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Semiconductor device

  • US 8,816,419 B2
  • Filed: 06/17/2008
  • Issued: 08/26/2014
  • Est. Priority Date: 06/19/2007
  • Status: Active Grant
First Claim
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1. A semiconductor device comprising:

  • a first semiconductor layer of one conductivity type having a plurality of trenches arranged at a predetermined interval from one another, and having a predetermined depth and width;

    a second semiconductor layer of the one conductivity type having a higher concentration than the first semiconductor layer and arranged between mutually adjacent ones of the trenches at a top face of the first semiconductor layer;

    a plurality of buried electrodes buried in the plurality of trenches respectively; and

    a plurality of conductor layers inside the plurality of trenches, each of the conductor layers being arranged above a respective one of the buried electrodes with a first insulation film interposed in between so that each of the conductor layers is capacitively coupled to the respective one of the buried electrodes, and each of the plurality of buried electrodes is on a respective interior surface of one of the trenches with another insulation film interposed in between, a thickness of the first insulation film being larger than a thickness of the other insulation film,wherein the plurality of buried electrodes are gate electrodes,wherein, in the first semiconductor layer, regions, which extend between mutually adjacent ones of the plurality of trenches and which function as current passages, are switched between a conducting state and a cut-off state as a voltage applied to the plurality of conductor layers that are connected together to control the plurality of buried electrodes is controlled, andwherein a width of each of the plurality of conductor layers in a direction of arrangement of the trenches is smaller than a width of the plurality of buried electrodes.

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