Audio port configuration for compact electronic devices

• US 8,804,993 B2
• Filed: 06/17/2011
• Issued: 08/12/2014
• Est. Priority Date: 01/10/2011
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Shukla, Ashutosh Y., Merz, Nicholas G. L., Tan, Tang Yew, Moolsintong, Pinida Jan, Wang, Erik
• Primary Examiner(s): Le, Huyen D
• Application Number:
  US13/163,308
• Publication Number:
  US 20120177237A1
• Time in Patent Office: 1,152 Days
• Field of Search: 381/332, 381/334, 381/335, 381/337, 381/338, 381/345, 381/353, 381/354, 381/386, 381/391, 381/189, 381/392, 379/388.01, 379/388.02, 379/420.02, 379/430, 379/433.02, 379/432, 455/575.1, 455/569.1
• US Class Current: 381/386
• CPC Class Codes: B29C 45/1671 with an insert
• CPC Class Codes: B29C 45/1676 using a soft material and a rigid material, e.g. making articles with a sealing part
• CPC Class Codes: B29L 2031/3418 Loud speakers
• CPC Class Codes: B29L 2031/3437 Cellular phones
• CPC Class Codes: H04M 1/035 Improving the acoustic characteristics by means of constructional features of the housing, e.g. ribs, walls, resonating chambers or cavities
• CPC Class Codes: H04M 1/18 Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment H04M1/19 takes precedence
• CPC Class Codes: H04R 1/34 by using a single transducer with sound reflecting, diffracting, directing or guiding means specially adapted for hearing aids H04R25/402
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/10083 Electromechanical or electro-acoustic component, e.g. microphone
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

A portable electronic device that provides compact configurations for audio elements are disclosed. The audio elements can be drivers (e.g., speakers) or receivers (e.g., microphones). In one embodiment, a molded acoustic chamber can be formed to assist in directing audio sound between an opening an outer housing and an internal flexible electronic substrate. The audio element can be mounted on or coupled to the flexible electrical substrate over an opening therein that allows allow audio sound to pass there through. The molded acoustic chamber can also be formed such that it includes a barrier, such as a mesh barrier, so that undesired foreign substances can be blocked from entry or further entry into the audio chamber. The molded acoustic chamber can also be formed such that it includes one or more acoustic seals that can be used to provide an acoustic seal between the molded acoustic chamber and the opening in the outer housing.

Claims

1. A portable electronic device, comprising:

a housing having an inner surface and an outer surface, the housing having an audio port opening;

a flexible substrate for electrical circuitry provided within the housing, the flexible substrate including a first side and a second side, the flexible substrate including a substrate opening there through;

an audio component coupled to the first side of the flexible substrate adjacent the substrate opening; and

a molded acoustic chamber provided within the housing, the molded acoustic chamber having;

an internal audio channel through the molded acoustic chamber from a first end to a second end, the second end being more compliant than the first end,

wherein the first end of the molded acoustic chamber is acoustically sealed to the second side of the flexible substrate adjacent the substrate opening, and

wherein the second end of the molded acoustic chamber is acoustically sealed to the inner surface of the housing adjacent the audio port opening; and

at least one sealing ring integrally molded with the second end of the internal audio chamber.

2. A portable electronic device as recited in claim 1, wherein the portable electronic device comprises a mesh barrier integrally molded with the second end of the integral audio chamber.

3. A portable electronic device as recited in claim 1, wherein the first end of the molded acoustic chamber is formed in a first mold process, and the second end of the molded acoustic chamber is formed in a second mold process, the second end being integrally molded to the first end.

4. A portable electronic device as recited in claim 3, wherein the molded acoustic chamber comprises a mesh barrier integrally molded with the second end of the integral audio chamber.

5. A portable electronic device as recited in claim 1, wherein the audio port opening includes a recess configured to receive a portion of the second end of the molded acoustic chamber.

6. A portable electronic device as recited in claim 5, wherein the molded acoustic chamber comprises at least one sealing ring integrally molded with the second end of the integral audio chamber, and wherein the sealing ring seal is configured to seal the second end of the molded acoustic chamber to the recess of the audio port opening.

7. A portable electronic device as recited in claim 6, wherein the molded acoustic chamber comprises a mesh barrier integrally molded with the second end of the integral audio chamber.

8. A portable electronic device as recited in claim 7, wherein the mesh barrier is positioned within the recess of the audio port opening.

9. A portable electronic device as recited in claim 1, wherein the audio component is a microphone or a speaker.

10. A portable electronic device as recited in claim 1, wherein the internal audio chamber is tapered such that the internal audio chamber is more narrow at the second end than the first end.

11. A portable electronic device as recited in claim 1, wherein the portable electronic device is a mobile phone or is configured to operate as a mobile phone.

12. A portable electronic device, comprising:

a housing having an inner surface and an outer surface, the housing having an audio port opening;

a flexible substrate for electrical circuitry provided within the housing, the flexible substrate including a first side and a second side, the flexible substrate including a substrate opening there through;

an audio component coupled to the first side of the flexible substrate adjacent the substrate opening;

a molded acoustic chamber provided within the housing, the molded acoustic chamber having an internal audio channel through the molded acoustic chamber from a first end to a second end; and

a mesh barrier integrally molded with the second end of the molded acoustic chamber, wherein the first end of the molded acoustic chamber is acoustically sealed to the second side of the flexible substrate adjacent the substrate opening, and wherein the second end of the molded acoustic chamber is acoustically sealed to the inner surface of the housing adjacent the audio port opening.

13. A portable electronic device as recited in claim 12, wherein the molded acoustic chamber comprises at least one sealing ring integrally molded with the second end of the internal audio chamber.

14. A portable electronic device as recited in claim 12, wherein the audio port opening includes a recess configured to receive a portion of the second end of the molded acoustic chamber.

15. A portable electronic device as recited in claim 14, wherein the molded acoustic chamber comprises at least one sealing ring integrally molded with the second end of the integral audio chamber, and wherein the sealing ring seal is configured to seal the second end of the molded acoustic chamber to the recess of the audio port opening.

16. A method for assembling an audio subsystem for use in a portable electronic device, comprising:

providing a molded acoustic chamber including;

at least a first portion having a first end;

a second portion having a second end;

an internal audio channel through the molded acoustic chamber from the first end to the second end,

wherein the internal audio chamber is tapered such that the internal audio chamber is more narrow at the second end than the first end; and

a mesh barrier provided within or adjacent the internal audio channel;

providing a flexible substrate for electrical circuitry, the flexible substrate including a first side and a second side, the flexible substrate including a substrate opening there through;

attaching an audio component coupled to the first side of the flexible substrate adjacent the substrate opening; and

acoustically coupling the first end of the molded acoustic chamber to the second side of the flexible substrate adjacent the substrate opening.

17. A method as recited in claim 16, wherein the method further comprises:

providing a portable electronic device housing having an inner surface and an outer surface, the housing having an audio port opening;

placing the audio subsystem within the portable electronic device housing; and

acoustically coupling the second end of the molded acoustic chamber to the inner surface of the portable electronic device housing adjacent the audio port opening.