Dust protection apparatus for flat loudspeakers

• US 8,811,634 B2
• Filed: 04/22/2010
• Issued: 08/19/2014
• Est. Priority Date: 04/23/2009
• Status: Active Grant

• Current Assignee: Audio Pixels Ltd. (Audio Pixels Holdings Ltd.)
• Original Assignee: Audio Pixels Ltd. (Audio Pixels Holdings Ltd.)
• Inventors: Kaplan, Shay, Cohen, Yuval, Lewin, Daniel, Ben Simon, Meir
• Primary Examiner(s): Ni, Suhan
• Application Number:
  US13/265,227
• Publication Number:
  US 20120033846A1
• Time in Patent Office: 1,580 Days
• Field of Search: 381/152, 381/353, 381170-181, 381/184, 381/186, 381391-392, 381/189, 381/386
• US Class Current: 381/189
• CPC Class Codes: H04R 1/023 Screens for loudspeakers
• CPC Class Codes: H04R 31/00 Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor manufacture of microstructural arrangements of deformable or non-deformable structures in general B81C1/00182
• CPC Class Codes: Y10T 29/49005 Acoustic transducer

Abstract

A method for fabricating flat loudspeakers comprising manufacturing a flat loudspeaker including at least one microspeaker array, having first and second main surfaces; and covering at least one of the main surfaces of the loudspeaker with a cover member including an airtight sound-pressure wave transparent thin polymer film.

Claims

1. A system including a flat loudspeaker including at least one microspeaker array and a dust protection cover apparatus, the dust protection cover apparatus comprising:

a cover member including an airtight sound-pressure wave transparent thin polymer film,

wherein the thickness of the film is between 0.1 microns and 10 microns thick so that it cannot absorb energy and transmits sound at frequencies from 20 Hz to 100 kHz and the film covers substantially the whole area of the at least one microspeaker array.

2. System according to claim 1 wherein said loudspeaker includes a plurality of speaker element arrays on a substrate;

and wherein the loudspeaker is surrounded with at least one frame on which the sound-pressure wave transparent thin polymer film is mounted, and wherein said frame has two main sides and is operative to equalize pressure between its said two main sides.

3. System according to claim 2 and wherein pressure equalization is achieved by using vent holes in the frame.

4. System according to claim 3 wherein a dust filter is deployed inside said vent holes to filter dust out of incoming air.

5. System according to claim 1 wherein the thickness of the film is of an order of magnitude of 2 microns.

6. System according to claim 1 wherein said polymer is selected from the following group:

Nitrocellulose, Polyimide, Polyethylene, Polyester, Parylene.

7. System according to claim 1 wherein the film is mounted offset from the surface using a spacer frame.

8. System according to claim 7 wherein said sound-pressure wave transparent thin polymer film is attached via an adhesive to said frame.

9. System according to claim 8 wherein said loudspeaker has at least one recess for controlling the flow of an adhesive used to attach said film to said frame.

10. System according to claim 7 wherein said pressure is equalized by said frame having on at least one of its surfaces a groove allowing air transfer from one side of the frame to the other.

11. System according to claim 10 wherein said groove comprises a meandering groove.

12. System according to claim 8 wherein said adhesive is porous and allows air to flow through it.

13. System according to claim 7 wherein said sound-pressure wave transparent thin polymer film is thermally bonded to said frame.

14. System according to claim 7 wherein said sound-pressure wave transparent thin polymer film is ultrasonically welded to said frame.

15. System according to claim 7 wherein said sound-pressure wave transparent thin polymer film is laser welded to said frame.

16. System according to claim 7 wherein said pressure is equalized by said frame such that said frame includes a wall disposed over a groove formed in the surface to which said frame is attached allowing air transfer from one side of the frame to the other.

17. System according to claim 7 and wherein pressure equalization is achieved by forming the frame of porous material defining holes, so as not to let airborne particles larger than a few microns pass through the holes.

18. System according to claim 7 wherein said frame has two main sides and wherein said pressure is equalized by said frame having vent holes connecting said two sides of said frame.

19. System according to claim 18 wherein said holes contain a porous material.

20. System according to claim 1 wherein said film is made from a polymer able to withstand temperatures used during solder reflow.

21. System according to claim 1 wherein said flat loudspeaker surface is treated to become hydrophobic.

22. System according to claim 1 wherein said loudspeaker includes a plurality of speaker element arrays.

23. System according to claim 1 wherein said sound-pressure wave transparent thin polymer film is attached to both top and bottom surfaces of said flat loudspeaker.

24. System according to claim 1 and also comprising a flat loudspeaker including at least one microspeaker array which is covered by said cover member.

25. System according to claim 1 wherein the film is mounted offset from the surface using a spacer frame and wherein pressure equalization is achieved by using a frame whose surface has at least one meandering channels crossing from the outside to the inside of the frame.

26. System according to claim 1 wherein said loudspeaker includes a plurality of speaker element arrays on a substrate;

and wherein loudspeaker is surrounded with at least one frame on which the sound-pressure wave transparent thin polymer film is mounted, and wherein said frame is an integral part of said substrate onto which at least one said array is attached.

27. System according to claim 26 wherein said frame and film also cover at least one electrical connection connecting said substrate to at least one said array.