Electrosurgical electrode and method of manufacturing same

• US 8,814,861 B2
• Filed: 01/11/2006
• Issued: 08/26/2014
• Est. Priority Date: 05/12/2005
• Status: Active Grant

• Current Assignee: Innovatech, LLC
• Original Assignee: Innovatech, LLC
• Inventors: Nesbitt, Bruce
• Primary Examiner(s): PEFFLEY, MICHAEL F
• Application Number:
  US11/330,499
• Publication Number:
  US 20060259033A1
• Time in Patent Office: 3,149 Days
• Field of Search: 606 32- 52
• US Class Current: 606/45
• CPC Class Codes: A61B 17/320016 Endoscopic cutting instruments, e.g. arthroscopes, resectoscopes A61B10/0233, A61B17/29, A61B17/3207 take precedence
• CPC Class Codes: A61B 18/14 Probes or electrodes therefor
• CPC Class Codes: A61B 18/1402 Probes for open surgery
• CPC Class Codes: A61B 2017/0088 ceramic
• CPC Class Codes: A61B 2017/00889 antimicrobial, disinfectant
• CPC Class Codes: A61B 2018/0013 non-sticking
• CPC Class Codes: A61B 2018/00595 Cauterization
• CPC Class Codes: A61B 2018/00607 Coagulation and cutting with the same instrument
• CPC Class Codes: A61B 2018/1412 Blade
• CPC Class Codes: A61B 2018/1417 Ball
• CPC Class Codes: A61B 2018/1425 Needle
• CPC Class Codes: A61B 2018/144 Wire
• CPC Class Codes: B05D 1/06 Applying particulate materials
• CPC Class Codes: B05D 1/12 Applying particulate materials B05D1/06, B05D1/10 take precedence

Abstract

An electrosurgical device coated an epoxy modified rigid silicone powder coating which includes a solvent-free hydroxyl functional solid phenyl silicone resin in the range of about 40% to about 60% parts per weight of the coating; a calcium metasilicate in the range of about 20% to about 40% parts per weight of the coating; an epoxy cresol novalac resin in the range of about 5% to about 15% parts per weight of the coating; an ultra-fine air micronized muscovite mica in the range of about 0% to about 10% parts per weight of the coating; a 60% active powder version of a methyl alkyl polysiloxane in the range of about 3% to about 7% parts per weight of the coating; a high temperature calcination of coprecipitated compound with manganese-copper-iron in the range of about 0% to about 10% parts per weight of the coating; an o-cresol novolac resin in the range of about 0.5% to about 3% parts per weight of the coating; and an acrylate copolymer in the range of about 0.5% to about 3% parts per weight of the coating. This coating is applied to the surfaces of an electrosurgical device minimize the build-up of charred tissue (i.e., eschar) on the surfaces of the electrosurgical device.

Claims

1. An electrosurgical device including an electrode, a handle connectable to the electrode and an electrical transfer member configured to transfer electrical energy to the electrode for contacting tissue in a body during an electrosurgical procedure, said electrode comprising:

a conductive substrate including a surface;

a bonding material applied to a first portion of the surface of the substrate, said bonding material including a solvent; and

at least one epoxy modified rigid silicone powder coating applied to the bonding material, wherein the epoxy modified rigid silicone powder coating includes a plurality of the epoxy modified rigid silicone powder particles each previously ground to a size of no greater than one-hundred-fifty microns and the epoxy modified rigid silicone powder coating at least includes;

(a) about 50% parts per weight of a solvent-free hydroxyl functional solid phenyl silicone resin;

(b) about 23.5% parts per weight of a calcium metasilicate;

(c) about 10% parts per weight of an epoxy cresol novalac resin;

(d) about 5% parts per weight of a 60% active powder version of a methyl alkyl polysiloxane;

(e) about 1.5% parts per weight of an o-cresol novolac resin; and

(f) about 1% parts per weight of an acrylate copolymer.

2. The electrosurgical device of claim 1, wherein the epoxy modified rigid silicone powder coating includes about 5% parts per weight of an ultra-fine air micronized muscovite mica.

3. The electrosurgical device of claim 1, wherein the epoxy modified rigid silicone powder coating includes about 4% parts per weight of a high temperature calcination of coprecipitated compound with manganese-copper-iron.

