Contacts for an n-type gallium and nitrogen substrate for optical devices
First Claim
Patent Images
1. A method for fabricating LED devices, the method comprising:
- providing a gallium and nitrogen containing substrate member comprising a backside surface and a front side surface, the front side surface including an n-type material overlying the substrate member, an active region overlying the n-type material, and a p-type material overlying the active region;
subjecting the backside surface to a polishing process, causing a backside surface characterized by a surface roughness;
subjecting the backside surface characterized by a surface roughness to an anisotropic etching process exposing various crystal planes to form a plurality of pyramid-like structures distributed spatially in a non-periodic manner on the backside surface, wherein the anisotropic etching process comprises use of a solution comprising silicic acid and potassium hydroxide;
treating the backside surface comprising the plurality of pyramid-like structures, to a plasma species to form a plasma-treated backside surface;
subjecting the plasma-treated backside surface to a surface treatment to form a surface-treated backside; and
forming a contact material comprising an aluminum bearing species or a titanium bearing species overlying the surface-treated backside to form a plurality of LED devices with the contact material.
3 Assignments
0 Petitions
Accused Products
Abstract
Techniques for manufacturing optical devices are disclosed. More particularly, light emitting diodes and in particular to ohmic contacts for light emitting diodes are disclosed.
208 Citations
18 Claims
-
1. A method for fabricating LED devices, the method comprising:
-
providing a gallium and nitrogen containing substrate member comprising a backside surface and a front side surface, the front side surface including an n-type material overlying the substrate member, an active region overlying the n-type material, and a p-type material overlying the active region; subjecting the backside surface to a polishing process, causing a backside surface characterized by a surface roughness; subjecting the backside surface characterized by a surface roughness to an anisotropic etching process exposing various crystal planes to form a plurality of pyramid-like structures distributed spatially in a non-periodic manner on the backside surface, wherein the anisotropic etching process comprises use of a solution comprising silicic acid and potassium hydroxide; treating the backside surface comprising the plurality of pyramid-like structures, to a plasma species to form a plasma-treated backside surface; subjecting the plasma-treated backside surface to a surface treatment to form a surface-treated backside; and forming a contact material comprising an aluminum bearing species or a titanium bearing species overlying the surface-treated backside to form a plurality of LED devices with the contact material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
-
-
10. A method for fabricating LED devices, the method comprising:
-
providing a gallium and nitrogen containing substrate member comprising a backside surface and a front side surface, the front side surface including an n-type material overlying the substrate member, an active region overlying the n-type material, and a p-type material overlying the active region; subjecting the backside surface to a polishing process, causing a backside surface characterized by a surface roughness; subjecting the backside surface characterized by a surface roughness to an anisotropic etching process exposing various crystal planes to form a plurality of pyramid-like structures distributed spatially in a non-periodic manner on the backside surface, the plurality of pyramid-like structures characterizing a roughened region overlying a plane within a vicinity of the backside region, wherein the anisotropic etching process comprises use of a solution comprising silicic acid and potassium hydroxide; treating the backside surface, comprising a plurality of pyramid-like structures, to a plasma species to form a plasma-treated backside surface; subjecting the plasma-treated backside surface to a surface treatment to form a surface-treated backside; and forming a contact material comprising an aluminum bearing species or a titanium bearing species overlying the surface-treated backside to form a plurality of LED devices with the contact material such that the contact material forms an ohmic contact with the surface-treated backside of each of the plurality of LED devices. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18)
-
Specification