LED module for lighting

• US 8,827,493 B2
• Filed: 12/20/2011
• Issued: 09/09/2014
• Est. Priority Date: 12/20/2010
• Status: Expired due to Fees

• Current Assignee: Toyoda Gosei Company Limited (Toyota Motor Corporation)
• Original Assignee: Toyoda Gosei Company Limited (Toyota Motor Corporation)
• Inventors: Tajima, Hiroyuki, Tsuchiya, Yosuke, Kato, Hideaki, Shimonishi, Syota
• Primary Examiner(s): TSO, LAURA K
• Application Number:
  US13/330,892
• Publication Number:
  US 20120155086A1
• Time in Patent Office: 994 Days
• Field of Search: 362/249.02
• US Class Current: 362/249.02
• CPC Class Codes: F21V 25/10 coming into action when lighting device is overloaded, e.g. thermal switch
• CPC Class Codes: F21Y 2105/10 comprising a two-dimensional array of point-like light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H05B 45/40 Details of LED load circuits
• CPC Class Codes: H05K 1/026 Spark gaps
• CPC Class Codes: H05K 1/0269 for visual or optical inspection
• CPC Class Codes: H05K 2201/09381 Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component notches in edge pads H05K2201/09181
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2201/2054 Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
• CPC Class Codes: H05K 2203/162 Testing a finished product, e.g. heat cycle testing of solder joints patterns for electrical inspection or testing H05K1/0268
• CPC Class Codes: Y02B 20/30 Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]

Abstract

An object of the present invention is to provide a LED module, capable of protecting LED chips from an excessive voltage, at low cost.

An LED module for lighting includes a wiring substrate having a plurality of wiring patterns formed thereon, and a plurality of LED chips connected to the wiring patterns so as to constitute a series circuit or a series-parallel circuit. In the LED module, the wiring patterns comprises an anode side wiring pattern constituting an anode side electrode of the circuit, and a cathode side wiring pattern constituting a cathode side electrode of the circuit, the anode side wiring pattern and the cathode side wiring pattern are disposed to surround connection regions of the wiring patterns with the LED chips, and forms guard electrodes, and both edge portions of the anode side wiring pattern face both edge portions of the cathode side wiring pattern with gaps, respectively.

Claims

1. An LED module for lighting, the LED module comprising:

a wiring substrate having a plurality of wiring patterns formed thereon; and

a plurality of LED chips connected to the wiring patterns so as to constitute a series circuit or a series-parallel circuit,

wherein the wiring patterns comprise an anode side wiring pattern constituting an anode side electrode of the circuit, and a cathode side wiring pattern constituting a cathode side electrode of the circuit,

wherein the anode side wiring pattern and the cathode side wiring pattern are disposed to surround connection regions of the other wiring patterns with the LED chips, and forms guard electrodes, and

wherein both edge portions of the anode side wiring pattern face both edge portions of the cathode side wiring pattern with gaps, respectively.

2. The LED module for lighting according to claim 1, wherein a clearance between outer peripheries of the anode side wiring pattern and the cathode side wiring pattern and an outer periphery of the wiring substrate is 1.5 mm or less.

3. The LED module for lighting according to claim 1, wherein a distributed Bragg reflector layer is formed on surfaces of the wiring patterns except for connection regions with the LED chips.

4. The LED module for lighting according to claim 1, wherein marks for recognition are formed by the both edge portions of the anode side wiring pattern and the both edge portions of the cathode side wiring pattern.

5. The LED module for lighting according to claim 1, wherein the LED chips are disposed to be approximately symmetrical with respect to a point.

6. The LED module for lighting according to claim 1, further comprising:

a plurality of bumps,

wherein the plurality of LED chips are mounted on the wiring patterns by flip-chip mounting via the plurality of bumps.

7. The LED module for lighting according to claim 1, further comprising:

a plurality of bumps,

wherein the anode side wiring pattern and the cathode side wiring pattern are electrically connected to the connection regions via the plurality of bumps.

8. The LED module for lighting according to claim 1, wherein the connection regions have a substantially square shape.

9. The LED module for lighting according to claim 1, wherein the gaps have a constant width.

10. The LED module for lighting according to claim 1, wherein a clearance between outer peripheries of the anode side wiring pattern and the cathode side wiring pattern and an outer periphery of the wiring substrate is uniformly set.

11. The LED module for lighting according to claim 1, wherein an edge portion of the anode side wiring pattern and an edge portion of the cathode side wiring pattern are configured as a U-shaped portion such that the U-shaped portion forms a mark for recognition.

12. The LED module for lighting according to claim 1, wherein a first edge portion of the anode side wiring pattern and a first edge portion of the cathode side wiring pattern in a vicinity of an outer periphery of the wiring substrate are configured as a first U-shape portion,

wherein a second edge portion of the anode side wiring pattern and a second edge portion of the cathode side wiring pattern in a vicinity of an outer periphery of the wiring substrate are configured as a second U-shape that is an inverted shape of the first U-shape portion,

wherein the first U-shaped portion and the second U-shaped portion each form a mark for recognition.

13. The LED module for lighting according to claim 1, wherein the wiring substrate further includes a base for radiating heat generated by the LED chips.

14. The LED module for lighting according to claim 13, wherein the base comprises an inorganic material.

15. The LED module for lighting according to claim 1, wherein a translucent layer is formed on surfaces of the wiring patterns except for connection regions with the LED chips.

16. The LED module for lighting according to claim 3, where the distributed Bragg reflector layer comprises a laminated layer formed by alternately laminating layers having different refractive indexes.

17. An LED module for lighting, the LED module comprising:

a wiring substrate having a plurality of wiring patterns formed thereon; and

a plurality of LED chips connected to the wiring patterns so as to constitute a series circuit or a series-parallel circuit,

wherein the wiring patterns comprise an anode side wiring pattern constituting an anode side electrode of the circuit, and a cathode side wiring pattern constituting a cathode side electrode of the circuit,

wherein connection regions of the other wiring patterns with the LED chips are disposed between the anode side wiring pattern and the cathode side wiring pattern such that the anode side wiring pattern and the cathode side wiring pattern form guard electrodes, and

both edge portions of the anode side wiring pattern face both edge portions of the cathode side wiring pattern with gaps, respectively.