Compact endocavity diagnostic probes for nuclear radiation detection

• US 8,816,292 B2
• Filed: 03/31/2011
• Issued: 08/26/2014
• Est. Priority Date: 04/01/2010
• Status: Active Grant

• Current Assignee: Hybridyne Imaging Technologies, Inc.
• Original Assignee: Hybridyne Imaging Technologies, Inc.
• Inventors: Cui, Yonggang, James, Ralph, Bolotnikov, Aleksey
• Primary Examiner(s): Gaworecki, Mark R
• Application Number:
  US13/077,627
• Publication Number:
  US 20110286576A1
• Time in Patent Office: 1,244 Days
• Field of Search: 250/336.1, 250/370.01, 250/370.08, 250/370.09, 600/407, 600/431, 600/436
• US Class Current: 250/370.09
• CPC Class Codes: A61B 1/051 Details of CCD assembly
• CPC Class Codes: A61B 6/06 Diaphragms
• CPC Class Codes: A61B 6/4208 characterised by using a particular type of detector
• CPC Class Codes: A61B 6/425 using detectors specially adapted to be used in the interior of the body
• CPC Class Codes: A61B 6/4258 for detecting non x-ray radiation, e.g. gamma radiation A61B6/037 takes precedence
• CPC Class Codes: A61B 6/4291 the detector being combined with a grid or grating
• CPC Class Codes: A61B 6/4417 related to combined acquisition of different diagnostic modalities
• CPC Class Codes: A61B 6/48 Diagnostic techniques A61B6/022, A61B6/025 A61B6/032, A61B6/037 take precedence
• CPC Class Codes: A61B 6/485 involving fluorescence X-ray imaging
• CPC Class Codes: A61B 6/50 specially adapted for specific body parts; specially adapted for specific clinical applications
• CPC Class Codes: A61B 8/08 Detecting organic movements or changes, e.g. tumours, cysts, swellings A61B8/02 - A61B8/06 take precedence
• CPC Class Codes: A61B 8/0875 for diagnosis of bone A61B5/4504 takes precedence
• CPC Class Codes: A61B 8/12 in body cavities or body tracts, e.g. by using catheters catheters per se A61M25/00
• CPC Class Codes: G01T 1/161 Applications in the field of nuclear medicine, e.g. in vivo counting apparatus for radiation diagnosis A61B6/00
• CPC Class Codes: G21K 1/025 using multiple collimators, e.g. Bucky screens; other devices for eliminating undesired or dispersed radiation
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14661 of the hybrid type
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

This invention relates to the field of radiation imaging. In particular, the invention relates to an apparatus and a method for imaging tissue or an inanimate object using a novel probe that has an integrated solid-state semiconductor detector and complete readout electronics circuitry.

Claims

1. A radiation imaging probe contained within a probe sheath, comprising:

a plurality of semiconductor detectors configured as an orthogonal strip detector;

a signal processing circuit attached to the plurality of semiconductor detectors to read out and process the signal produced by the detectors due to an absorption of the radiation; and

a power supply and associated power supply circuits;

wherein the plurality of semiconductor detectors is operable to detect x-ray or gamma ray radiation.

2. A radiation imaging probe contained within a probe sheath, comprising:

a plurality of semiconductor detectors configured in an array of individual detectors;

a signal processing circuit attached to the plurality of semiconductor detectors to read out and process the signal produced by the detectors due to an absorption of the radiation; and

a power supply and associated power supply circuits;

wherein the array of individual detectors is a virtual Frisch-grid detector array; and

wherein the plurality of semiconductor detectors is operable to detect x-ray or gamma ray radiation.

3. A radiation imaging probe contained within a probe sheath, comprising:

a plurality of semiconductor detectors wherein each of the plurality of semiconductor detectors include a semiconductor made from a compound of elements of groups III and V of the periodic table, of elements of groups II and VI of the periodic table, and of elements or alloys of group IV of the periodic table;

a signal processing circuit attached to the plurality of semiconductor detectors to read out and process the signal produced by the detectors due to an absorption of the radiation; and

a power supply and associated power supply circuits;

wherein the plurality of semiconductor detectors is operable to detect x-ray or gamma ray radiation.

4. The radiation imaging probe of claim 3, where the semiconductor is a single element crystal.

5. The radiation imaging probe of claim 3, wherein the semiconductor is a binary compound.

6. The radiation imaging probe of claim 3, wherein the semiconductor is aternary compound or alloy.

7. The radiation imaging probe of claim 3, wherein the semiconductor comprises CdZnTe, CdTe, CdMnTe, HgI₂, or TlBr.

8. The radiation imaging probe of claim 7, wherein the semiconductor is CdZnTe.

9. A radiation imaging probe contained within a probe sheath, comprising:

plurality of semiconductor detectors;

a collimator positioned on top of the plurality of semiconductor detectors;

a signal processing circuit, including a front-end electronic implemented as an application-specific integrated circuit (ASIC), attached to the plurality of semiconductor detectors to read out and process the signal produced by the detectors due to an absorption of the radiation; and

a power supply and associated power supply circuits;

wherein the plurality of radiation detectors is mounted directly on the ASIC; and

wherein the plurality of semiconductor detectors is operable to detect x-ray or gamma ray radiation.

10. The radiation imaging probe of claim 9, wherein connections between the semiconductor detector and ASIC use bump-bonding.