Method for forming patterned conductive film

• US 8,828,555 B2
• Filed: 01/26/2011
• Issued: 09/09/2014
• Est. Priority Date: 01/28/2010
• Status: Expired due to Fees

• Current Assignee: Japan Science And Technology Agency, JSR Corporation
• Original Assignee: Japan Science And Technology Agency, JSR Corporation
• Inventors: Shimoda, Tatsuya, Matsuki, Yasuo, Shen, Zhongrong
• Primary Examiner(s): LAM, CATHY FONG FONG
• Application Number:
  US13/575,477
• Publication Number:
  US 20120298402A1
• Time in Patent Office: 1,322 Days
• Field of Search: 428/209, 428/141, 428/142, 428/148, 428/901, 428/548, 428/615, 428/652, 427/125, 427/304, 427/314, 427/318, 427/405
• US Class Current: 428/652
• CPC Class Codes: C23C 18/06 Coating on selected surface areas, e.g. using masks
• CPC Class Codes: C23C 18/08 characterised by the deposition of metallic material
• CPC Class Codes: C23C 18/10 Deposition of aluminium only
• CPC Class Codes: C23C 18/1603 coating on selected surface areas
• CPC Class Codes: C23C 18/42 Coating with noble metals
• CPC Class Codes: C23C 22/73 characterised by the process
• CPC Class Codes: H05K 2203/0709 Catalytic ink or adhesive for electroless plating
• CPC Class Codes: H05K 2203/1105 Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
• CPC Class Codes: H05K 3/182 characterised by the patterning method
• CPC Class Codes: Y10T 428/12028 Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
• CPC Class Codes: Y10T 428/12493 Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
• CPC Class Codes: Y10T 428/1275 Next to Group VIII or IB metal-base component
• CPC Class Codes: Y10T 428/24917 including metal layer

Abstract

The present invention is directed to a method for forming a patterned conductive film, which comprises the step of bringing a substrate having a layer made of platinum microcrystal particles formed thereon in a pattern and a complex of an amine compound and an aluminum hydride into contact with each other at a temperature of 50 to 120° C. According to the present invention, there is provided a method for forming a patterned conductive layer, which can ensure electrical bonding with a substrate and also can be suitably applied to various electronic devices, simply without requiring a massive and heavy apparatus.

Claims

1. A patterned conductive film formed by a method comprising:

bringing a substrate and a complex of an amine compound and an aluminum hydride into contact with each other at a temperature of 50 to 120°

C.,

wherein the substrate has a layer made of platinum microcrystal particles formed thereon in a pattern, and

the patterned conductive film is a two-layered film, comprising;

a first layer made of the platinum microcrystal particles, and

a second layer made of aluminum formed on the first layer, and

wherein the first layer is formed by a method comprising;

applying a platinum microcrystal particle dispersion comprising platinum microcrystal particles having a protective colloid and a solvent on the substrate to form a coated film; and

heating the coated film at 300 to 1000°

C. to remove the protective colloid from the platinum microcrystal particles.