Thick doped adhesive tape to enhance backscatter X-ray detectability

• US 8,828,538 B1
• Filed: 12/20/2012
• Issued: 09/09/2014
• Est. Priority Date: 07/01/2011
• Status: Active Grant

• Current Assignee: The Boeing Co.
• Original Assignee: The Boeing Co.
• Inventors: Toh, Chin H., Engel, James E.
• Primary Examiner(s): Chang, Victor
• Application Number:
  US13/722,154
• Time in Patent Office: 628 Days
• Field of Search: 428/343, 428/354
• US Class Current: 428/343
• CPC Class Codes: C09J 11/04 inorganic
• CPC Class Codes: C09J 2301/408 additives as essential feature of the adhesive layer
• CPC Class Codes: C09J 2301/41 additives as essential feature of the carrier layer
• CPC Class Codes: C09J 7/205 characterised by the backing impregnating composition
• CPC Class Codes: C09J 7/21 Paper; Textile fabrics
• CPC Class Codes: Y10T 156/10 Methods of surface bonding and/or assembly therefor
• CPC Class Codes: Y10T 156/1105 Delaminating process responsive to feed or shape at delamination
• CPC Class Codes: Y10T 428/266 of base or substrate
• CPC Class Codes: Y10T 428/28 Web or sheet containing structurally defined element or component and having an adhesive outermost layer
• CPC Class Codes: Y10T 428/2848 Three or more layers

Abstract

Doped adhesive tape is used during the manufacture of aircraft, including positioning marks, covering orifices from debris, allowing locations to be marked. Any doped adhesive tape inadvertently left in sub-assemblies during the manufacturing process can be detected using backscatter X-ray inspection technology. Detection is facilitated in one embodiment by making the tape thicker, to produce an increased mass density, and in another embodiment by adding a dopant comprising an element that is readily detected by the backscatter X-ray technology. The element can be iodine, and can be incorporated into the backing layer or the adhesive layer of the tape during manufacturing. The use of both thicker tape and a dopant can be used in combination to facilitate detection. If the doped adhesive tape is detected after components are assembled using a backscatter X-ray inspection device, then the doped adhesive tape is removed.

Claims

1. An adhesive tape for assembling components, comprising:

a doped backing layer comprising a dopant configured to scatter X-rays in a backscatter X-ray inspection technique; and

an adhesive having one side applied to the doped backing layer and the other side configured for attachment to an aircraft component, wherein the adhesive comprises an iodine based dopant.

2. The adhesive tape of claim 1, wherein the backing layer comprises a paper layer comprising an iodine based dopant.

3. The adhesive tape of claim 1, wherein the backing layer is a paper layer that is greater than 20 mils thickness.

4. The adhesive tape of claim 2, wherein the iodine in the backing layer comprises potassium iodide.

5. The doped adhesive tape of claim 1, wherein the iodine in the adhesive comprises potassium iodide.

6. The adhesive tape of claim 1, wherein the dopant of the backing layer is added to the backing layer by spraying a liquid comprising iodine on the backing layer prior to application of the adhesive.