4. The electrosurgical device of claim 1, wherein the conductive substrate includes a metal.

5. The electrosurgical device of claim 1, wherein at least a portion of the conductive substrate includes an electrically insulative material, which is applied to at least a second portion of the surface of the conductive substrate.

6. The electrosurgical device of claim 1, wherein a plurality of anti-microbial particles are interspersed in said epoxy modified rigid silicone powder coating.

7. An electrosurgical device comprising:

a conductive substrate including a surface, a proximal end and a distal end;

a handle connectable to the proximal end of said substrate;

at least one electrical transfer member connectable to the handle, which transfers electrical energy from an electrical source through the handle to the conductive substrate;

a bonding material applied to a first portion of the surface of the substrate, said bonding material including a solvent; and

at least one layer of epoxy modified rigid silicone powder coating applied to the bonding material, wherein the epoxy modified rigid silicone powder coating includes a plurality of the epoxy modified rigid silicone powder particles each previously ground to a size of no greater than one-hundred-fifty microns and the epoxy modified rigid silicone powder coating at least includes;

(a) a solvent-free hydroxyl functional solid phenyl silicone resin in the range of about 40% to about 60% parts per weight of the epoxy modified rigid silicone powder coating;

(b) a calcium metasilicate in the range of about 20% to about 40% parts per weight of the epoxy modified rigid silicone powder coating;

(c) an epoxy cresol novalac resin in the range of about 5% to about 15% parts per weight of the epoxy modified rigid silicone powder coating;

(d) a 60% active powder version of a methyl alkyl polysiloxane in the range of about 3% to about 7% parts per weight of the epoxy modified rigid silicone powder coating;

(e) an o-cresol novolac resin in the range of about 0.5% to about 3% parts per weight of the epoxy modified rigid silicone powder coating; and

(f) an acrylate copolymer in the range of about 0.5% to about 3% parts per weight of the epoxy modified rigid silicone powder coating.

8. The electrosurgical device of claim 7, wherein the epoxy modified rigid silicone powder coating includes an ultra-fine air micronized muscovite mica in the range of about 0% to about 10% parts per weight of the epoxy modified rigid silicone powder coating.

9. The electrosurgical device of claim 7, wherein the epoxy modified rigid silicone powder coating includes a high temperature calcination of coprecipitated compound with manganese-copper-iron in the range of about 0% to about 10% parts per weight of the epoxy modified rigid silicone powder coating.

10. The electrosurgical device of claim 7, wherein the epoxy modified rigid silicone powder coating includes an aluminum pigment in the range of about 0% to about 6% parts per weight of the epoxy modified rigid silicone powder coating.

11. The electrosurgical device of claim 7, wherein the epoxy modified rigid silicone powder coating includes an ultra marine blue pigment in the range of about 0% to about 10% parts per weight of the epoxy modified rigid silicone powder coating.

12. The electrosurgical device of claim 7, wherein the conductive substrate includes a metal.

13. The electrosurgical device of claim 7, wherein the epoxy modified rigid silicone powder coating includes a plurality of anti-microbial particles.

14. The electrosurgical device of claim 7, wherein at least a portion of the conductive substrate includes an electrically insulative material, which is applied to at least a second portion of the surface of the conductive substrate.

15. A method of coating an electrosurgical device including a conductive substrate, said method comprising the steps of:

(a) grinding a plurality of epoxy modified rigid silicone powder particles each to a size of no greater than one-hundred-fifty microns, wherein the epoxy modified rigid silicone powder particles at least include;

(i) about 50% parts per weight of a solvent-free hydroxyl functional solid phenyl silicone resin;

(ii) about 23.5% parts per weight of a calcium metasilicate;

(iii) about 10% parts per weight of an epoxy cresol novalac resin;

(iv) about 5% parts per weight of a 60% active powder version of a methyl alkyl polysiloxane;

(v) about 1.5% parts per weight of an o-cresol novolac resin; and

(vi) about 1% parts per weight of an acrylate copolymer;

(b) applying a wet bonding material to a first portion of a surface of the conductive substrate, said wet bonding material including a solvent;

(c) evenly applying a coating of plurality of ground epoxy modified rigid silicone powder particles to the wet bonding material; and

(d) at least partially curing the wet bonding material and the epoxy modified rigid silicone powder coating.

