Antenna array package and method for building large arrays

• US 8,816,929 B2
• Filed: 07/27/2011
• Issued: 08/26/2014
• Est. Priority Date: 07/27/2011
• Status: Active Grant

• Current Assignee: Globalfoundries US Incorporated (GlobalFoundries, Inc.)
• Original Assignee: International Business Machines Corporation
• Inventors: Kam, Dong G., Liu, Duixian, Reynolds, Scott K.
• Primary Examiner(s): DINH, TRINH VO
• Application Number:
  US13/191,917
• Publication Number:
  US 20130027271A1
• Time in Patent Office: 1,126 Days
• Field of Search: None
• US Class Current: 343/848
• CPC Class Codes: H01Q 21/0025 Modular arrays
• CPC Class Codes: H01Q 21/064 using horn or slot aerials slotted waveguides arrays H01Q21/005
• CPC Class Codes: H01Q 21/065 Patch antenna array
• CPC Class Codes: H01Q 9/0414 in a stacked or folded configuration
• CPC Class Codes: Y10T 29/49016 Antenna or wave energy "plumbing" making

Abstract

Array packages and methods for forming large-scale antenna arrays. One method includes aligning two or more array packages. The two or more array packages each include one or more bottom dielectric layers, an array of antennas arranged in a plane above the one or more bottom dielectric layers, a ground plane layer above the one or more bottom dielectric layers, and a conductive surface on at least a part of an outside surface of the array package and orthogonal to the plane of the array of antennas. The conductive surface is electrically connected to the ground plane layer.

Claims

1. An array package for forming antenna arrays, the array package comprising:

at least one bottom dielectric layer;

an array of antennas arranged in a plane above the at least one bottom dielectric layer;

a ground plane layer above the at least one bottom dielectric layer, the ground plane layer being electrically conductive; and

a conductive surface electrically connected to the ground plane layer, the conductive surface being carried by at least a part of an outside surface of the array package and orthogonal to the plane of the array of antennas.

2. The array package of claim 1, wherein the conductive surface is a conductive plate carried by the outside surface of the array package.

3. The array package of claim 1, wherein the conductive surface is a cross-section of at least one plated via, the at least one plated via being a groove on the outside surface of the array package, the groove being plated with a conductive material.

4. The array package of claim 1, further comprising:

at least one top dielectric layer above the ground plane layer, wherein the conductive surface is carried by one of a layer from the at least one top dielectric layer and a layer from the at least one bottom dielectric layer.

5. An antenna system comprising:

at least two array packages electrically coupled together, each of the array packages comprising;

at least one bottom dielectric layer;

an array of antennas arranged in a plane above the at least one bottom dielectric layer;

a ground plane layer above the at least one bottom dielectric layer, the ground plane layer being electrically conductive; and

a conductive surface carried by at least a part of an outside surface of the array package and orthogonal to the plane of the array of antennas, the conductive surface electrically connected to the ground plane layer.

6. The antenna system of claim 5, wherein the conductive surface of each array package is united with a conductive surface of at least one other array package such that the ground plane layers from the respective array packages form a united ground plane layer electrically continuous in one plane.

7. The antenna system of claim 5, wherein the conductive surface of each array package is a conductive plate carried by the outside surface of the array package.

8. The antenna system of claim 5, wherein the conductive surface of each array package is a cross-section of at least one plated via, the at least one plated via being a groove on the outside surface of the array package, the groove being plated with a conductive material.

9. The antenna system of claim 5, each array package further comprising:

at least one top dielectric layer above the ground plane layer, wherein the conductive surface is carried by one of a layer from the at least one top dielectric layer and a layer from the at least one bottom dielectric layer.

10. The antenna system of claim 5, wherein the conductive surfaces of the at least two array packages are united by eutectic solder.

11. The antenna system of claim 5, wherein the array of antennas of each array package includes a set of antennas closest to the conductive surface, the set of antennas of each array package being separated from a different set of antennas from a different array package by a distance of at most a wavelength the array package is configured to receive.

12. The antenna system of claim 5, further comprising:

a printed circuit board, wherein the at least two array packages are fixed to the printed circuit board.

13. A method for forming an antenna array package, the method comprising:

forming at least one bottom dielectric layer;

forming an array of antennas arranged in a plane above the at least one bottom dielectric layer;

forming a ground plane layer above the at least one bottom dielectric layer, the ground plane layer being electrically conductive; and

forming a conductive surface carried by at least a part of an outside surface of the array package, the conductive surface electrically connected to the ground plane layer and orthogonal to the plane of the array of antennas.

14. The method of claim 13, wherein the conductive surface is a conductive plate carried by the outside surface of the array package.

15. The method of claim 13, wherein the conductive surface is a cross-section of at least one plated via, the at least one plated via being a groove on the outside surface of the array package, the groove being plated with a conductive material.

16. The method claim 13, further comprising:

forming at least one top dielectric layer above the ground plane layer, wherein the conductive surface is carried by one of a layer from the at least one top dielectric layer and a layer from the at least one bottom dielectric layer.

17. A method for forming antenna arrays, the method comprising:

aligning at least two array packages, the array packages each including;

at least one bottom dielectric layer, an array of antennas arranged in a plane above the at least one bottom dielectric layer, a ground plane layer above the at least one bottom dielectric layer, and a conductive surface carried by at least a part of an outside surface of the array package and orthogonal to the plane of the array of antennas, the ground plane layer being electrically conductive and the conductive surface electrically connected to the ground plane layer.

18. The method of claim 17, wherein aligning the at least two array packages is performed by uniting a conductive surface on an array package with a conductive surface of another array package such that the ground plane layers from the respective array packages form a united ground plane layer electrically continuous in one plane.

19. The method of claim 17, wherein uniting the conductive surfaces of the at least two array packages includes applying eutectic solder between the conductive surfaces of the at least two array packages.

20. The method of claim 17, wherein the array of antennas of each array package includes a set of antennas closest to the conductive surface, wherein the at least two array packages are aligned such that the set of antennas of each array package is separated from a different set of antennas from a different array package by a distance of at most a wavelength the array package is configured to receive.

21. The method of claim 17, further comprising:

attaching the at least two array packages to a printed circuit board.

22. The method of claim 17, wherein attaching the at least two array packages to a printed circuit board and aligning the at least two array packages is performed at the same time.

23. The method of claim 17, wherein the conductive surface is a conductive plate carried by the outside surface of the array package.

24. The method of claim 17, wherein the conductive surface is a cross-section of at least one plated via, the at least one plated via being a groove on the outside surface of the array package, the groove being plated with a conductive material.

25. The method claim 17, wherein each array package further includes:

at least one top dielectric layer above the ground plane layer, wherein the conductive surface is carried by one of a layer from the at least one top dielectric layer and a layer from the at least one bottom dielectric layer.