Plasma tuning rods in microwave processing systems
First Claim
1. A method of processing a substrate using a microwave processing system comprising:
- positioning a substrate on a movable substrate holder within a process space in a rectangular process chamber;
coupling a first cavity assembly to the rectangular process chamber using a first interface assembly, the first cavity assembly having a first electromagnetic (EM) energy tuning space therein, the first interface assembly including a first set of isolation assemblies, wherein a first set of EM-coupling regions are established in the first EM energy tuning space;
coupling each one from a first set of plasma-tuning rods to one of the isolation assemblies of the first set, the first set of plasma-tuning rods each having a first set of plasma-tuning portions in the process space and an EM-tuning portion in the first EM energy tuning space, each of the plasma-tuning portions being coupled to a respective one of the EM-coupling regions of the first set, wherein the first set of EM-tuning portions is configured to obtain EM energy from the first set of EM-coupling regions;
coupling to the first cavity assembly through a first cavity assembly wall a first set of slab control assemblies and coupling a first set of plasma-tuning slabs disposed proximate to the first set of EM-coupling regions in the first EM energy tuning space to the first set of slab control assemblies, each plasma-tuning slab of the first set being positioned a first EM-coupling distance from the EM-tuning portion of a plasma-tuning rod of the first set by a slab control assembly of the first set that is configured to tune the EM energy in a respective one of the EM-coupling regions of the first set;
coupling a first cavity control assembly to the first cavity assembly and coupling a first cavity-tuning slab to the first cavity control assembly so that the first cavity-tuning slab is positioned at a variable cavity tuning distance within the first EM energy space and configured to tune EM energy in the first EM energy tuning space;
coupling a second cavity assembly to the rectangular process chamber using a second interface assembly, the second cavity assembly having a second EM energy tuning space therein, the second interface assembly including a second set of isolation assemblies, wherein a second set of EM-coupling regions are established in the second EM energy tuning space;
coupling each one from a second set of plasma-tuning rods to one of the isolation assemblies of the second set, the second set of plasma-tuning rods each having plasma-tuning portions in the process space and an EM-tuning portion in the second EM energy tuning space, each of the plasma-tuning portions being coupled to a respective one of the EM-coupling regions of the second set, wherein the first set of EM-tuning portions is configured to obtain EM energy from the second set of EM-coupling regions;
coupling to the second cavity assembly through a second cavity assembly wall a second set of slab control assemblies and coupling a second set of plasma-tuning slabs disposed proximate to the second set of EM-coupling regions in the second EM energy tuning space to the second set of slab control assemblies, each plasma-tuning slab of the second set being positioned a second EM-coupling distance from the EM-tuning portion of a plasma-tuning rod of the second set by a slab control assembly of the second set that is configured to tune the EM energy in a respective one of the EM-coupling regions of the second set;
coupling a second cavity control assembly to the second cavity assembly and coupling a second cavity-tuning slab to the second cavity control assembly so that the second cavity-tuning slab is positioned at a variable cavity tuning distance within the second EM energy space and configured to tune EM energy in the second EM energy tuning space; and
coupling a controller to the first cavity control assembly, the second cavity control assembly, the first set of slab control assemblies, the second set of slab control assemblies, the first cavity assembly and the second cavity assembly, wherein the controller is configured to independently control the first set of slab control assemblies so as to control the first EM-coupling distance to tune each EM energy associated with each first set of the EM-coupling regions of the first set, the second set of slab control assemblies so as to control the second EM-coupling distance to tune each EM energy associated with each of the EM-coupling regions of the second set, and the first and second cavity control assemblies to tune the EM energies in the first and second EM energy tuning spaces, to thereby control plasma uniformity in the process space.
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Accused Products
Abstract
The invention provides a plurality of plasma tuning rod subsystems. The plasma tuning rod subsystems can comprise one or more microwave cavities configured to couple electromagnetic (EM) energy in a desired EM wave mode to a plasma by generating resonant microwave energy in one or more plasma tuning rods within and/or adjacent to the plasma. One or more microwave cavity assemblies can be coupled to a process chamber, and can comprise one or more tuning spaces/cavities. Each tuning space/cavity can have one or more plasma tuning rods coupled thereto. Some of the plasma tuning rods can be configured to couple the EM energy from one or more of the resonant cavities to the process space within the process chamber and thereby create uniform plasma within the process space.
