Semiconductor device
First Claim
1. A semiconductor device comprising:
- a first electrode;
a first oxide semiconductor film and a second oxide semiconductor film, which are in contact with the first electrode;
a second electrode overlapping with the first electrode with the first oxide semiconductor film and the second oxide semiconductor film interposed therebetween;
a gate insulating film covering at least the first electrode, the first oxide semiconductor film and the second oxide semiconductor film; and
a third electrode which is in contact with the gate insulating film and is formed at least between the first oxide semiconductor film and the second oxide semiconductor film,wherein a portion of the gate insulating film is in contact with the first electrode.
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Accused Products
Abstract
The present invention is a semiconductor device including a first electrode over a substrate; a pair of oxide semiconductor films in contact with the first electrode; a second electrode in contact with the pair of oxide semiconductor films; a gate insulating film covering at least the first electrode and the pair of oxide semiconductor films; and a third electrode that is in contact with the gate insulating film and is formed at least between the pair of oxide semiconductor films. When the donor density of the oxide semiconductor films is 1.0×1013/cm3 or less, the thickness of the oxide semiconductor films is made larger than the in-plane length of each side of the oxide semiconductor films which is in contact with the first electrode.
114 Citations
24 Claims
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1. A semiconductor device comprising:
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a first electrode; a first oxide semiconductor film and a second oxide semiconductor film, which are in contact with the first electrode; a second electrode overlapping with the first electrode with the first oxide semiconductor film and the second oxide semiconductor film interposed therebetween; a gate insulating film covering at least the first electrode, the first oxide semiconductor film and the second oxide semiconductor film; and a third electrode which is in contact with the gate insulating film and is formed at least between the first oxide semiconductor film and the second oxide semiconductor film, wherein a portion of the gate insulating film is in contact with the first electrode. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A semiconductor device comprising:
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a first electrode; a first oxide semiconductor film and a second oxide semiconductor film, which are in contact with the first electrode; a second electrode overlapping with the first electrode with the first oxide semiconductor film and the second oxide semiconductor film interposed therebetween; a gate insulating film covering at least the first electrode, the first oxide semiconductor film and the second oxide semiconductor film; and a third electrode which is in contact with the gate insulating film and is formed at least between the first oxide semiconductor film and the second oxide semiconductor film, wherein a thickness of each of the first oxide semiconductor film and the second oxide semiconductor film is larger than a length of each side of the first oxide semiconductor film and the second oxide semiconductor film, which is in contact with the first electrode, and wherein a portion of the gate insulating film is in contact with the first electrode. - View Dependent Claims (8, 9, 10, 11, 12)
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13. A semiconductor device comprising:
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a first electrode; a first oxide semiconductor film, a second oxide semiconductor film and a third oxide semiconductor film, which are in contact with the first electrode; a second electrode overlapping with the first electrode with the first oxide semiconductor film, the second oxide semiconductor film and the third oxide semiconductor film interposed therebetween; a gate insulating film covering at least the first electrode, the first oxide semiconductor film, the second oxide semiconductor film and the third oxide semiconductor film; and a third electrode which is in contact with the gate insulating film and is formed at least between the first oxide semiconductor film and the second oxide semiconductor film and between the second oxide semiconductor film and the third oxide semiconductor film, wherein a portion of the gate insulating film is in contact with the first electrode. - View Dependent Claims (14, 15, 16, 17, 18)
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19. A semiconductor device comprising:
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a first electrode; a first oxide semiconductor film, a second oxide semiconductor film and a third oxide semiconductor film, which are in contact with the first electrode; a second electrode overlapping with the first electrode with the first oxide semiconductor film, the second oxide semiconductor film and the third oxide semiconductor film interposed therebetween; a gate insulating film covering at least the first electrode, the first oxide semiconductor film, the second oxide semiconductor film and the third oxide semiconductor film; and a third electrode which is in contact with the gate insulating film and is formed at least between the first oxide semiconductor film and the second oxide semiconductor film and between the second oxide semiconductor film and the third oxide semiconductor film, wherein a thickness of each of the first oxide semiconductor film, the second oxide semiconductor film and the third oxide semiconductor film is larger than a length of each side of the first oxide semiconductor film, the second oxide semiconductor film and the third oxide semiconductor film, which is in contact with the first electrode, and wherein a portion of the gate insulating film is in contact with the first electrode. - View Dependent Claims (20, 21, 22, 23, 24)
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Specification