LED packages with mushroom shaped lenses and methods of manufacturing LED light-emitting devices

• US 8,816,369 B2
• Filed: 04/27/2007
• Issued: 08/26/2014
• Est. Priority Date: 10/29/2004
• Status: Active Grant

• Current Assignee: LED Engin, Inc. (Ams-Osram AG)
• Original Assignee: LED Engin, Inc. (Ams-Osram AG)
• Inventors: Yan, Xiantao
• Primary Examiner(s): Tsai, H
• Application Number:
  US11/796,240
• Publication Number:
  US 20070241357A1
• Time in Patent Office: 2,678 Days
• Field of Search: 257 79- 84, 256 98-103, 256 88- 93, 256/E33.059
• US Class Current: 257/98
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2933/0058 relating to optical field-shaping elements
• CPC Class Codes: H01L 33/48 characterised by the semiconductor body packages
• CPC Class Codes: H01L 33/483 Containers
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/52 Encapsulations
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/64 Heat extraction or cooling elements

Abstract

Methods of fabricating a light-emitting device are provided. A light-emitting device can be formed from bonding a lens including a plug and a cap to an LED package including a socket configured to receive the plug. The lens can be fabricated using an injection mold formed from a well secured to the LED package and injecting a material into the injection mold to cure into a shape of the lens. The lens can also be fabricated using a blank about the shape of the lens and machining the blank to produce the plug and the cap of the lens. The lens can be bonded to the LED package using a convex bead of adhesive deposited on the surface of the LED package and spreading the adhesive between the lens and the LED package.

Claims

1. A light-emitting device comprising:

a package including;

a light-emitting side,

a top surface,

a socket including a socket sidewall and a bottom surface, the socket sidewall disposed between the top surface and the bottom surface of the package, the socket disposed on the light-emitting side of the package;

a cavity having a floor and configured to transmit light to the light emitting side of the package via the socket;

an LED disposed within the cavity and bonded to the floor of the cavity;

a thermal insulation layer disposed within the cavity between the LED and the top surface of the package; and

a luminescent layer within the cavity between the thermal insulation layer and the top surface of the package;

a class lens including a cap and a plug, the cap including an upper surface and a lower surface, the plug including a lower surface and a plug sidewall between the lower surface of the plug and the lower surface of the cap, the plug disposed within the socket and the lower surface of the cap disposed adjacent the top surface of the package; and

an adhesive layer disposed to attach the lower surface of the cap to the top surface of the package, wherein a portion the adhesive layer is disposed between the luminescent layer and the lower surface of the plug.

2. The light-emitting device of claim 1, wherein an angle defined between the socket sidewall and the bottom surface of the socket is less than 90 degrees.

3. The light-emitting device of claim 1, wherein an angle defined between the plug sidewall and the lower surface of the plug is different from an angle defined between the socket sidewall and the bottom surface of the socket.

4. The light-emitting device of claim 1, wherein an angle defined between the socket sidewall and the bottom surface of the socket is about 90 degrees, and an angle defined between the plug sidewall and the lower surface of the plug is greater than 90 degrees.

5. The light-emitting device of claim 1, wherein the floor is fabricated from aluminum nitride, the aluminum nitride having a width in a direction parallel to the top surface that is at least as wide as the top surface, the aluminum nitride having a thickness between 0.2 and 0.4 mm.

6. The light-emitting device of claim 1, wherein the thermal insulation layer includes a material having a thermal conductivity below 0.5 watts/meter-Kelvin.

7. The light-emitting device of claim 1, wherein the top surface includes an alignment layer.

8. The light-emitting device of claim 1, wherein the lens includes a first diameter and a second diameter, the second diameter greater than the first diameter.

9. The light-emitting device of claim 8, wherein a ratio of the first diameter to the second diameter is about 9 to 16.

10. The light-emitting device of claim 1, wherein the lower surface of the plug has a larger radius than a radius at the intersection of the plug sidewall and the lower surface of the cap.

11. The light-emitting device of claim 1, wherein a shape of the cap includes a Fresnel surface.

12. The light-emitting device of claim 1, wherein the thermal insulation layer does not include luminescent material.

13. The light-emitting device of claim 1, wherein the cavity further includes a protective capping layer between the luminescent layer and the top surface.

14. The light-emitting device of claim 2, wherein an angle defined between the plug sidewall and the lower surface of the plug is greater than 90 degrees, the lower surface of the plug has a first width, and the top of the socket sidewall has a second width greater than the first width for guiding the lens into the socket.

15. The light-emitting device of claim 1, wherein an angle defined between the plug sidewall and the lower surface of the plug is less than 90 degrees.

16. The light-emitting device of claim 1, wherein the plug sidewall and the socket sidewall form an interference fit.

17. The light-emitting device of claim 1, wherein the package comprises a ceramic material.

24. The light-emitting device of claim 17, wherein the encapsulation layer comprises a luminescent layer.

25. The light-emitting device of claim 17, wherein the package comprises a ceramic material.

18. A light-emitting device comprising:

a package including;

a light-emitting side,

a top surface,

a socket including a socket sidewall and a bottom surface, the socket sidewall disposed between the top surface and the bottom surface of the package, the socket disposed on the light-emitting side of the package;

a cavity having a floor and configured to transmit light to the light emitting side of the package via the socket;

an LED disposed within the cavity and bonded to the floor of the cavity;

an encapsulation layer disposed within the cavity between the LED and the top surface of the package; and

a glass lens including a cap and a plug, the cap including an upper surface and a lower surface, the plug including a lower surface and a plug sidewall between the lower surface of the plug and the lower surface of the cap, the plug disposed within the socket and the lower surface of the cap disposed adjacent the top surface of the package; and

an adhesive layer disposed to attach the lower surface of the cap to the top surface of the package, wherein a portion the adhesive layer is disposed between the encapsulation layer and the lower surface of the plug.

19. The light-emitting device of claim 18, wherein a portion the adhesive layer is disposed between the lower surface of the cap and the top surface of the package.

20. The light-emitting device of claim 18, wherein a portion the adhesive layer is disposed between the sidewall of the cap and the sidewall of the socket.

21. The light-emitting device of claim 18, lower surface of the cap is a flat surface, and the top surface of the package is a flat surface.

22. The light-emitting device of claim 18, wherein a portion the adhesive layer is disposed between the encapsulation layer and the lower surface of the plug.

23. The light-emitting device of claim 18, wherein the encapsulation layer comprises a thermal insulation layer.