Performance enhancement in transistors by reducing the recessing of active regions and removing spacers
First Claim
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1. A method of forming a semiconductor device, the method comprising:
- forming a protective liner above an active region and a gate electrode structure formed on said active region, said gate electrode comprising a dielectric cap layer, wherein the protective liner is formed on and in contact with the gate electrode structure and on and in contact with an upper surface of the dielectric cap layer;
performing a first ion implantation process to form drain and source extension regions in said active region in the presence of said protective liner;
forming a spacer structure on and in contact with said protective liner;
removing an exposed portion of said protective liner by using said spacer structure as an etch mask so as to thereby expose the upper surface of the dielectric cap layer and portions of the active region; and
performing a second ion implantation process to form drain and source regions by forming deep drain and source areas in said exposed portions of the active region in the presence of said spacer structure.
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Abstract
Sophisticated transistors for semiconductor devices may be formed on the basis of a superior process sequence in which an increased space between closely spaced gate electrode structures may be obtained in combination with a reduced material loss in the active regions. To this end, an offset spacer conventionally used for laterally profiling the drain and source extension regions is omitted and the spacer for the deep drain and source areas may be completely removed.
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Citations
17 Claims
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1. A method of forming a semiconductor device, the method comprising:
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forming a protective liner above an active region and a gate electrode structure formed on said active region, said gate electrode comprising a dielectric cap layer, wherein the protective liner is formed on and in contact with the gate electrode structure and on and in contact with an upper surface of the dielectric cap layer; performing a first ion implantation process to form drain and source extension regions in said active region in the presence of said protective liner; forming a spacer structure on and in contact with said protective liner; removing an exposed portion of said protective liner by using said spacer structure as an etch mask so as to thereby expose the upper surface of the dielectric cap layer and portions of the active region; and performing a second ion implantation process to form drain and source regions by forming deep drain and source areas in said exposed portions of the active region in the presence of said spacer structure. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method, comprising:
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forming a protective liner above an active region of a transistor, said protective liner covering a gate electrode structure formed on said active region, said gate electrode comprising a dielectric cap layer, wherein the protective liner is formed on and in contact with the gate electrode structure and on and in contact with an upper surface of the dielectric cap layer; performing a first ion implantation process to form drain and source extension regions by incorporating a drain and source dopant species in said active region through said protective liner; forming a spacer element on and in contact with said protective liner; removing an exposed portion of said protective liner by using said spacer structure as an etch mask so as to thereby expose the upper surface of the dielectric cap layer and portions of the active region; and performing a second ion implantation process to form drain and source regions in said exposed portions of said active region by using said spacer element as an implantation mask; and performing a common etch process to remove said spacer element and said dielectric cap layer of said gate electrode structure after forming said drain and source regions. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16, 17)
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Specification