Electrosurgical electrode and method of manufacturing same

• US 8,814,862 B2
• Filed: 12/11/2006
• Issued: 08/26/2014
• Est. Priority Date: 05/12/2005
• Status: Active Grant

• Current Assignee: Innovatech, LLC
• Original Assignee: Innovatech, LLC
• Inventors: Nesbitt, Bruce
• Primary Examiner(s): PEFFLEY, MICHAEL F
• Application Number:
  US11/637,445
• Publication Number:
  US 20070118113A1
• Time in Patent Office: 2,815 Days
• Field of Search: 606/41, 606 45- 50
• US Class Current: 606/45
• CPC Class Codes: A61B 18/1402 Probes for open surgery
• CPC Class Codes: A61B 2018/0013 non-sticking

Abstract

An electrosurgical device coated with powder coatings including a silicone resin and siloxane additive without fluoropolymers. In the powder coatings, the silicone resin is methyl phenyl silicone or phenyl silicone or methyl polysiloxane or phenyl alkyl polysiloxane resin and the additive is either methyl alkyl polysiloxane or dimethyl polysiloxane. This coating is applied to the surfaces of an electrosurgical device minimize the build-up of charred tissue on the surfaces of the electrosurgical device.

Claims

1. An electrosurgical electrode connectible to a handle, said electrosurgical electrode comprising:

a conductive substrate including a surface; and

a bonding material and at least one epoxy modified rigid silicone powder coating applied to at least a first portion of the surface of the substrate, said at least one epoxy modified rigid silicone powder coating including a plurality of epoxy modified rigid silicone powder particles each having a size of no greater than one-hundred-fifty microns.

2. The electrosurgical electrode of claim 1, wherein each of the epoxy modified rigid silicone powder particles includes a rigid silicone resin and a polysiloxane additive.

3. The electrosurgical electrode of claim 2, wherein the silicone resin is selected from the group consisting of:

a phenyl polysiloxane powder resin, a methyl polysiloxane powder resin, a methyl phenyl siloxane powder resin, a phenyl silicone powder, a methyl phenyl silicone, a methyl phenyl polysiloxane powder resin and a phenyl alkyl polysiloxane powder resin.

4. The electrosurgical electrode of claim 2, wherein the polysiloxane additive is selected from the group consisting of:

a methyl alkyl polysiloxane, a dimethyl polysiloxane and a methyl phenyl siloxane.

5. The electrosurgical electrode of claim 1, wherein each of the epoxy modified rigid silicone powder particles includes a rigid silicone resin.

6. The electrosurgical electrode of claim 5, wherein the silicone resin is selected from the group consisting of:

a phenyl polysiloxane powder resin, a methyl polysiloxane powder resin, a methyl phenyl siloxane powder resin, a phenyl silicone powder, a methyl phenyl silicone, a methyl phenyl polysiloxane powder resin and a phenyl alkyl polysiloxane powder resin.

7. The electrosurgical electrode of claim 1, wherein each of the epoxy modified rigid silicone powder particles includes a polysiloxane additive.

8. The electrosurgical electrode of claim 7, wherein the polysiloxane additive is selected from the group consisting of:

a methyl alkyl polysiloxane, a dimethyl polysiloxane and a methyl phenyl siloxane.

9. The electrosurgical electrode of claim 1, wherein the conductive substrate includes a metal.

10. The electrosurgical electrode of claim 9, wherein the metal includes stainless steel.

11. The electrosurgical electrode of claim 1, which includes an electrically insulative material applied to at least a second portion of the surface of the conductive substrate.

12. The electrosurgical electrode of claim 11, wherein the second portion of the surface of the conductive substrate underneath the electrically insulative material includes the epoxy modified rigid silicone powder coating.

13. The electrosurgical electrode of claim 1, wherein a plurality of anti-microbial particles are interspersed in said epoxy modified rigid silicone powder coating.

14. The electrosurgical electrode of claim 13, wherein the anti-microbial particles include at least one of the group consisting of:

silver particles and ceramic particles.

15. The electrosurgical electrode of claim 1, which includes a single substantially uniform layer of the epoxy modified rigid silicone powder particles.

16. The electrosurgical electrode of claim 1, wherein the bonding material includes a primer.

17. The electrosurgical electrode of claim 1, wherein the bonding material includes an ultraviolet light cure resin.

18. The electrosurgical electrode of claim 1, wherein the bonding material includes an electron beam cure resin.

19. The electrosurgical electrode of claim 1, wherein the plurality of epoxy modified rigid silicone powder particles include a plurality of different sized epoxy modified rigid silicone powder particles.

