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Spacecraft heat dissipation system

  • US 8,820,684 B2
  • Filed: 03/24/2010
  • Issued: 09/02/2014
  • Est. Priority Date: 03/24/2009
  • Status: Active Grant
First Claim
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1. A spacecraft comprising:

  • a housing having first and second sides opposite one another;

    a first thermal radiator panel coupled to one of the first and second sides of the housing and a second thermal radiator panel coupled to the other of the first and second sides of the housing;

    at least one first heat pipe comprising a first portion that is thermally coupled to the first thermal radiator panel and a second portion, wherein no portion of the at least one first heat pipe is in contact with the second thermal radiator panel and the at least one first heat pipe is configured to transfer heat in both directions between the first and second portions of the at least one first heat pipe;

    at least one second heat pipe comprising a first portion that is thermally coupled to the second thermal radiator panel and a second portion, wherein no portion of the at least one second heat pipe is in contact with the first thermal radiator panel and the at least one second heat pipe is configured to transfer heat in both directions between the first and second portions of the at least one second heat pipe, wherein the second portion of the at least one first heat pipe and the second portion of the at least one second heat pipe are in abutting contact within a first thermal connection zone, the first thermal connection zone being separate from both the first and second thermal radiator panels; and

    at least one heat-generating component attached to the housing and thermally coupled to the first thermal connection zone,wherein;

    each of the first thermal radiator panel and the second thermal radiator panel comprises an opening;

    the at least one first heat pipe extends through the opening in the first thermal radiator panel;

    the at least one second heat pipe extends through the opening in the second thermal radiator panel; and

    the first thermal connection zone is disposed on the housing.

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