×

Compliant wafer level probe assembly

  • US 8,803,539 B2
  • Filed: 05/25/2010
  • Issued: 08/12/2014
  • Est. Priority Date: 06/03/2009
  • Status: Active Grant
First Claim
Patent Images

1. A probe assembly to act as a temporary interconnect between terminals on a circuit member and a test station, the probe assembly comprising:

  • a base layer of a dielectric material printed onto a surface of a fixture, the surface of the fixture having a plurality of cavities;

    a plurality of discrete contact members formed in the plurality of cavities in the fixture and coupled to the base layer;

    a plurality of conductive traces printed onto an exposed surface of the base layer and electrically coupled with proximal ends of one or more of the discrete contact members;

    a compliant layer deposited over the conductive traces and the proximal ends of the contact members, the compliant layer adapted to bias the contact members toward the terminals on the circuit member and to compensate for non-planarity of the terminal; and

    a protective layer deposited on the compliant layer, wherein removal of the probe assembly from the fixture allows distal ends of the contact members to contact terminals on the circuit member such that the conductive traces electrically couple the circuit member to the test station.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×