Method for flex circuit bonding without solder mask for high density electrical interconnect
First Claim
1. A method of manufacturing a print head comprising:
- providing a jet stack comprising an array of jets;
bonding an actuator layer to the jet stack, the actuator layer including actuator array;
applying a standoff adhesive layer to the actuator layer and the jet stack, the standoff adhesive layer having an array of holes, wherein each hole of the array of holes overlies one of the actuators of the actuator array;
aligning a flex circuit layer having an array of bumped contact pads, wherein each bumped contact pad of the array of bumped contact pads aligns with one of the holes of the array of holes of the standoff adhesive layer; and
bonding the flex circuit layer to the jet stack layer.
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Accused Products
Abstract
In some aspects of the present application, a method of manufacturing a print head is disclosed. The method can include providing a jet stack including an array of jets, bonding an actuator layer to the jet stack, the actuator layer including an actuator array, applying a standoff adhesive layer to the actuator layer and the jet stack, the standoff layer having an array of holes, wherein each hole of the array of holes overlies one of the actuators of the actuator array. A flex circuit layer having an array of bumped contact pads is aligned such that each bumped contact pad aligns with one of the holes of the standoff adhesive. Further, the flex circuit layer is boned to the jet stack layer.
14 Citations
9 Claims
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1. A method of manufacturing a print head comprising:
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providing a jet stack comprising an array of jets; bonding an actuator layer to the jet stack, the actuator layer including actuator array; applying a standoff adhesive layer to the actuator layer and the jet stack, the standoff adhesive layer having an array of holes, wherein each hole of the array of holes overlies one of the actuators of the actuator array; aligning a flex circuit layer having an array of bumped contact pads, wherein each bumped contact pad of the array of bumped contact pads aligns with one of the holes of the array of holes of the standoff adhesive layer; and bonding the flex circuit layer to the jet stack layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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Specification