Reducing thermal expansion effects in semiconductor packages
First Claim
1. A method for manufacturing an electronic device comprising:
- coupling an electronic component to a top surface of a support that is directly opposite from and substantially parallel to a bottom surface of the support;
selecting a first material and a second material;
using the first material to produce a first layer over the electronic component, the first layer substantially encasing, and in direct physical contact with, all exposed surfaces of the electronic component, the first layer including a dye for identifying cracks in the electronic device, the dye being transmissive to optical emissions and not visually apparent except when illuminated by blue light; and
using the second material to produce a second layer over the first layer, the second layer substantially encasing, and in direct physical contact with, a portion of the bottom surface of the support that is directly opposite from the electronic component;
wherein the first material and the second material are selected such that the first material is more flexible than the second material, and a thickness of the first layer is selected to form a mechanical buffer layer configured to absorb stresses caused by thermal expansion of the second layer.
5 Assignments
0 Petitions
Accused Products
Abstract
Reducing effects of thermal expansion in electronic components. An electronic device can include a support, such as a leadframe. An electronic component can be supported by the support. A first flexible layer can cover the electronic component. A second more rigid layer can cover the first layer. The first layer can be made from a material that is more flexible than the second layer thereby creating a mechanical buffer layer between the second layer and the electronic component such that the electronic component is protected from thermal expansion of the second portion caused by changes in temperature. The electronic component can be a laser. The first and second materials can be selected to disperse an optical emission from the optical transmitter.
14 Citations
19 Claims
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1. A method for manufacturing an electronic device comprising:
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coupling an electronic component to a top surface of a support that is directly opposite from and substantially parallel to a bottom surface of the support; selecting a first material and a second material; using the first material to produce a first layer over the electronic component, the first layer substantially encasing, and in direct physical contact with, all exposed surfaces of the electronic component, the first layer including a dye for identifying cracks in the electronic device, the dye being transmissive to optical emissions and not visually apparent except when illuminated by blue light; and using the second material to produce a second layer over the first layer, the second layer substantially encasing, and in direct physical contact with, a portion of the bottom surface of the support that is directly opposite from the electronic component; wherein the first material and the second material are selected such that the first material is more flexible than the second material, and a thickness of the first layer is selected to form a mechanical buffer layer configured to absorb stresses caused by thermal expansion of the second layer. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method for manufacturing an optical transmission device comprising:
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coupling an optical transmitter to a top surface of a support that is directly opposite from and substantially parallel to a bottom surface of the support; encasing the optical transmitter with a first material having a first refractive index, the first material substantially encasing, and in direct physical contact with, all exposed surfaces of the optical transmitter, wherein the first material includes a dye that is transmissive to emissions from the optical transmitter and that is not visually apparent except when illuminated by blue light; and encasing the first material with a second material having a second refractive index, the second refractive index being greater than the first refractive index so as to disperse a width of an optical emission from the optical transmitter, the second material also substantially encasing, and in direct physical contact with, the portion of the bottom surface of the support that is directly opposite from the optical transmitter. - View Dependent Claims (9, 10, 11, 12, 13)
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14. A method for manufacturing an optoelectronic device comprising:
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coupling an optoelectronic component to a top surface of a support that is directly opposite from and substantially parallel to a bottom surface of the support; encasing the optoelectronic component with a first material having a first refractive index, the first material not including filler particles embedded therein; and encasing the first material with a second material having a second refractive index that is greater than the first refractive index, the second material including filler particles embedded therein, the second material substantially encasing, and in direct physical contact with, the portion of the bottom surface of the support that is directly opposite from the optoelectronic component wherein the first material includes a dye that is transmissive to emissions to or from the optoelectronic component and that is not visually apparent except when illuminated by blue light. - View Dependent Claims (15, 16, 17, 18, 19)
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Specification