Sealed body, method for manufacturing sealed body, light-emitting device, and method for manufacturing light-emitting device

• US 8,816,336 B2
• Filed: 06/14/2012
• Issued: 08/26/2014
• Est. Priority Date: 06/16/2011
• Status: Expired due to Fees

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Shimomura, Akihisa
• Primary Examiner(s): Dang, Trung Q
• Application Number:
  US13/523,435
• Publication Number:
  US 20120319092A1
• Time in Patent Office: 803 Days
• Field of Search: 257/40, 257/E51.018
• US Class Current: 257/40
• CPC Class Codes: B32B 2309/02 Temperature
• CPC Class Codes: B32B 2309/105 Thickness
• CPC Class Codes: B32B 2309/60 In a particular environment
• CPC Class Codes: B32B 2309/65 Dust free, e.g. clean room
• CPC Class Codes: B32B 2310/0812 using induction
• CPC Class Codes: B32B 2310/0843 using laser
• CPC Class Codes: B32B 2457/20 Displays, e.g. liquid crystal displays, plasma displays
• CPC Class Codes: B32B 2457/206 Organic displays, e.g. OLED
• CPC Class Codes: B32B 37/06 characterised by the heating method
• CPC Class Codes: H01L 27/156 two-dimensional arrays
• CPC Class Codes: H01L 33/483 Containers
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: H10K 50/8426 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 59/8722 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 71/421 using coherent electromagnetic radiation, e.g. laser annealing
• CPC Class Codes: Y10T 428/24744 Longitudinal or transverse tubular cavity or cell

Abstract

A highly productive method for sealing substrates with the use of glass frit is provided. A method for sealing substrates with the use of glass frit, which can be used for a substrate provided with a material having low heat resistance, is provided. A highly airtight sealed body which is manufactured by such a method is provided. A light-emitting device having high productivity and high reliability and a manufacturing method thereof are provided. A heat generation layer containing a conductive material which generates heat by induction heating is formed to overlap with a region where a paste including a frit material and a binder is applied. Alternatively, a conductive material which generates heat by induction heating is added to the paste itself. The paste is locally heated by induction heating to remove the binder included in the paste.

Claims

1. A method for manufacturing a sealed body, comprising the steps of:

forming a heat generation layer over a first substrate;

forming a frit paste comprising a frit material and a binder over the heat generation layer;

heating the heat generation layer by induction heating to remove the binder and to fuse the frit material so that a glass frit is formed;

arranging the first substrate and a second substrate to interpose the glass frit therebetween; and

irradiating the glass frit with laser light to bond the glass frit to the second substrate.

2. The method for manufacturing a sealed body, according to claim 1, wherein a closed space surrounded by the first substrate, the second substrate, the glass frit, and the heat generation layer is formed.

3. The method for manufacturing a sealed body, according to claim 1, further comprising the step of forming a light-emitting unit comprising an EL element over a surface of the second substrate between the step of heating the heat generation layer and the step of arranging the first substrate and the second substrate.

4. The method for manufacturing a sealed body, according to claim 1, further comprising the step of forming a color filter over the first substrate between the step of forming the heat generation layer and the step of forming the frit paste.

5. The method for manufacturing a sealed body, according to claim 1, wherein the heat generation layer has a shape of a closed curve.

6. The method for manufacturing a sealed body, according to claim 1, wherein the heat generation layer comprises any one of iron, tungsten, and molybdenum.

7. The method for manufacturing a sealed body, according to claim 1, wherein the frit material comprises one or more compounds selected from magnesium oxide, calcium oxide, barium oxide, lithium oxide, sodium oxide, potassium oxide, boron oxide, vanadium oxide, zinc oxide, tellurium oxide, aluminum oxide, silicon dioxide, lead oxide, tin oxide, phosphorus oxide, ruthenium oxide, rhodium oxide, iron oxide, copper oxide, titanium oxide, tungsten oxide, bismuth oxide, and antimony oxide.

8. A method for manufacturing a sealed body, comprising the steps of:

forming a frit paste comprising a frit material, a binder, and a conductive material over a first substrate;

heating the fit paste by induction heating to remove the binder and to fuse the fit material so that a glass fit is formed;

arranging the first substrate and a second substrate to interpose the glass frit therebetween; and

irradiating the glass frit with laser light to bond the glass frit to the second substrate.

9. The method for manufacturing a sealed body, according to claim 8, wherein a closed space surrounded by the first substrate, the second substrate, and the glass frit is formed.

10. The method for manufacturing a sealed body, according to claim 8, further comprising the step of forming a light-emitting unit comprising an EL element over a surface of the second substrate between the step of heating the frit paste and the step of arranging the first substrate and the second substrate.

11. The method for manufacturing a sealed body, according to claim 8, further comprising the step of forming a color filter over the first substrate before the step of forming the frit paste.

12. The method for manufacturing a sealed body, according to claim 8, wherein the conductive material comprises any one of iron, tungsten, and molybdenum.

13. The method for manufacturing a sealed body, according to claim 8, wherein the conductive material is a powder material.

14. The method for manufacturing a sealed body, according to claim 13, wherein a diameter of the powder material is larger than or equal to 1 nm and smaller than or equal to 100 μ

m.

15. The method for manufacturing a sealed body, according to claim 8, wherein the frit material comprises one or more compounds selected from magnesium oxide, calcium oxide, barium oxide, lithium oxide, sodium oxide, potassium oxide, boron oxide, vanadium oxide, zinc oxide, tellurium oxide, aluminum oxide, silicon dioxide, lead oxide, tin oxide, phosphorus oxide, ruthenium oxide, rhodium oxide, iron oxide, copper oxide, titanium oxide, tungsten oxide, bismuth oxide, and antimony oxide.

16. A method for manufacturing a light-emitting device, comprising the steps of:

forming a heat generation layer over a first substrate;

forming a frit paste comprising a frit material and a binder over the heat generation layer;

heating the heat generation layer by induction heating to remove the binder and to fuse the frit material so that a glass frit is formed;

forming a sealant over the first substrate;

arranging the first substrate and a second substrate to interpose the glass frit and the sealant therebetween; and

irradiating the glass frit with laser light to bond the glass frit to the second substrate.

17. The method for manufacturing a light-emitting device, according to claim 16, wherein a closed space surrounded by the first substrate, the second substrate, the glass frit, and the heat generation layer is formed.

18. The method for manufacturing a light-emitting device, according to claim 16, further comprising the step of forming a light-emitting unit comprising an EL element over a surface of the second substrate between the step of heating the heat generation layer and the step of arranging the first substrate and the second substrate.

19. The method for manufacturing a light-emitting device, according to claim 16, further comprising the step of forming a color filter over the first substrate between the step of forming the heat generation layer and the step of forming the frit paste.

20. The method for manufacturing a light-emitting device, according to claim 16, wherein the heat generation layer has a shape of a closed curve.

21. The method for manufacturing a light-emitting device, according to claim 16, wherein the heat generation layer comprises any one of iron, tungsten, and molybdenum.

22. The method for manufacturing a light-emitting device, according to claim 16, wherein the second substrate is provided with a light-emitting unit.