing nickel (Ni);
placing the light emitting structure onto a silicon substrate with the nickel of the bonding material in direct contact with the silicon substrate; and
bonding the light emitting structure and the silicon substrate via forming a nickel silicide (NiSi) material at an interface between the silicon substrate and the bonding material.
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Accused Products
Abstract
Various embodiments of light emitting devices, assemblies, and methods of manufacturing are described herein. In one embodiment, a method for manufacturing a lighting emitting device includes forming a light emitting structure, and depositing a barrier material, a mirror material, and a bonding material on the light emitting structure in series. The bonding material contains nickel (Ni). The method also includes placing the light emitting structure onto a silicon substrate with the bonding material in contact with the silicon substrate and annealing the light emitting structure and the silicon substrate. As a result, a nickel silicide (NiSi) material is formed at an interface between the silicon substrate and the bonding material to mechanically couple the light emitting structure to the silicon substrate.
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Citations
10 Claims
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1. A method for manufacturing a lighting emitting device, comprising:
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forming a light emitting structure; depositing a barrier material, a mirror material, and a bonding material on the light emitting structure, the bonding material containing nickel (Ni); placing the light emitting structure onto a silicon substrate with the nickel of the bonding material in direct contact with the silicon substrate; and bonding the light emitting structure and the silicon substrate via forming a nickel silicide (NiSi) material at an interface between the silicon substrate and the bonding material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method for manufacturing a lighting emitting device, comprising:
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forming a light emitting structure; depositing a barrier material, a mirror material, and a nickel material on the light emitting structure, wherein the nickel material has a first surface; placing the light emitting structure onto a carrier substrate, wherein the carrier substrate includes a silicon material having a second surface, and wherein the second surface of the silicon material is in direct contact with the first surface of nickel material; and forming a nickel silicide (NiSi) material at an interface between the nickel material and the silicon material to bond the light emitting structure to the carrier substrate. - View Dependent Claims (10)
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Specification