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Reducing thermal expansion effects in semiconductor packages

  • US 8,809,125 B2
  • Filed: 05/27/2011
  • Issued: 08/19/2014
  • Est. Priority Date: 10/18/2005
  • Status: Active Grant
First Claim
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1. A method for manufacturing an electronic device comprising:

  • coupling an electronic component to a top surface of a support that is directly opposite from and substantially parallel to a bottom surface of the support;

    selecting a first material and a second material;

    using the first material to produce a first layer over the electronic component, the first layer substantially encasing, and in direct physical contact with, all exposed surfaces of the electronic component, the first layer including a dye for identifying cracks in the electronic device, the dye being transmissive to optical emissions and not visually apparent except when illuminated by blue light; and

    using the second material to produce a second layer over the first layer, the second layer substantially encasing, and in direct physical contact with, a portion of the bottom surface of the support that is directly opposite from the electronic component;

    wherein the first material and the second material are selected such that the first material is more flexible than the second material, and a thickness of the first layer is selected to form a mechanical buffer layer configured to absorb stresses caused by thermal expansion of the second layer.

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