16. The method of claim 15, wherein the epoxy modified rigid silicone powder coating includes a plurality of anti-microbial particles.

17. The method of claim 15, which includes the step of applying an electrically insulative material to at least a second portion of the surface of the conductive substrate.

18. The method of claim 15, wherein the epoxy modified rigid silicone powder coating includes about 5% parts per weight of an ultra-fine air micronized muscovite mica.

19. The method of claim 15, wherein the epoxy modified rigid silicone powder coating includes about 4% parts per weight of a high temperature calcination of coprecipitated compound with manganese-copper-iron.

20. The method of claim 15, which includes:

(i) charging the plurality of epoxy modified rigid silicone powder particles before evenly applying the coating of the plurality of epoxy modified rigid silicone powder particles to the wet bonding material, and

(ii) grounding the applied wet bonding material before evenly applying the coating of the plurality of epoxy modified rigid silicone powder particles to the wet bonding material.

21. The method of claim 20, wherein the step of evenly applying the coating of the plurality of epoxy modified rigid silicone powder particles to the wet bonding material includes electrostatically applying the charged epoxy modified rigid silicone powder particles to the wet bonding material.

22. A method of coating an electrosurgical device including a conductive substrate, said method comprising the steps of:

(a) grinding a plurality of epoxy modified rigid silicone powder particles each to a size of no greater than one-hundred-fifty microns each, wherein the epoxy modified rigid silicone powder particles at least include;

(i) a solvent-free hydroxyl functional solid phenyl silicone resin in the range of about 40% to about 60% parts per weight of the epoxy modified rigid silicone powder coating;

(ii) a calcium metasilicate in the range of about 20% to about 40% parts per weight of the epoxy modified rigid silicone powder coating;

(iii) an epoxy cresol novalac resin in the range of about 5% to about 15% parts per weight of the epoxy modified rigid silicone powder coating;

(iv) a 60% active powder version of a methyl alkyl polysiloxane in the range of about 3% to about 7% parts per weight of the epoxy modified rigid silicone powder coating;

(v) an o-cresol novolac resin in the range of about 0.5% to about 3% parts per weight of the epoxy modified rigid silicone powder coating; and

(vi) an acrylate copolymer in the range of about 0.5% to about 3% parts per weight of the epoxy modified rigid silicone powder coating;

(b) applying a wet bonding material to a first portion of a surface of the conductive substrate, said wet bonding material including a solvent;

(c) evenly applying a coating of the plurality of ground epoxy modified rigid silicone powder particles to the wet bonding material; and

(d) at least partially curing the wet bonding material and the epoxy modified rigid silicone powder coating.

23. The method of claim 22, wherein the epoxy modified rigid silicone powder coating includes a plurality of anti-microbial particles.

24. The method of claim 22, which includes the step of applying an electrically insulative material to at least a second portion of the surface of the conductive substrate.

25. The method of claim 22, wherein the epoxy modified rigid silicone powder coating includes an ultra-fine air micronized muscovite mica in the range of about 0% to about 10% parts per weight of the epoxy modified rigid silicone powder coating.

26. The method of claim 22, wherein the epoxy modified rigid silicone powder coating includes a high temperature calcination of coprecipitated compound with manganese-copper-iron in the range of about 0% to about 10% parts per weight of the epoxy modified rigid silicone powder coating.

27. The method of claim 22, wherein the epoxy modified rigid silicone powder coating includes an aluminum pigment in the range of about 0% to about 6% parts per weight of the epoxy modified rigid silicone powder coating.

28. The method of claim 22, wherein the epoxy modified rigid silicone powder coating includes an ultra marine blue in the range of about 0% to about 10% parts per weight of the epoxy modified rigid silicone powder coating.

29. The method of claim 22, which includes:

(i) charging the plurality of epoxy modified rigid silicone powder particles before evenly applying the coating of the plurality of epoxy modified rigid silicone powder particles to the wet bonding material, and

(ii) grounding the applied wet bonding material before evenly applying the coating of the plurality of epoxy modified rigid silicone powder particles to the wet bonding material.

30. The method of claim 29, wherein the step of evenly applying the coating of the plurality of epoxy modified rigid silicone powder particles to the wet bonding material includes electrostatically applying the charged epoxy modified rigid silicone powder particles to the wet bonding material.