Method of manufacturing a display device comprising a step of simultaneously polishing a second substrate and a semiconductor chip to have the same thickness as each other

• US 8,804,089 B2
• Filed: 08/17/2012
• Issued: 08/12/2014
• Est. Priority Date: 03/14/2006
• Status: Expired due to Fees

• Current Assignee: Japan Display West Incorporated (Japan Display Incorporated)
• Original Assignee: Japan Display West Incorporated (Japan Display Incorporated)
• Inventors: Ino, Masumitsu
• Primary Examiner(s): Lee, Paul
• Application Number:
  US13/588,620
• Publication Number:
  US 20120314162A1
• Time in Patent Office: 725 Days
• Field of Search: 349150-154
• US Class Current: 349/151
• CPC Class Codes: G02F 1/133308 Support structures for LCD panels, e.g. frames or bezels
• CPC Class Codes: G02F 1/133528 Polarisers
• CPC Class Codes: G02F 1/13363 Birefringent elements, e.g. for optical compensation
• CPC Class Codes: G02F 1/1339 Gaskets; Spacers; Sealing of cells
• CPC Class Codes: G02F 1/13452 Conductors connecting driver circuitry and terminals of panels
• CPC Class Codes: G02F 1/13454 Drivers integrated on the active matrix substrate G02F1/136277 takes precedence
• CPC Class Codes: G02F 1/1368 in which the switching element is a three-electrode device G02F1/136277 takes precedence
• CPC Class Codes: G02F 2201/50 Protective arrangements
• CPC Class Codes: H01J 9/20 Manufacture of screens on or from which an image or pattern is formed, picked up, converted or stored; Applying coatings to the vessel

Abstract

A display device including: a first substrate with a pixel switch and drivers mounted thereon; a second substrate disposed in facing relation to the first substrate; a material layer held between the first substrate and the second substrate and having peripheral edges sealed by a seal member, the material layer having an electrooptical effect; and a semiconductor chip mounted as a COG component on the first substrate, the semiconductor chip having a control system configured to control the drivers; wherein the semiconductor chip having a thickness equal to the total thickness of the seal member and the second substrate or larger than the thickness of the seal member and smaller than the total thickness.

Claims

1. A method of manufacturing a display device having a first substrate with a pixel switch and drivers mounted thereon, a second substrate disposed in facing relation to said first substrate, and a material layer held between said first substrate and said second substrate and sealed by a seal member, the method comprising:

a first step of mounting a semiconductor chip having a control system configured to control said drivers, as a COG component on said first substrate parallel to a region in which said seal member and said second substrate are stacked;

a second step of filling a space around said semiconductor chip with a protective fixing member thereby to secure said first substrate and said semiconductor chip to each other; and

a third step of simultaneously polishing said second substrate and said semiconductor chip to the same thickness as each other.