Hybrid integrated component and method for the manufacture thereof
First Claim
1. A hybrid integrated component, comprising:
- an ASIC element having integrated circuit elements and a back-end stack;
an MEMS element having a substrate and a micromechanical structure which extends over the entire thickness of the substrate of the MEMS element; and
a cap wafer;
wherein the MEMS element is mounted on the ASIC element in such a way that a gap exists between the micromechanical structure and the back-end stack of the ASIC element, and the cap wafer is mounted above the micromechanical structure of the MEMS element, and wherein a pressure-sensitive diaphragm structure having at least one deflectable electrode of a capacitor system is implemented in the back-end stack of the ASIC element, and the diaphragm structure spans a pressure connection in the rear side of the ASIC element.
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Accused Products
Abstract
A hybrid integrated component includes: at least one ASIC element having integrated circuit elements and a back-end stack; an MEMS element having a micromechanical structure, which extends over the entire thickness of the MEMS substrate; and a cap wafer. The hybrid integrated component is provided with an additional micromechanical function. The MEMS element is mounted on the ASIC element, so that a gap exists between the micromechanical structure and the back-end stack of the ASIC element. The cap wafer is mounted above the micromechanical structure of the MEMS element. A pressure-sensitive diaphragm structure having at least one deflectable electrode of a capacitor system is implemented in the back-end stack of the ASIC element, which diaphragm structure spans a pressure connection in the rear side of the ASIC element.
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Citations
13 Claims
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1. A hybrid integrated component, comprising:
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an ASIC element having integrated circuit elements and a back-end stack; an MEMS element having a substrate and a micromechanical structure which extends over the entire thickness of the substrate of the MEMS element; and a cap wafer; wherein the MEMS element is mounted on the ASIC element in such a way that a gap exists between the micromechanical structure and the back-end stack of the ASIC element, and the cap wafer is mounted above the micromechanical structure of the MEMS element, and wherein a pressure-sensitive diaphragm structure having at least one deflectable electrode of a capacitor system is implemented in the back-end stack of the ASIC element, and the diaphragm structure spans a pressure connection in the rear side of the ASIC element. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method for manufacturing a hybrid integrated component, comprising:
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integrating circuit elements into an ASIC substrate; producing a back-end stack on the ASIC substrate, wherein a diaphragm structure having at least one deflectable electrode is applied in the back-end stack, and wherein the diaphragm structure is exposed in the back-end stack; mounting an MEMS substrate on the back-end stack of the ASIC substrate in such a way that a gap exists between the MEMS substrate and the back-end stack of the ASIC substrate; structuring an entire thickness of the mounted MEMS substrate; producing a pressure connection in the rear side of the ASIC substrate; and mounting a cap wafer above the micromechanical structure of the MEMS substrate. - View Dependent Claims (13)
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Specification