20. The electrosurgical electrode of claim 1, which includes a top coat selected from the group consisting of:

an abrasive resistant coating, a non-stick coating, an anti-microbial coating and an electrically conductive coating.

21. The electrosurgical electrode of claim 1, wherein at least part of the conductive substrate forms a shape selected from the group consisting of:

a blade, a knife, a wire and a ball.

22. An electrosurgical electrode connectible to a handle, said electrosurgical electrode comprising:

a conductive substrate including a surface; and

a bonding material and at least one epoxy modified rigid silicone powder coating applied to at least a first portion of the surface of the substrate, wherein the epoxy modified rigid silicone powder coating includes;

(i) a plurality of electrically conductive particles, and (ii) a plurality of epoxy modified rigid silicone powder particles each having a size of no greater than one-hundred-fifty microns.

23. An electrosurgical electrode connectible to a handle, said handle including at least one electrical transfer member configured to transfer electrical energy from an electrical source, said electrosurgical electrode comprising:

a conductive substrate configured to receive said electrical energy; and

a bonding material and at least one layer of epoxy modified rigid silicone powder applied to at least a first portion of a surface of the substrate, said epoxy modified rigid silicone powder including a plurality of epoxy modified rigid silicone powder particles each having a size of no greater than one-hundred-fifty microns.

24. The electrosurgical electrode of claim 23, wherein each of the epoxy modified rigid silicone powder particles includes a rigid silicone resin and a polysiloxane additive.

25. The electrosurgical electrode of claim 24, wherein the silicone resin is selected from the group consisting of:

a phenyl polysiloxane powder resin, a methyl polysiloxane powder resin, a methyl phenyl siloxane powder resin, a phenyl silicone powder, a methyl phenyl silicone, a methyl phenyl polysiloxane powder resin and a phenyl alkyl polysiloxane powder resin.

26. The electrosurgical electrode of claim 24, wherein the polysiloxane additive is selected from the group consisting of:

a methyl alkyl polysiloxane, a dimethyl polysiloxane and a methyl phenyl siloxane.

27. The electrosurgical electrode of claim 23, wherein each of the epoxy modified rigid silicone powder particles includes a rigid silicone resin.

28. The electrosurgical electrode of claim 27, wherein the silicone resin is selected from the group consisting of:

a phenyl polysiloxane powder resin, a methyl polysiloxane powder resin, a methyl phenyl siloxane powder resin, a phenyl silicone powder, a methyl phenyl silicone, a methyl phenyl polysiloxane powder resin and a phenyl alkyl polysiloxane powder resin.

29. The electrosurgical electrode of claim 23, wherein each of the epoxy modified rigid silicone powder particles includes a polysiloxane additive.

30. The electrosurgical electrode of claim 29, wherein the polysiloxane additive is selected from the group consisting of:

a methyl alkyl polysiloxane, a dimethyl polysiloxane and a methyl phenyl siloxane.

31. The electrosurgical electrode of claim 23, wherein the conductive substrate includes a metal.

32. The electrosurgical electrode of claim 31, wherein the metal includes stainless steel.

33. The electrosurgical electrode of claim 23, wherein the epoxy modified rigid silicone powder includes a plurality of anti-microbial particles.

34. The electrosurgical electrode of claim 33, wherein the anti-microbial particles include at least one of the group consisting of:

silver particles and ceramic particles.

35. The electrosurgical electrode of claim 33, which includes an electrically insulative material applied to at least a second portion of the surface of the conductive substrate.

36. The electrosurgical electrode of claim 33, wherein the second portion of the surface of the conductive substrate underneath the electrically insulative material is coated with the epoxy modified rigid silicone powder.

37. The electrosurgical electrode of claim 23, wherein the bonding material includes a primer.

38. The electrosurgical electrode of claim 23, which includes a single substantially uniform layer of the epoxy modified rigid silicone powder particles.

39. The electrosurgical electrode of claim 23, wherein the bonding material includes an ultraviolet light cure resin.

40. The electrosurgical electrode of claim 23, wherein the bonding material includes an electron beam cure resin.

41. The electrosurgical electrode of claim 23, wherein the epoxy modified rigid silicone powder includes at least one electrically conductive pigment.

42. The electrosurgical electrode of claim 23, wherein the plurality of epoxy modified rigid silicone powder particles include a plurality of different sized epoxy modified rigid silicone powder particles.

43. The electrosurgical electrode of claim 23, which includes a top coat selected from the group consisting of:

an abrasive resistant coating, a non-stick coating, an anti-microbial coating and an electrically conductive coating.

44. The electrosurgical electrode of claim 23, wherein at least part of the conductive substrate forms a shape selected from the group consisting of:

a blade, a knife, a wire and a ball.

