Shielding and potting for electrical circuits

• US 8,822,844 B1
• Filed: 09/27/2010
• Issued: 09/02/2014
• Est. Priority Date: 09/27/2010
• Status: Active Grant

• Current Assignee: Rockwell Collins, Inc. (Raytheon Technologies Corporation d/b/a RTX)
• Original Assignee: Rockwell Collins, Inc. (Raytheon Technologies Corporation d/b/a RTX)
• Inventors: Dimke, Mark T., Hamilton, Brandon C., Horak, Luke W.
• Primary Examiner(s): NGO, HUNG V
• Application Number:
  US12/891,050
• Time in Patent Office: 1,436 Days
• Field of Search: 174/384, 174/385, 174/386, 174/521, 257/659
• US Class Current: 174/386
• CPC Class Codes: H05K 1/0219 Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
• CPC Class Codes: H05K 2201/0715 provided by an outer layer of PCB
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: H05K 9/003 made from non-conductive materials comprising an electro-conductive coating H05K9/0031 takes precedence

Abstract

A method for shielding an electrical circuit may include depositing a potting material upon the electrical circuit. The method may include providing a path to a ground of the electrical circuit. The method may also include depositing an electrically conductive coating upon the electrical circuit and over the potting material. The method may further include connecting the electrically conductive coating to the ground of the electrical circuit.

Claims

1. A device, comprising:

an electrical circuit having a ground plane, the ground plane located on an upper surface of the electrical circuit;

a potting material deposited upon the electrical circuit, the potting material defining a path to the ground plane of the electrical circuit; and

a first electrically conductive coating deposited upon the electrical circuit and over the potting material, the first electrically conductive coating connected to the ground plane of the electrical circuit; and

a second electrically conductive coating deposited in a distinct layer upon a portion of the first electrically conductive coating and electrically connected to the first electrically conductive coating.

2. The device of claim 1, wherein the electrical circuit includes at least one of a printed circuit board, a printed wiring board, a microelectronic assembly, a semiconductor package, a molded array processing microelectronic package, a ceramic integrated circuit package, a lead frame integrated circuit carrier, or a flexible circuit.

3. The device of claim 1, wherein the first electrically conductive coating and the second electrically conductive coating include at least one of a metal material, an organic material, a ceramic material, or an organometallic complex.

4. The device of claim 1, wherein the first electrically conductive coating and the second electrically conductive coating are at least one of sputtered, chemical vapor deposited, plated, painted, jetted, sprayed, dipped, augered, pin transferred, screened, or over molded.

5. The device of claim 1, wherein the potting material includes at least one of epoxy, polyimide, polyurethane, silicone, ceramic composite, or hot melt adhesive.

6. The device of claim 1, further comprising:

a connecting material applied upon a ground of the electrical circuit.

7. The device of claim 1, wherein the second electrically conductive coating is separated from the first electrically conductive coating by a distance.

8. The device of claim 7, further comprising:

a second potting material deposited between the first electrically conductive coating and the second electrically conductive coating.