Recharge of an implantable device in the presence of other conductive objects

• US 8,818,523 B2
• Filed: 04/25/2012
• Issued: 08/26/2014
• Est. Priority Date: 04/25/2012
• Status: Active Grant

• Current Assignee: Medtronic Incorporated (Medtronic Plc)
• Original Assignee: Medtronic Incorporated (Medtronic Plc)
• Inventors: Olson, David P., Kallmyer, Todd A.
• Primary Examiner(s): VOORHEES, CATHERINE M
• Application Number:
  US13/455,690
• Publication Number:
  US 20130289662A1
• Time in Patent Office: 853 Days
• Field of Search: 607/33, 607 60- 61, 320/108
• US Class Current: 607/61
• CPC Class Codes: A61N 1/3787 from an external energy source
• CPC Class Codes: H02J 50/12 of the resonant type
• CPC Class Codes: H02J 50/70 involving the reduction of electric, magnetic or electromagnetic leakage fields
• CPC Class Codes: H02J 50/80 involving the exchange of data, concerning supply or distribution of electric power, between transmitting devices and receiving devices
• CPC Class Codes: H02J 50/90 involving detection or optimisation of position, e.g. alignment

Abstract

Techniques are disclosed for controlling the transcutaneously transfer of energy to an implantable medical device (IMD) that is in proximity to a conductive object that conducts current in the presence of an electromagnetic field. Various techniques are disclosed for estimating or determining the levels of heat dissipation associated with the object during the transfer of energy. If too much heat is being dissipated, the transfer of energy may be adjusted so that heating remains below acceptable levels.

Claims

1. A system to transfer energy to an Implantable Medical Device (IMD) that is located in proximity to a conductive object that is associated with an estimated amount of heat, comprising:

a primary coil configured to transcutanously transfer energy to the IMD located in proximity to the conductive object; and

processing circuitry configured to control the transfer of energy to the IMD based on the estimated amount of heat associated with the object during the transfer of energy to the IMD, wherein the IMD comprises a housing and the conductive object is located outside of the housing.

2. The system of claim 1, wherein the processing circuitry is configured to determine the amount of heat dissipated by the object and to control the transfer of energy based on the determined amount.

3. The system of claim 1, wherein the processing circuitry is configured to vary a frequency at which the primary coil is driven to determine respective loading profiles of the system in the presence of the object and in the absence of the object and to control the transfer of energy based on the respective loading profiles.

4. The system of claim 3, wherein the processing circuitry is configured to control the transfer of energy based on a peak-to-baseline ratio indicated by at least one of the respective loading profiles.

5. The system of claim 1, wherein the processing circuitry is configured to control the transfer of energy based on at least one predetermined characteristic of the object.

6. The system of claim 1, wherein the processing circuitry is configured to control the transfer of energy based on heating of the IMD.

7. The system of claim 1, wherein the processing circuitry is configured to control the transfer of energy based on a change in a ratio between power delivered to a power source of the IMD and total heat dissipation within the system.

8. The system of claim 1, wherein the processing circuitry is configured to control the transfer of energy based on a positional map containing associations, each association associating a relative position between the primary coil and a secondary coil of the IMD and an indication of a power level obtained when energy is transferred from the primary coil to the secondary coil when the primary coil is in the relative position with respect to the secondary coil.

9. The system of claim 8, wherein one or more relative positions between the primary coil and the secondary coil are selected based on the positional map for use in transferring energy from the primary coil to the secondary coil, and wherein feedback is provided to a user to guide the user in locating the primary coil in one of the relative positions with respect to the secondary coil.

10. The system of claim 1, further comprising the Implantable Medical Device (IMD), and wherein the IMD is configured to perform at least one of providing a therapy and sensing a signal.

11. The system of claim 1, wherein the conductive object comprises a second implantable medical device located in proximity to the IMD.

12. The system of claim 1, wherein the IMD is configured to be implantable within a patient'"'"'s body, and wherein the conductive object comprises at least one conductive object configured to be carried on the exterior of the patient'"'"'s body.

13. The system of claim 1, wherein the IMD is configured to be implantable within a patient'"'"'s body, and wherein the conductive object comprises a collection of multiple objects configured to be positioned at one or more locations of the patient'"'"'s body.

14. The system of claim 1, wherein the object is separated by some distance from the IMD while being close enough to the IMD to receive some of the energy transcutaneously transferred to the IMD.

15. A method, comprising:

transcutanously transferring energy to an implantable medical device (IMD) that is located in proximity to a conductive object; and

controlling, via processing circuitry the transcutaneous transfer of energy to the IMD based on an estimated amount of heat associated with the object during the transfer of the energy, wherein the IMD comprises a housing and the object is located outside of the housing.

16. The method of claim 15, further comprising determining the amount of heat dissipated by the object and wherein controlling the transfer of energy comprises controlling the transfer of energy based on the determined amount of heat dissipated by the object.

17. The method of claim 15, further comprising varying a frequency at which the transfer of energy occurs to determine a loading profile and wherein controlling the transfer of energy comprises controlling the transfer of energy based on the loading profile.

18. The method of claim 17, further comprising determining a difference between a resonant frequency of the determined loading profile and a resonant frequency of a reference loading profile, and where controlling the transfer of energy comprises controlling the transfer of energy based on the difference.

19. The method of claim 15, further comprising determining a peak-to-baseline ratio for power delivery at a resonant frequency, and wherein controlling the transfer of energy comprises controlling the transfer of energy based on the peak-to-baseline ratio.

20. The method of claim 15, further comprising controlling the transfer of energy based on at least one predetermined characteristic of the object.

21. The method of claim 15, further comprising controlling the transfer of energy based on at least one of heat dissipated by the primary coil and heat dissipated by the IMD.

22. A system to transfer energy to an implantable medical device (IMD) that is located in proximity to another object, the other object being conductive and being associated with an estimated amount of heat, comprising:

means for transcutanously transferring energy to the IMD located in proximity to the conductive object; and

means for controlling the transfer of energy to the IMD based on the estimated amount of heat associated with the object during the transfer of energy, wherein the IMD comprises a housing and the object is located outside of the housing.

23. A non-transitory storage medium for storing instructions to cause a control circuit to:

transcutanously transfer energy to an implantable medical device (IMD) that is located in proximity to a conductive object; and

control the transfer of energy to the IMD based on an estimated amount of heat associated with the object during the transfer of energy, wherein the IMD comprises a housing and the object is located outside of the housing.

24. The storage medium of claim 23, wherein the instructions further cause the control circuit to varying a frequency at which the transfer of energy occurs to determine a loading profile and to control the transfer of energy based on a characteristic of the loading profile.

25. The storage medium of claim 24, wherein the instructions further cause the control circuit to determine respective loading profiles in the presence and absence of the conductive object and to control the transfer of energy based on a difference between the respective loading profiles.

26. The storage medium of claim 23, wherein the instructions further cause the control circuit to control the transcutaneous transfer of energy based on a determined amount of heat dissipated by the object.

27. The storage medium of claim 26, wherein the instructions further cause the control circuit to determine the amount of heat dissipated by the object based on an amount of power provided to a rechargeable power source of the IMD and an amount of heat dissipated by the IMD.

28. The storage medium of claim 23, wherein the instructions further cause the control circuit to estimate the amount of heat associated with the object based on a difference between an amount of power delivered by a primary coil in the presence of the conductive object to achieve a predetermined level of power delivered to a rechargeable power source of the IMD as compared to an amount of power delivered by the primary coil in the absence of the conductive object to achieve the predetermined level of power delivered to the rechargeable power source.