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LED packages with mushroom shaped lenses and methods of manufacturing LED light-emitting devices

  • US 8,816,369 B2
  • Filed: 04/27/2007
  • Issued: 08/26/2014
  • Est. Priority Date: 10/29/2004
  • Status: Active Grant
First Claim
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1. A light-emitting device comprising:

  • a package including;

    a light-emitting side,a top surface,a socket including a socket sidewall and a bottom surface, the socket sidewall disposed between the top surface and the bottom surface of the package, the socket disposed on the light-emitting side of the package;

    a cavity having a floor and configured to transmit light to the light emitting side of the package via the socket;

    an LED disposed within the cavity and bonded to the floor of the cavity;

    a thermal insulation layer disposed within the cavity between the LED and the top surface of the package; and

    a luminescent layer within the cavity between the thermal insulation layer and the top surface of the package;

    a class lens including a cap and a plug, the cap including an upper surface and a lower surface, the plug including a lower surface and a plug sidewall between the lower surface of the plug and the lower surface of the cap, the plug disposed within the socket and the lower surface of the cap disposed adjacent the top surface of the package; and

    an adhesive layer disposed to attach the lower surface of the cap to the top surface of the package, wherein a portion the adhesive layer is disposed between the luminescent layer and the lower surface of the plug.

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