39 Citations
14 Claims
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1. A method of processing a substrate using a microwave processing system comprising:
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positioning a substrate on a movable substrate holder within a process space in a rectangular process chamber; coupling a first cavity assembly to the rectangular process chamber using a first interface assembly, the first cavity assembly having a first electromagnetic (EM) energy tuning space therein, the first interface assembly including a first set of isolation assemblies, wherein a first set of EM-coupling regions are established in the first EM energy tuning space; coupling each one from a first set of plasma-tuning rods to one of the isolation assemblies of the first set, the first set of plasma-tuning rods each having a first set of plasma-tuning portions in the process space and an EM-tuning portion in the first EM energy tuning space, each of the plasma-tuning portions being coupled to a respective one of the EM-coupling regions of the first set, wherein the first set of EM-tuning portions is configured to obtain EM energy from the first set of EM-coupling regions; coupling to the first cavity assembly through a first cavity assembly wall a first set of slab control assemblies and coupling a first set of plasma-tuning slabs disposed proximate to the first set of EM-coupling regions in the first EM energy tuning space to the first set of slab control assemblies, each plasma-tuning slab of the first set being positioned a first EM-coupling distance from the EM-tuning portion of a plasma-tuning rod of the first set by a slab control assembly of the first set that is configured to tune the EM energy in a respective one of the EM-coupling regions of the first set; coupling a first cavity control assembly to the first cavity assembly and coupling a first cavity-tuning slab to the first cavity control assembly so that the first cavity-tuning slab is positioned at a variable cavity tuning distance within the first EM energy space and configured to tune EM energy in the first EM energy tuning space; coupling a second cavity assembly to the rectangular process chamber using a second interface assembly, the second cavity assembly having a second EM energy tuning space therein, the second interface assembly including a second set of isolation assemblies, wherein a second set of EM-coupling regions are established in the second EM energy tuning space; coupling each one from a second set of plasma-tuning rods to one of the isolation assemblies of the second set, the second set of plasma-tuning rods each having plasma-tuning portions in the process space and an EM-tuning portion in the second EM energy tuning space, each of the plasma-tuning portions being coupled to a respective one of the EM-coupling regions of the second set, wherein the first set of EM-tuning portions is configured to obtain EM energy from the second set of EM-coupling regions; coupling to the second cavity assembly through a second cavity assembly wall a second set of slab control assemblies and coupling a second set of plasma-tuning slabs disposed proximate to the second set of EM-coupling regions in the second EM energy tuning space to the second set of slab control assemblies, each plasma-tuning slab of the second set being positioned a second EM-coupling distance from the EM-tuning portion of a plasma-tuning rod of the second set by a slab control assembly of the second set that is configured to tune the EM energy in a respective one of the EM-coupling regions of the second set; coupling a second cavity control assembly to the second cavity assembly and coupling a second cavity-tuning slab to the second cavity control assembly so that the second cavity-tuning slab is positioned at a variable cavity tuning distance within the second EM energy space and configured to tune EM energy in the second EM energy tuning space; and coupling a controller to the first cavity control assembly, the second cavity control assembly, the first set of slab control assemblies, the second set of slab control assemblies, the first cavity assembly and the second cavity assembly, wherein the controller is configured to independently control the first set of slab control assemblies so as to control the first EM-coupling distance to tune each EM energy associated with each first set of the EM-coupling regions of the first set, the second set of slab control assemblies so as to control the second EM-coupling distance to tune each EM energy associated with each of the EM-coupling regions of the second set, and the first and second cavity control assemblies to tune the EM energies in the first and second EM energy tuning spaces, to thereby control plasma uniformity in the process space. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A microwave processing system for processing a substrate comprising:
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a rectangular process chamber comprising a process space having a movable substrate holder therein; a first cavity assembly coupled to the rectangular process chamber using a first interface assembly, the first cavity assembly having a first electromagnetic (EM) energy tuning space therein, the first interface assembly including a first set of isolation assemblies, wherein a first set of EM-coupling regions, each with EM energy therein, are established in the first EM energy tuning space; a first set of plasma-tuning rods, each coupled to a respective one of the isolation assemblies of the first set, the first set of plasma-tuning rods each having a plasma-tuning portion in the process space and an EM-tuning portion in the first EM energy tuning space, each of the plasma-tuning portions being coupled to a respective one of the EM-coupling regions of the first set, wherein the first set of EM-tuning portions is configured to obtain EM energy from the first set of EM-coupling regions; a first set of plasma-tuning slabs disposed proximate to the first set of EM-coupling regions in the first EM energy tuning space and a first set of slab control assemblies coupled to the first set of plasma-tuning slabs through a first cavity assembly wall, each plasma-tuning slab of the first set being positioned a first EM-coupling distance from the EM-tuning portion of a plasma-tuning rod of the first set by a respective slab control assembly of the first set that is configured to tune the EM energy in a respective one of the EM-coupling regions of the first set; a first cavity-tuning slab positioned at a variable cavity tuning distance within the first EM energy tuning space by a first cavity control assembly coupled to the cavity tuning slab and configured to tune EM energy in the first EM energy tuning space; a second cavity assembly coupled to the rectangular process chamber using a second interface assembly, the second cavity assembly having a second EM energy tuning space therein, the second interface assembly including a second set of isolation assemblies, wherein a second set of EM-coupling regions, each with EM energy therein, are established in the second EM energy tuning space; a second set of plasma-tuning rods, each coupled to a respective one of the isolation assemblies of the second set, the second set of plasma-tuning rods each having a plasma-tuning portion in the process space and an EM-tuning portion in the second EM energy tuning space, each of the plasma-tuning portions being coupled to a respective one of the EM-coupling regions of the second set, wherein the second set of EM-tuning portions is configured to obtain EM energy from the second set of EM-coupling regions; a second set of plasma-tuning slabs disposed proximate to the second set of EM-coupling regions in the second EM energy tuning space and a second set of slab control assemblies coupled to the second set of plasma-tuning slabs through a second cavity assembly wall, each plasma-tuning slab of the second set being positioned a second EM-coupling distance from the EM-tuning portion of a plasma-tuning rod of the second set by a respective slab control assembly of the second set that is configured to tune the EM energy in a respective one of the EM-coupling regions of the second set; a second cavity-tuning slab positioned a variable cavity tuning distance within the second EM energy tuning space by a second cavity control assembly coupled to the cavity tuning slab and configured to tune EM energy in the second EM energy tuning space; and a controller coupled to the first cavity control assembly, the second cavity control assembly, the first set of slab control assemblies, the set of second slab control assemblies, the first cavity assembly and the second cavity assembly, wherein the controller is configured to independently control the first set of slab control assemblies so as to control the first EM-coupling distance to tune each EM energy associated with each of the EM-coupling regions of the first set, the second set of slab control assemblies so as to control the second EM-coupling distance to tune each EM energy associated with each of the EM-coupling regions of the second set, and the first and second cavity control assemblies to tune the EM energies in the first and second EM energy tuning spaces, to thereby control plasma uniformity in the process space. - View Dependent Claims (8, 9, 10, 11, 12, 13, 14)
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Specification