Electronic package structure

• US 8,824,165 B2
• Filed: 07/19/2011
• Issued: 09/02/2014
• Est. Priority Date: 02/18/2008
• Status: Active Grant

• Current Assignee: Cyntec Co. Ltd. (Delta Electronics Incorporated)
• Original Assignee: Cyntec Co. Ltd. (Delta Electronics Incorporated)
• Inventors: Chen, Da-Jung, Wen, Chau-Chun, Liu, Chun-Tiao
• Primary Examiner(s): Chen, Xiaoliang
• Application Number:
  US13/185,573
• Publication Number:
  US 20120014079A1
• Time in Patent Office: 1,141 Days
• Field of Search: 361/813, 361/729, 257/637, 257/666, 257/676, 336/65, 336/200
• US Class Current: 361/813
• CPC Class Codes: H01F 27/027 specially adapted for combination of signal type inductors or transformers with electronic circuits, e.g. mounting on printed circuit boards
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 2201/1003 Non-printed inductor
• CPC Class Codes: H05K 2201/10515 Stacked components
• CPC Class Codes: H05K 2201/10537 Attached components
• CPC Class Codes: H05K 2201/10924 Leads formed from a punched metal foil affixing a prefabricated self-supporting metal foil pattern H05K3/202
• CPC Class Codes: H05K 3/3421 Leaded components
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

An electronic package structure including at least one first electronic element, a second electronic element and a lead frame is provided. The second electronic element includes a body having a cavity. The first electronic element is disposed in the cavity. The lead frame has a plurality of leads. Each of the leads has a first end and a second end. The first end of at least one of the leads extends to the cavity to electrically connect the first electronic element.

Claims

1. An electronic package, comprising:

an electronic element;

a lead frame having a plurality of leads, each of said leads having

a top section electrically coupled to said electronic element,

a bottom section, and

a middle section connecting said top section and said bottom section to define a bracket shape;

a coil bracketed by said leads, wherein the coil is below the top section and above the bottom section of each of said leads;

a body encapsulating at least said coil, said body having a bottom face on which the bottom sections of the leads are positioned and exposed;

a first electrode electrically coupled to a first end of said coil;

a second electrode electrically coupled to a second end of said coil; and

wherein

in each of said leads, the top section extends inwardly from a top end of the middle section toward a middle part of the body, and the bottom section extends inwardly from a bottom end of the middle section toward the middle part of the body;

a first bottom of said first electrode protrudes from the bottom face in the middle part of said body;

a second bottom of said second electrode protrudes from the bottom face in the middle part of said body;

on the bottom face of the body, the bottom sections of said leads extend inwardly from opposite sides toward the first and second bottoms of said first and second electrodes in the middle part of the body; and

said bottom sections of the leads and the first and second bottoms of the first and second electrodes have undersides that are coplanar to define said package as a surface-mount package.

2. An electronic package as claimed in claim 1, wherein said middle section of at least one of the leads is exposed out of said body along a side face of said body.

3. An electronic package as claimed in claim 1, wherein said middle section of at least one of the leads is embedded in said body.

4. An electronic package as claimed in claim 1, wherein said body extends above said top sections of the leads and has a recess in which said electronic element is positioned.

5. An electronic package as claimed in claim 4, wherein

said top sections have portions extending into and being exposed within said recess;

and

said electronic element is electrically coupled to said exposed portions of the top sections.

6. An electronic package as claimed in claim 4, further comprising:

a circuit board positioned within said recess, above the top sections of the leads and below the electronic element;

wherein said circuit board is electrically coupled between the top sections of the leads and the electronic element.

7. An electronic package as claimed in claim 4, further comprising:

an insulating encapsulant filled in said recess.

8. An electronic package as claimed in claim 4, wherein

a width of said recess is smaller than an outer dimension of said coil.

9. An electronic package as claimed in claim 8, wherein

the width of said recess is greater than an inner dimension of said coil.

10. An electronic package as claimed in claim 1, wherein the top section and bottom section of each said lead are positioned in parallel planes and the middle section of said lead is perpendicular to the top section and the bottom section.

11. An electronic package as claimed in claim 1, wherein said electronic element is one selected from the group consisting of a capacitor, a resistor, and an inductor with a smaller inductance than the coil.

12. An electronic package as claimed in claim 1, wherein said electronic element is one selected from the group consisting of a metal-oxide-semiconductor field effect transistor (MOSFET), an insulated gate bipolar transistor (IGBT), and a diode.

13. An electronic package as claimed in claim 1, wherein the coil is completely positioned within a space bordered by the top sections, the bottom sections and the middle sections of said leads.

14. An electronic package as claimed in claim 4, wherein the recess is free of a material of the body.

15. An electronic package as claimed in claim 14, wherein

said top sections have portions extending into and being exposed within said recess;

and

said electronic element is electrically coupled to said exposed portions of the top sections.

16. An electronic package as claimed in claim 14, further comprising:

a circuit board positioned within said recess, above the top sections of the leads and below the electronic element;

wherein said circuit board is electrically coupled between the top sections of the leads and the electronic element.

17. An electronic package as claimed in claim 7, wherein a first material of the insulating encapsulant filled in said recess is different from a second material of the body.

18. An electronic package as claimed in claim 17, wherein the first material is an insulating material and the second material is a magnetic material.

19. An electronic package as claimed in claim 1, wherein the body is a magnetic body that encloses the coil.

20. An electronic package as claimed in claim 1, wherein

the coil has an inner hole filled with a material of the body, and

the first and second electrodes overlap the inner hole along an axial direction of the inner hole.