Systems and methods for composite structures with embedded interconnects

• US 8,809,689 B2
• Filed: 07/02/2012
• Issued: 08/19/2014
• Est. Priority Date: 07/31/2009
• Status: Active Grant

• Current Assignee: Raytheon Company (Rtx Corporation)
• Original Assignee: Raytheon Company (Rtx Corporation)
• Inventors: Olden, Thomas A., Wrigglesworth, Walter
• Primary Examiner(s): Patel, Ishwarbhai B
• Application Number:
  US13/539,677
• Publication Number:
  US 20120273260A1
• Time in Patent Office: 778 Days
• Field of Search: 361/749, 361/760, 361/748, 361/792, 361/777, 361/751, 361/752, 439/77
• US Class Current: 174/254
• CPC Class Codes: H05K 1/0284 Details of three-dimensional rigid printed circuit boards H05K1/119 takes precedence; shaping of the substrate H05K3/0014
• CPC Class Codes: H05K 1/0366 reinforced, e.g. by fibres, fabrics H05K1/036 takes precedence
• CPC Class Codes: H05K 1/05 Insulated conductive substrates, e.g. insulated metal substrate
• CPC Class Codes: H05K 2201/0323 Carbon
• CPC Class Codes: H05K 2201/09018 Rigid curved substrate
• CPC Class Codes: H05K 2201/09063 Holes or slots in insulating substrate not used for electrical connections
• CPC Class Codes: H05K 2201/092 Exposing inner circuit layers or metal planes at the walls of high aspect ratio holes forming plated-through holes H05K3/42; cutting around hole H05K2203/0242
• CPC Class Codes: H05K 2203/302 Bending a rigid substrate; Breaking rigid substrates by bending rigid circuit boards or rigid supports locally made bendable H05K1/0278
• CPC Class Codes: H05K 3/0014 Shaping of the substrate, e.g. by moulding
• CPC Class Codes: H05K 3/4632 laminating thermoplastic or uncured resin sheets comprising printed circuits without added adhesive materials between the sheets
• CPC Class Codes: H05K 3/465 by applying an insulating layer having channels for the next circuit layer
• CPC Class Codes: Y10T 29/49124 On flat or curved insulated base, e.g., printed circuit, etc.

Abstract

A composite interconnect assembly includes a body structure formed from a composite material (e.g., a carbon graphite material) with one or more conductive traces embedded therein (e.g., a copper or copper alloy). One or more contact regions are provided such that the conductive traces are exposed and are configured to mechanically and electrically connect to one or more electronic components. The body structure may have a variety of shapes, including planar, cylindrical, conical, and the like.

Claims

1. A composite interconnect assembly, comprising:

a generally tubular, composite body structure comprising layers of two or more constituent materials having different physical and chemical properties;

a conductive trace embedded within the composite body structure at a border between the layers, the conductive trace traversing the border such that a portion of the conductive trace only partially intrudes into and forms at least three contact surfaces with one of the layers and an opposite portion of the conductive trace only partially intrudes into and forms at least three contact surfaces with the other of the layers; and

a contact region defined on the composite body structure such that the conductive trace is exposed and is configured to mechanically and electrically connect to an external electronic component,

wherein one of the two or more materials of the composite body structure is a carbon graphite material.

2. The composite interconnect assembly of claim 1, wherein the composite body structure has a thickness of less than approximately 1.5 mm.

3. The composite interconnect assembly of claim 1, wherein the conductive trace comprises copper.

4. The composite interconnect assembly of claim 1, wherein the contact region is an opening in the composite body structure extending to the conductive trace.

5. The composite interconnect assembly of claim 1, wherein the contact region is a bond pad substantially flush with the composite body structure.

6. The composite interconnect assembly of claim 1, wherein the contact region is a through-hole structure.

7. The composite interconnect assembly of claim 1, further comprising electrical components disposed radially from the outer perimeter of the tubular, composite body structure toward an interior of the tubular, composite body structure.

8. The composite interconnect assembly of claim 1, further comprising a plurality of conductive traces configured within multiple levels.

9. A composite interconnect assembly, comprising:

a composite body structure comprising at least two layers, with each layer comprising two or more constituent materials having different physical and chemical properties;

a conductive trace embedded within the composite body structure at a border between the layers, the conductive trace traversing the border such that a portion of the conductive trace only partially intrudes into and forms at least three contact surfaces with one of the layers and an opposite portion of the conductive trace only partially intrudes into and forms at least three contact surfaces with the other of the layers; and

a contact region defined on the composite body structure such that the conductive trace is exposed and is configured to mechanically and electrically connect to an external electronic component,

wherein one of the two or more materials of the composite body structure is a carbon graphite material.

10. The composite interconnect assembly of claim 9, wherein the composite body structure has a thickness of less than approximately 1.5 mm.

11. The composite interconnect assembly of claim 9, wherein the conductive trace comprises copper.

12. The composite interconnect assembly of claim 9, wherein the contact region is an opening in the composite body structure extending to the conductive trace.

13. The composite interconnect assembly of claim 9, wherein the contact region is a bond pad substantially flush with the composite body structure.

14. The composite interconnect assembly of claim 9, wherein the contact region is a through-hole structure.

15. The composite interconnect assembly of claim 9, further comprising a plurality of conductive traces configured within multiple levels.

16. A composite interconnect assembly, comprising:

a composite body structure comprising at least two layers, with each layer comprising two or more constituent materials having different physical and chemical properties;

a plurality of conductive traces embedded within the composite body structure and

comprising;

a first conductive trace, which is wholly encompassed within one of the layers,

a second conductive trace at a border between the layers such that the second conductive trace only partially intrudes into and forms at least three contact surfaces with one of the layers and forms one contact surface with the other of the layers, and

a third conductive trace traversing the border such that a portion of the conductive trace only partially intrudes into and forms at least three contact surfaces with one of the layers and an opposite portion of the conductive trace only partially intrudes into and forms at least three contact surfaces with the other of the layers; and

a plurality of contact regions defined on the composite body structure such that each of the plurality of conductive traces is exposed and is configured to mechanically and electrically connect to an external electronic component,

wherein one of the two or more materials of the composite body structure is a carbon graphite material.