Semiconductor module

• US 8,810,026 B2
• Filed: 09/02/2010
• Issued: 08/19/2014
• Est. Priority Date: 09/02/2010
• Status: Active Grant

• Current Assignee: DENSO Corporation
• Original Assignee: Toyota Jidosha Kabushiki Kaisha (Toyota Motor Corporation)
• Inventors: Kadoguchi, Takuya, Suzuki, Yoshikazu, Miyoshi, Tatsuya, Okumura, Tomomi, Kaji, Masaya, Nakajima, Kiyofumi, Kawashima, Takanori
• Primary Examiner(s): Quach, Tuan N.
• Application Number:
  US13/819,221
• Publication Number:
  US 20130154081A1
• Time in Patent Office: 1,447 Days
• Field of Search: 257/670, 257/671, 257/675, 257/701, 257/706, 257/707, 257/712, 257/717, 257/E23.031, 257/E23.101, 257/E23.102, 438/122, 438/123
• US Class Current: 257/712
• CPC Class Codes: H01L 2224/29099 Material
• CPC Class Codes: H01L 2224/30181 On opposite sides of the body
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/371 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/40095 Kinked
• CPC Class Codes: H01L 2224/40247 Connecting the strap to a bond pad of the item
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48245 the item being metallic
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73215 Layer and wire connectors
• CPC Class Codes: H01L 2224/73221 Strap and wire connectors
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/83801 Soldering or alloying
• CPC Class Codes: H01L 2224/84801 Soldering or alloying
• CPC Class Codes: H01L 23/34 Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements thermal treatment apparatus H01L21/00
• CPC Class Codes: H01L 23/36 Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks H01L23/28, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence; heating H01L23/345
• CPC Class Codes: H01L 23/4006 with bolts or screws
• CPC Class Codes: H01L 23/4334 Auxiliary members in encapsulations H01L23/49568 takes precedence
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 23/49537 : Plurality of lead frames mounted in one device
• CPC Class Codes: H01L 24/29 : of an individual layer connector
• CPC Class Codes: H01L 24/30 : of a plurality of layer connectors
• CPC Class Codes: H01L 24/32 : of an individual layer connector
• CPC Class Codes: H01L 24/37 : of an individual strap connector
• CPC Class Codes: H01L 24/40 : of an individual strap connector
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/84 : using a strap connector
• CPC Class Codes: H01L 25/072 : the devices being arranged next to each other
• CPC Class Codes: H01L 25/115 : the devices being arranged next to each other
• CPC Class Codes: H01L 25/117 : Stacked arrangements of devices
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/1305 : Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13055 : Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/1306 : Field-effect transistor [FET]
• CPC Class Codes: H01L 2924/13091 : Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/181 : Encapsulation

Abstract

A semiconductor module which includes a semiconductor device; a wiring member that is connected to the semiconductor device; a cooling plate that includes a first surface on a side of the semiconductor device and a second surface on a side opposite to the first surface and has a fastening portion at an end thereof in a first direction; and a molded portion that is formed by molding a resin on the semiconductor device, the wiring member and the cooling plate, wherein the fastening portion is exposed out of the molded portion, and a terminal portion of the wiring member is exposed out of the molded portion such that the terminal portion of the wiring member extends in a second direction which is substantially perpendicular to the first direction.

Claims

1. A semiconductor module comprising:

a semiconductor device;

a wiring member that is connected to the semiconductor device;

a cooling plate that includes a first surface on a side of the semiconductor device and a second surface on a side opposite to the first surface and has a fastening portion at an end thereof in a first direction;

a molded portion that is formed by molding a resin on the semiconductor device, the wiring member and the cooling plate,

a heat sink part that is provided between the semiconductor device and the first surface of the cooling plate on the side of the semiconductor device; and

an insulating material that is provided between the heat sink part and the first surface of the cooling plate on the side of the semiconductor device;

wherein the fastening portion is exposed out of the molded portion, and a terminal portion of the wiring member is exposed out of the molded portion such that the terminal portion of the wiring member extends in a second direction which is substantially perpendicular to the first direction,

the heat sink part and the insulating material are disposed in the molded portion,

the cooling plate includes fins on the second surface,

the insulating material includes an end that extends outwardly with respect to an end of the heat sink part, and

the fins of the cooling plate are formed at a center side with respect to the end of the heat sink part.

2. The semiconductor module of claim 1, wherein the terminal portion of the wiring member is exposed out of the molded portion only in the first direction.

3. The semiconductor module of claim 1, wherein the wiring member is formed by a lead frame.

4. The semiconductor module of claim 1, wherein the molded portion includes an extended side portion at a region of the cooling plate where the fastening portion does not exist, the extended side portion extending to be coplanar with the second surface of the cooling plate such that it is brought into intimate contact with a side surface of the cooling plate.

5. The semiconductor module of claim 4, wherein the second surface of the cooling plate includes a thin portion, and

the extended side portion of the molded portion covers the second surface of the cooling plate at the thin portion.

6. The semiconductor module of claim 1, wherein a seal portion is provided between a fluid channel for a cooling medium and the second surface of the cooling plate and at a center side with respect to the fastening portion.

7. The semiconductor module of claim 1, wherein the molded portion includes a rib portion at a side portion region thereof where the terminal portion of the wiring member is exposed, the rib portion projecting outwardly with respect a neighboring side portion region.

8. The semiconductor module of claim 1, wherein the cooling plate includes fastening portions provided at opposite ends thereof in the first direction,

the fastening portions of the cooling plate are formed in a region that projects in the first direction with respect to another region in the corresponding ends of the cooling plate,

the molded portion is formed at a center side of the cooling plate in the first direction with respect to the fastening portions of the cooling plate, and

the fastening portion of one end of the cooling plate is formed at a position that has an offset in the second direction with respect to the fastening portion of another end of the cooling plate.

9. The semiconductor module of claim 1, wherein the cooling plate includes fastening portions provided at opposite ends thereof in the first direction,

the fastening portions of the cooling plate are formed to have a thickness smaller than a center portion of the cooling plate, and

the fastening portion of one end of the cooling plate in the first direction is coplanar with the first surface of the cooling plate on the side of the semiconductor device, and the fastening portion of another end of the cooling plate in the first direction is coplanar with the second surface of the cooling plate.

10. The semiconductor module of claim 1, wherein the cooling plate is fastened to a channel forming member at the fastening portion, the channel forming member forming a cooling medium channel in which a cooling medium flows.

11. A hybrid system comprising the semiconductor module of claim 1.