DC-DC converter semiconductor die structure
First Claim
1. Circuitry comprising:
- a direct current (DC)-DC converter semiconductor die comprising;
a first layer including;
a first series alpha switching element; and
a second series alpha switching element;
a second layer over the first layer and including;
a first alpha flying capacitor connection node, which is vertically aligned with the second series alpha switching element; and
a second alpha flying capacitor connection node, which is vertically aligned with the first series alpha switching element; and
an alpha flying capacitive element electrically coupled between the first alpha flying capacitor connection node and the second alpha flying capacitor connection node.
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Abstract
A direct current (DC)-DC converter having a DC-DC converter semiconductor die and an alpha flying capacitive element is disclosed. The DC-DC converter semiconductor die includes a first series alpha switching element, a second series alpha switching element, a first alpha flying capacitor connection node, which is about over the second series alpha switching element, and a second alpha flying capacitor connection node, which is about over the first series alpha switching element. The alpha flying capacitive element is electrically coupled between the first alpha flying capacitor connection node and the second alpha flying capacitor connection node. By locating the first alpha flying capacitor connection node and the second alpha flying capacitor connection node about over the second series alpha switching element and the first series alpha switching element, respectively, lengths of transient current paths may be minimized, thereby reducing noise and potential interference.
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Citations
25 Claims
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1. Circuitry comprising:
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a direct current (DC)-DC converter semiconductor die comprising; a first layer including; a first series alpha switching element; and a second series alpha switching element; a second layer over the first layer and including; a first alpha flying capacitor connection node, which is vertically aligned with the second series alpha switching element; and a second alpha flying capacitor connection node, which is vertically aligned with the first series alpha switching element; and an alpha flying capacitive element electrically coupled between the first alpha flying capacitor connection node and the second alpha flying capacitor connection node. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. Circuitry comprising:
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a direct current (DC)-DC converter semiconductor die comprising; a first series alpha switching element; a second series alpha switching element; a first alpha flying capacitor connection node about over the second series alpha switching element; a second alpha flying capacitor connection node about over the first series alpha switching element; a first alpha charging switching element adjacent to the first series alpha switching element; and a second alpha charging switching element between the first series alpha switching element and the second series alpha switching element; and an alpha flying capacitive element electrically coupled between the first alpha flying capacitor connection node and the second alpha flying capacitor connection node. - View Dependent Claims (14, 15, 16, 17, 18, 19)
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20. Circuitry comprising:
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a direct current (DC)-DC converter semiconductor die comprising; a first series alpha switching element; a second series alpha switching element; a first alpha flying capacitor connection node about over the second series alpha switching element; a second alpha flying capacitor connection node about over the first alpha switching element; a first series beta switching element; a second series beta switching element; a first beta flying capacitor connection node about over the second series beta switching element; and a second beta flying capacitor connection node about over the first series beta switching element; an alpha flying capacitive element electrically coupled between the first alpha flying capacitor connection node and the second alpha flying capacitor connection node. - View Dependent Claims (21, 22, 23, 24)
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25. A method comprising:
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providing a direct current (DC)-DC converter semiconductor die comprising; a first layer including; a first series alpha switching element; and a second series alpha switching element; a second layer over the first layer and including; a first alpha flying capacitor connection node, which is vertically aligned with the second series alpha switching element; and a second alpha flying capacitor connection node, which is vertically aligned with the first series alpha switching element; and providing an alpha flying capacitive element electrically coupled between the first alpha flying capacitor connection node and the second alpha flying capacitor connection node.
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Specification