Patterns of passivation material on bond pads and methods of manufacture thereof

• US 8,802,554 B2
• Filed: 02/13/2012
• Issued: 08/12/2014
• Est. Priority Date: 02/15/2011
• Status: Active Grant

• Current Assignee: Marvell Asia Pte Limited (Marvell Technology Group Limited)
• Original Assignee: Marvell World Trade Limited (Marvell Technology Group Limited)
• Inventors: Sutardja, Sehat
• Primary Examiner(s): Coleman, William D
• Application Number:
  US13/372,315
• Publication Number:
  US 20120205812A1
• Time in Patent Office: 911 Days
• Field of Search: 257/739, 438/612
• US Class Current: 438/612
• CPC Class Codes: H01L 2224/0213 Alignment aids
• CPC Class Codes: H01L 2224/02166 Collar structures
• CPC Class Codes: H01L 2224/0217 Alignment aids
• CPC Class Codes: H01L 2224/04042 Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
• CPC Class Codes: H01L 2224/05011 comprising apertures or cavities
• CPC Class Codes: H01L 2224/05186 with a principal constituent of the material being a non metallic, non metalloid inorganic material
• CPC Class Codes: H01L 2224/05551 comprising apertures or cavities
• CPC Class Codes: H01L 2224/05552 in top view
• CPC Class Codes: H01L 2224/05564 Only on the bonding interface of the bonding area
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05576 being mutually engaged together, e.g. through inserts
• CPC Class Codes: H01L 2224/05578 being disposed next to each other, e.g. side-to-side arrangements
• CPC Class Codes: H01L 2224/05624 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/05644 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/05647 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/05655 Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/05686 with a principal constituent of the material being a non metallic, non metalloid inorganic material
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48453 of the interface with the bonding area
• CPC Class Codes: H01L 2224/48624 : Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/48644 : Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48647 : Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48655 : Nickel (Ni) as principal constituent
• CPC Class Codes: H01L 2224/48686 : with a principal constituent of the bonding area being a non metallic, non metalloid inorganic material
• CPC Class Codes: H01L 2224/48824 : Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/48844 : Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48847 : Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48855 : Nickel (Ni) as principal constituent
• CPC Class Codes: H01L 2224/48886 : with a principal constituent of the bonding area being a non metallic, non metalloid inorganic material
• CPC Class Codes: H01L 2224/85035 : by heating means, e.g. "free-air-ball"
• CPC Class Codes: H01L 2224/85365 : Shape, e.g. interlocking features
• CPC Class Codes: H01L 23/485 : consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts H01L23/4821, H01L23/4822, H01L23/4824, H01L23/4825 take precedence; materials H01L23/532, bond pads H01L24/02, bump connectors H01L24/10
• CPC Class Codes: H01L 24/05 : of an individual bonding area
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/85 : using a wire connector wire bonding in general B23K20/004
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01327 : Intermediate phases, i.e. intermetallics compounds
• CPC Class Codes: H01L 2924/05042 : Si3N4
• CPC Class Codes: H01L 2924/05442 : SiO2

Abstract

A method includes forming a pad on an electronic component. The pad comprises conductive material. The method further includes providing passivation material on a surface of the conductive material and removing passivation material from the surface to expose portions of the conductive material to form a bond pad comprising conductive material and passivation material.

Claims

1. A method comprising:

forming a pad on an electronic component, wherein the pad comprises conductive material;

providing passivation material on a surface of the conductive material;

selectively removing the passivation material from the surface of the conductive material to expose a section of the conductive material; and

subsequent to selectively removing the passivation material from the surface of the conductive material to expose the section of the conductive material, depositing a plurality of spacers on the exposed section of the conductive material to form a bond pad comprising (i) the conductive material and (ii) the plurality of spacers.

2. The method of claim 1, wherein:

the plurality of spacers include a pattern of material deposited on the pad.

3. The method of claim 1, wherein the passivation material includes silicon nitride.

4. The method of claim 1, wherein forming the pad on the electronic component and providing the passivation material on the surface of the conductive material comprises:

providing the pad on a layer of the electronic component; and

depositing the passivation material on (i) the pad and (ii) the layer to define a passivation layer of the electronic component.

5. The method of claim 1, wherein forming the pad on the electronic component and providing the passivation material on the surface of the conductive material comprises:

depositing the passivation material on a layer of the electronic component to define a passivation layer of the electronic component;

selectively removing the passivation material to expose a location on the layer to create the pad;

depositing the conductive material at the location; and

depositing passivation material on the conductive material.

6. The method of claim 2, further comprising:

coupling a bond wire to the bond pad such that the bond wire is in physical contact with (i) the pad and (ii) the plurality of spacers, wherein the pattern comprises at least one of (i) straight lines and (ii) curved lines.

7. The method of claim 6, wherein the pattern comprises at least one of a plurality of (i) squares and (ii) circles.

8. The method of claim 6, wherein the pattern comprises one of (i) a checkerboard-type pattern, (ii) a diagonal checkerboard-type pattern, (iii) squares within squares, and (iv) circles within circles.