Method for applying hot melt adhesive powder onto a shoe or sole part

• US 8,808,809 B2
• Filed: 08/29/2013
• Issued: 08/19/2014
• Est. Priority Date: 10/01/2012
• Status: Active Grant

• Current Assignee: Orisol Asia Ltd.
• Original Assignee: Orisol Asia Ltd.
• Inventors: Makover, Jakov, Mardix, Bar Cochva, Sadeh, Yaacov
• Primary Examiner(s): PARKER, FREDERICK JOHN
• Application Number:
  US14/014,143
• Publication Number:
  US 20140093655A1
• Time in Patent Office: 355 Days
• Field of Search: 427/475, 427/477, 427/534, 427/558
• US Class Current: 427/475
• CPC Class Codes: A43D 111/00 Shoe machines with conveyors for jacked shoes or for shoes or shoe parts
• CPC Class Codes: A43D 117/00 Racks for receiving or transporting shoes or shoe parts; Other conveying means
• CPC Class Codes: A43D 25/18 Devices for applying adhesives to shoe parts A43D25/20 takes precedence; applying liquids or other fluent materials to surfaces in general B05
• CPC Class Codes: A43D 25/183 by nozzles
• CPC Class Codes: A43D 25/20 Arrangements for activating or for accelerating setting of adhesives, e.g. by using heat
• CPC Class Codes: B29L 2031/504 Soles

Abstract

A method for applying hot melt adhesive powder onto a sole or shoe part includes the steps of applying a cleaning agent, irradiating, applying a conductive liquid which has a conductivity at least 100 times higher than purified water which has a conductivity of 5.5·10⁻⁶ S/m, spraying hot melt adhesive powder; and heating. The method can save energy, reduce the working space, reduce the labor intensity and improve the working environment by continuously carrying out the spraying and the melting operation of the hot melt adhesive.

Claims

1. A method for applying hot melt adhesive powder onto a sole or shoe part comprising the steps of:

applying a cleaning agent onto a surface of a to-be-bonded shoe;

placing the to-be-bonded shoe in a irradiation chamber and irradiating the surface of the to-be-bonded shoe which has been treated by the previous step with UVC and ozone;

applying conductive liquid which has a conductivity at least 100 times higher than purified water having a conductivity of 5.5·

10<sup>−

6</sup> S/m onto the surface of the to-be-bonded shoe which has been treated by the previous steps;

placing the to-be-bonded shoe in a spraying chamber and spraying charged hot melt adhesive powder on the surface of the to-be-bonded shoe which has been treated by the previous steps to make the charged hot melt adhesive powder attached onto the to-be-bonded area of the to-be-bonded shoe; and

heating the surface of the to-be-bonded shoe which has been treated by the previous steps by placing the to-be-bonded shoe in a heating chamber to melt the hot melt adhesive powder.

2. The method for applying hot melt adhesive powder onto a sole or shoe part as claimed in claim 1, wherein the steps of applying cleaning agent and applying the conductive liquid onto the surface of the to-be-bonded shoe are combined into a single step by using a mixture of cleaning agent and conductive liquid.

3. The method for applying hot melt adhesive powder onto a sole or shoe part as claimed in claim 1, wherein the hot melt adhesive powder is a polyurethane adhesive powder.

4. The method for applying hot melt adhesive powder onto a sole or shoe part as claimed in claim 3, wherein the hot melt adhesive powder is a thermoplastic Polyurethane.