Forming semiconductor chip connections

• US 8,802,497 B2
• Filed: 03/28/2012
• Issued: 08/12/2014
• Est. Priority Date: 05/26/2009
• Status: Active Grant

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: International Business Machines Corporation
• Inventors: Hsu, Louis Lu-Chen, Cheng, Kangguo, Dalton, Timothy J., Farooq, Mukta G., Fitzsimmons, John A.
• Primary Examiner(s): Lee, Cheung
• Assistant Examiner(s): JOY, JEREMY J
• Application Number:
  US13/432,963
• Publication Number:
  US 20120187561A1
• Time in Patent Office: 867 Days
• Field of Search: 257/686, 257/777, 257/E23.02, 257/E23.021, 257/E23.023, 257/E23.145, 257/E21.511, 257/E23.013, 438/107, 438/109
• US Class Current: 438/109
• CPC Class Codes: H01L 21/6836 Wafer tapes, e.g. grinding or dicing support tapes adhesive tapes in general C09J7/20
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/0554 External layer
• CPC Class Codes: H01L 2224/0555 Shape
• CPC Class Codes: H01L 2224/0556 Disposition
• CPC Class Codes: H01L 2224/0557 the external layer being disposed on a via connection of the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/05571 the external layer being disposed in a recess of the surface
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/06183 On contiguous sides of the body
• CPC Class Codes: H01L 2224/13009 Bump connector integrally formed with a via connection of the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/131 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/14183 On contiguous sides of the body
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/16105 the bump connector connecting bonding areas being not aligned with respect to each other
• CPC Class Codes: H01L 2224/16137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/16147 the bump connector connecting to a bonding area disposed in a recess of the surface
• CPC Class Codes: H01L 2224/81205 Ultrasonic bonding
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 2225/06513 : Bump or bump-like direct electrical connections between devices, e.g. flip-chip connection, solder bumps
• CPC Class Codes: H01L 2225/06524 : Electrical connections formed on device or on substrate, e.g. a deposited or grown layer
• CPC Class Codes: H01L 2225/06551 : Conductive connections on the side of the device
• CPC Class Codes: H01L 24/11 : Manufacturing methods for bumps on insulating substrates H01L21/4853
• CPC Class Codes: H01L 24/13 : of an individual bump connector
• CPC Class Codes: H01L 24/14 : of a plurality of bump connectors
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 24/17 : of a plurality of bump connectors
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 25/0652 : the devices being arranged next and on each other, i.e. mixed assemblies
• CPC Class Codes: H01L 25/0657 : Stacked arrangements of devices
• CPC Class Codes: H01L 27/0207 : Geometrical layout of the components, e.g. computer aided design; custom LSI, semi-custom LSI, standard cell technique
• CPC Class Codes: H01L 29/0657 : characterised by the shape of the body
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0001 : Technical content checked by a classifier
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits

Abstract

Systems and methods are disclosed that enable forming semiconductor chip connections. In one embodiment, the semiconductor chip includes a body having a polyhedron shape with a pair of opposing sides; and a solder member extending along a side that extends between the pair of opposing sides of the polyhedron shape.

Claims

1. A method of forming a semiconductor structure, the method comprising:

forming a plurality of semiconductor chips by;

depositing a plurality of dielectric layers over a chip body having a polyhedron shape with a pair of opposing sides;

etching the plurality of dielectric layers to form a hole, and etching the plurality of dielectric layers and the chip body to create a through silicon via (TSV) opening;

dicing the chip body through the TSV opening, forming the plurality of semiconductor chips and a space between the plurality of semiconductor chips;

depositing a solder layer in the hole, forming a solder ball element;

depositing the solder layer in the TSV opening and in the space between the plurality of semiconductor chips after the dicing of the chip body through the TSV opening,

the depositing of the solder layer in the TSV opening including filling the TSV opening with the solder layer to form a filled TSV; and

cutting through a portion of the solder layer in the filled TSV and the solder layer in the space between the plurality of semiconductor chips, forming a solder member extending completely along a side that extends between the pair of opposing sides of the chip body;

connecting the plurality of semiconductor chips, each semiconductor chip including;

a body having a polyhedron shape with a pair of opposing sides;

a solder member extending completely along a side that extends between the opposing sides of the polyhedron shape; and

a solder ball element located on a surface of one of the pair of opposing sides;

the connecting including;

heating the solder ball element of a first semiconductor chip and heating the solder ball element of a second semiconductor chip; and

compressing the solder ball element of the first semiconductor chip against the solder ball element of the second semiconductor chip;

connecting a connector chip to one of the plurality of semiconductor chips, the connector chip including;

a body having a polyhedron shape with a pair of opposing substantially planar sides;

a solder member extending completely along a side that extends between the opposing substantially planar sides of the polyhedron shape; and

a solder ball element located on a surface of one of the pair of opposing substantially planar sides,

the connecting of the connector chip to one of the plurality of semiconductor chips including;

heating the solder ball element of the connector chip and heating the solder member extending completely along the side that extends between the opposing substantially planar sides of the polyhedron shape of one of the plurality of semiconductor chips; and

compressing the solder ball element of the connector chip against the solder member of one of the plurality of semiconductor chips,

wherein the connector chip forms a substantially right angle with the one of the plurality of semiconductor chips;

connecting the connector chip and the one of the plurality of semiconductor chips to a substrate,

wherein the connector chip is connected to the substrate by the solder member of the connector chip that extends completely along the side that extends between the opposing substantially planar sides of the polyhedron shape, and

wherein the one of the plurality of semiconductor chips is connected to the substrate by the solder ball element of the semiconductor chip.

2. The method of claim 1, wherein the solder member in each of the plurality of semiconductor chips further extends over a corner formed by adjacent sides of the body of each semiconductor chip.