×

Semiconductor method and device of forming a fan-out PoP device with PWB vertical interconnect units

  • US 8,810,024 B2
  • Filed: 03/23/2012
  • Issued: 08/19/2014
  • Est. Priority Date: 03/23/2012
  • Status: Active Grant
First Claim
Patent Images

1. A method of making a semiconductor device, comprising:

  • providing a carrier with a die attach area;

    disposing a semiconductor die over the die attach area;

    disposing a modular interconnect unit over the carrier in a peripheral region around the semiconductor die;

    depositing an encapsulant over the carrier, semiconductor die, and modular interconnect unit;

    removing a first portion of the encapsulant to expose the semiconductor die while leaving a second portion of the encapsulant over the modular interconnect unit;

    removing the carrier; and

    forming an interconnect structure over the semiconductor die or modular interconnect unit.

View all claims
  • 8 Assignments
Timeline View
Assignment View
    ×
    ×