45. The electrosurgical electrode of claim 23, wherein said conductive substrate includes a proximal end connectible to the handle.

46. A method of coating an electrosurgical device including a conductive substrate, said method comprising the steps of:

(a) applying a wet bonding material to at least a first portion of a surface of the conductive substrate;

(b) applying an epoxy modified rigid silicone powder coating to the wet bonding material, said epoxy modified rigid silicone powder coating including a plurality of epoxy modified rigid silicone powder particles each having a size of no greater than one-hundred-fifty microns; and

(c) at least partially curing the wet bonding material and the epoxy modified rigid silicone powder coating.

47. The method of claim 46, wherein the wet bonding material includes a primer.

48. The method of claim 46, which includes the step of repeating (a) to (c) until a desired thickness is achieved.

49. The method of claim 46, wherein the epoxy modified rigid silicone powder coating includes a plurality of anti-microbial particles.

50. The method of claim 49, wherein the anti-microbial particles include at least one of the group consisting of:

silver particles and ceramic particles.

51. The method of claim 46, which includes applying an electrically insulative material to at least a second portion of the surface of the conductive substrate.

52. The method of claim 51, which includes applying the epoxy modified rigid silicone powder coating to the second portion of the surface of the conductive substrate underneath the insulative material.

53. The method of claim 46, wherein each of the epoxy modified rigid silicone powder particles includes a rigid silicone resin and a polysiloxane additive.

54. The method of claim 53, wherein the silicone resin is selected from the group consisting of:

a phenyl polysiloxane powder resin, a methyl polysiloxane powder resin, a methyl phenyl siloxane powder resin, a phenyl silicone powder, a methyl phenyl silicone, a methyl phenyl polysiloxane powder resin and a phenyl alkyl polysiloxane powder resin.

55. The method of claim 53, wherein the polysiloxane additive is selected from the group consisting of:

a methyl alkyl polysiloxane, a dimethyl polysiloxane and a methyl phenyl siloxane.

56. The method of claim 46, wherein each of the epoxy modified rigid silicone powder particles includes a rigid silicone resin.

57. The method of claim 56, wherein the silicone resin is selected from the group consisting of:

a phenyl polysiloxane powder resin, a methyl polysiloxane powder resin, a methyl phenyl siloxane powder resin, a phenyl silicone powder, a methyl phenyl silicone, a methyl phenyl polysiloxane powder resin and a phenyl alkyl polysiloxane powder resin.

58. The method of claim 46, wherein each of the epoxy modified rigid silicone powder particles includes a polysiloxane additive.

59. The method of claim 58, wherein the polysiloxane additive is selected from the group consisting of:

a methyl alkyl polysiloxane, a dimethyl polysiloxane and a methyl phenyl siloxane.

60. The method of claim 46, wherein the wet bonding material includes an ultraviolet light cure resin.

61. The method of claim 46, wherein the wet bonding material includes an electron beam cure resin.

62. The method of claim 46, wherein the plurality of epoxy modified rigid silicone powder particles include a plurality of different sized epoxy modified rigid silicone powder particles.

63. The method of claim 46, which includes applying a top coat to the epoxy modified rigid silicone powder coating, said top coat selected from the group consisting of:

an abrasive resistant coating, a non-stick coating, an anti-microbial coating and an electrically conductive coating.

64. The method of claim 46, which includes evenly applying the epoxy modified rigid silicone powder particles to the wet bonding material.

65. A method of coating an electrosurgical device including a conductive substrate, said method comprising the steps of:

(a) applying a wet bonding material to at least a first portion of a surface of the conductive substrate;

(b) applying an epoxy modified rigid silicone powder coating to the wet bonding material;

wherein the epoxy modified rigid silicone powder coating includes;

(i) at least one electrically conductive particle, and (ii) a plurality of epoxy modified rigid silicone powder particles each having a size of no greater than one-hundred-fifty microns; and

(c) at least partially curing the wet bonding material and the epoxy modified rigid silicone powder coating.

66. A method of coating an electrosurgical device including a conductive substrate, said method comprising the steps of:

(a) applying a wet bonding material to at least a first portion of a surface of the conductive substrate,

(b) charging a plurality of epoxy modified rigid silicone powder particles before applying a coating of the plurality of epoxy modified rigid silicone powder particles to the wet bonding material,

(c) grounding the conductive substrate and the applied wet bonding material before applying the coating of the plurality of epoxy modified rigid silicone powder particles to the wet bonding material,

(d) electrostatically applying the coating of the epoxy modified rigid silicone powder particles to the wet bonding material, and

(e) at least partially curing the wet bonding material and the epoxy modified rigid silicone powder coating.