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Device and method for inspecting moving semiconductor wafers

  • US 8,817,249 B2
  • Filed: 05/04/2011
  • Issued: 08/26/2014
  • Est. Priority Date: 05/06/2010
  • Status: Active Grant
First Claim
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1. A system for inspecting defects in semiconductor wafers comprising:

  • a) a first device for detecting surface defects from variations in the slope of a surface of the waferb) a second device for detecting surface defects from variations in the intensity of light reflected by a surface of the wafer at a plurality of points, said second device being configured to calculate the intensity of the light at a plurality of image points to generate an image of the reflected intensities;

    c) a third device for detecting the intensity of the light diffused by the surface of the wafer;

    d) a detection and classification device coupled to an output of each of the first, second and third devices;

    e) a light source common to the first device and the second device, the light source comprising a projection member configured to project a pattern of substantially vertical alternate fringes of continuous light and dark bands onto the surface of the wafer, the projection member comprising a screen having a luminosity of at least 300 cd/cm2;

    f) a controller for displacing the pattern produced by the light source in at least one direction relative to the wafer;

    g) an image capture sensor common to the first, second and third detection devices, the image capture sensor being capable of measuring local light intensity during displacement pattern reflected by the wafer.

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