Piezoelectric microphone fabricated on glass
First Claim
1. An apparatus for detecting sound comprising:
- a glass substrate;
an electromechanical microphone device disposed on a surface of the glass substrate;
an integrated circuit device disposed on the surface of the glass substrate, the integrated circuit device configured to sense output from the electromechanical microphone device;
a cover glass bonded to the surface of the glass substrate, wherein the cover glass includes a first recess that defines a first cavity when the cover glass is bonded to the surface of the glass substrate, the first cavity being configured to accommodate the electromechanical microphone device, a portion of the first recess being at an edge of the cover glass such that the cover glass and the glass substrate, when bonded together, define an aperture at the edge of the cover glass, the aperture configured to allow a sound wave to interact with the electromechanical microphone device;
a layer of metal between the glass substrate and the electromechanical microphone device; and
a layer of metal on portions of the first cavity proximate the electromechanical microphone device.
2 Assignments
0 Petitions
Accused Products
Abstract
This disclosure provides systems, methods and apparatus for glass-encapsulated microphones. In one aspect, a glass-encapsulated microphone may include a glass substrate, an electromechanical microphone device, an integrated circuit device, and a cover glass. The cover glass may be bonded to the glass substrate with an adhesive, such as epoxy, or a metal bond ring. The cover glass may have any of a number of configurations. In some configurations, the cover glass may define an aperture for the electromechanical microphone device at an edge of the glass-encapsulated microphone. In some configurations, the cover glass may define a cavity to accommodate the integrated circuit device that is separate from a cavity that accommodates the electromechanical microphone device.
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Citations
33 Claims
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1. An apparatus for detecting sound comprising:
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a glass substrate; an electromechanical microphone device disposed on a surface of the glass substrate; an integrated circuit device disposed on the surface of the glass substrate, the integrated circuit device configured to sense output from the electromechanical microphone device; a cover glass bonded to the surface of the glass substrate, wherein the cover glass includes a first recess that defines a first cavity when the cover glass is bonded to the surface of the glass substrate, the first cavity being configured to accommodate the electromechanical microphone device, a portion of the first recess being at an edge of the cover glass such that the cover glass and the glass substrate, when bonded together, define an aperture at the edge of the cover glass, the aperture configured to allow a sound wave to interact with the electromechanical microphone device; a layer of metal between the glass substrate and the electromechanical microphone device; and a layer of metal on portions of the first cavity proximate the electromechanical microphone device. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23)
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24. An apparatus comprising:
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a glass substrate; an electromechanical microphone device disposed on a surface of the glass substrate; an integrated circuit device disposed on the surface of the glass substrate, the integrated circuit device configured to sense output from the electromechanical microphone device; and a cover glass bonded to the surface of the glass substrate with a joining ring, wherein the cover glass includes a first recess that defines a first cavity when the cover glass is bonded to the surface of the glass substrate and a second recess that defines a second cavity when the cover glass is bonded to the surface of the glass substrate, the first cavity being configured to accommodate the electromechanical microphone device, the second cavity being configured to accommodate the integrated circuit device, a portion of the first recess being at an edge of the cover glass such that when the cover glass is bonded to the surface of the glass substrate, the cover glass and the glass substrate define an aperture at the edge of the cover glass, the aperture configured to allow a sound wave to interact with the electromechanical microphone device. - View Dependent Claims (25, 26, 27)
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28. A method of forming an acoustic microphone comprising:
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providing a glass substrate, the glass substrate having an electromechanical microphone device disposed on a surface of the glass substrate; bonding a cover glass to the surface of the glass substrate, wherein the cover glass includes a first recess that defines a first cavity when the cover glass is bonded to the surface of the glass substrate, the first cavity being configured to accommodate the electromechanical microphone device, a portion of the first recess being at an edge of the cover glass such that when the cover glass is bonded to the surface of the glass substrate, an aperture is defined, the aperture configured to allow a sound wave to interact with the electromechanical microphone device; forming a layer of metal between the glass substrate and the electromechanical microphone device; and forming a layer of metal on portions of the first cavity proximate the electromechanical microphone device. - View Dependent Claims (29, 30, 31)
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32. An apparatus for detecting sound comprising:
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a glass substrate; an electromechanical microphone device disposed on a surface of the glass substrate; an integrated circuit device disposed on the surface of the glass substrate, the integrated circuit device configured to sense output from the electromechanical microphone device; and a cover glass bonded to the surface of the glass substrate, wherein the cover glass includes a first recess that defines a first cavity when the cover glass is bonded to the surface of the glass substrate, the first cavity being configured to accommodate the electromechanical microphone device, a portion of the first recess being at an edge of the cover glass such that the cover glass and the glass substrate, when bonded together, define an aperture at the edge of the cover glass, the aperture configured to allow a sound wave to interact with the electromechanical microphone device, wherein; the surface of the glass substrate further includes a plurality of conductive traces and a plurality of ledge pads; the plurality of conductive traces are in electrical contact with the integrated circuit device; each of the plurality of ledge pads is in electrical contact with a conductive trace of the plurality of conductive traces; and the plurality of ledge pads are on an outside surface of the apparatus when the cover glass is bonded to the surface of the glass substrate. - View Dependent Claims (33)
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Specification