Base for power module
First Claim
1. A power module base comprising:
- a heat radiation substrate formed of a high-thermal-conduction material, the heat radiation substrate having a first surface and a second surface opposite to the first surface;
an insulating substrate provided over the first surface of the heat radiation substrate;
a wiring layer provided on a surface of the insulating substrate opposite a side where the insulating substrate is provided over the heat radiation substrate;
a first component attachment plate joined to the first surface of the heat radiation substrate, the first component attachment plate having a through hole such that the insulating substrate is located within the through hole;
a heat radiation fin brazed to the second surface of the heat radiation substrate;
a cooling jacket fixed to the second surface of the heat radiation substrate such that the cooling jacket covers the heat radiation fin, the cooling jacket comprising a circumferential wall and a bottom wall that closes a lower end opening of the circumferential wall; and
a second component attachment plate brazed to a surface of the bottom wall of the cooling jacket,wherein the first component attachment plate is thicker than the heat radiation substrate and brazed to the heat radiation substrate, the heat radiation fin has a corrugate shape including wave crest portions, wave trough portions, and connection portions connecting the wave crest portions and the wave trough portions, the wave crest portions are brazed to the heat radiation substrate, and the wave trough portions are brazed to the cooling jacket.
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Accused Products
Abstract
A power module base includes a heat radiation substrate formed of a high-thermal-conduction material, an insulating substrate joined to an upper surface of the heat radiation substrate, a wiring layer provided on an upper surface of the insulating substrate, and a heat radiation fin joined to a lower surface of the heat radiation substrate. A component attachment plate thicker than the heat radiation substrate and including a through hole for accommodating the insulating substrate is joined to the upper surface of the heat radiation substrate such that the insulating substrate is located within the through hole. This power module base can maintain the upper surface of the component attachment plate flat, and various components for a power module, such as a casing, can be attached onto the component attachment plate.
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Citations
18 Claims
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1. A power module base comprising:
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a heat radiation substrate formed of a high-thermal-conduction material, the heat radiation substrate having a first surface and a second surface opposite to the first surface; an insulating substrate provided over the first surface of the heat radiation substrate; a wiring layer provided on a surface of the insulating substrate opposite a side where the insulating substrate is provided over the heat radiation substrate; a first component attachment plate joined to the first surface of the heat radiation substrate, the first component attachment plate having a through hole such that the insulating substrate is located within the through hole; a heat radiation fin brazed to the second surface of the heat radiation substrate; a cooling jacket fixed to the second surface of the heat radiation substrate such that the cooling jacket covers the heat radiation fin, the cooling jacket comprising a circumferential wall and a bottom wall that closes a lower end opening of the circumferential wall; and a second component attachment plate brazed to a surface of the bottom wall of the cooling jacket, wherein the first component attachment plate is thicker than the heat radiation substrate and brazed to the heat radiation substrate, the heat radiation fin has a corrugate shape including wave crest portions, wave trough portions, and connection portions connecting the wave crest portions and the wave trough portions, the wave crest portions are brazed to the heat radiation substrate, and the wave trough portions are brazed to the cooling jacket. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A power module base comprising:
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a heat radiation substrate formed of a high-thermal-conduction material, the heat radiation substrate having a first surface and a second surface opposite to the first surface; an insulating substrate provided over the first surface of the heat radiation substrate; a wiring layer provided on a surface of the insulating substrate opposite a side where the insulating substrate is provided over the heat radiation substrate; a heat transfer layer which is formed of a high-thermal-conduction material and is provided on a surface of the insulating substrate opposite the side where the wiring layer is provided; a first component attachment plate joined to the first surface of the heat radiation substrate, the first component attachment plate having a through hole such that the insulating substrate is located within the through hole; a heat radiation fin brazed to the second surface of the heat radiation substrate; a cooling jacket fixed to the second surface of the heat radiation substrate such that the cooling jacket covers the heat radiation fin, the cooling jacket comprising a circumferential wall and a bottom wall that closes a lower end opening of the circumferential wall; and a second component attachment plate brazed to a surface of the bottom wall of the cooling jacket, wherein the first component attachment plate is thicker than the heat radiation substrate and brazed to the heat radiation substrate, the heat radiation fin has a corrugate shape including wave crest portions, wave trough portions, and connection portions connecting the wave crest portions and the wave trough portions, the wave crest portions are brazed to the heat radiation substrate, and the wave trough portions are brazed to the cooling jacket. - View Dependent Claims (15, 16, 17, 18)
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Specification