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Method of manufacturing a display device comprising a step of simultaneously polishing a second substrate and a semiconductor chip to have the same thickness as each other

  • US 8,804,089 B2
  • Filed: 08/17/2012
  • Issued: 08/12/2014
  • Est. Priority Date: 03/14/2006
  • Status: Expired due to Fees
First Claim
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1. A method of manufacturing a display device having a first substrate with a pixel switch and drivers mounted thereon, a second substrate disposed in facing relation to said first substrate, and a material layer held between said first substrate and said second substrate and sealed by a seal member, the method comprising:

  • a first step of mounting a semiconductor chip having a control system configured to control said drivers, as a COG component on said first substrate parallel to a region in which said seal member and said second substrate are stacked;

    a second step of filling a space around said semiconductor chip with a protective fixing member thereby to secure said first substrate and said semiconductor chip to each other; and

    a third step of simultaneously polishing said second substrate and said semiconductor chip to the same thickness as each other.

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